Abstract: Feedback responsive input arrangements are presented where arrangements includes: a sensor in mechanical communication with a surface layer, the sensor configured to generate electronic signals in response to applied forces exerted upon the surface layer; a processing module configured to convert electronic signals into user-defined programmatic dimensions; and a tactile feedback response component configured to actuate in response to electronic signals. In some embodiments, user defined programmatic dimensions are selected from the group consisting of: a state dimension, a magnitude dimension, and a temporal dimension. In some embodiments, the processing module is further configured to process user-defined programmatic dimensions into user-defined programmatic actions. In some embodiments, user-defined programmatic actions are coupled to graphical environments, the graphical environments configured to provide a graphic feedback response based on user-defined programmatic actions.

Abstract: Feedback responsive input arrangements are presented where arrangements includes: a sensor in mechanical communication with a surface layer, the sensor configured to generate electronic signals in response to applied forces exerted upon the surface layer; a processing module configured to convert electronic signals into user-defined programmatic dimensions; and a tactile feedback response component configured to actuate in response to electronic signals. In some embodiments, user defined programmatic dimensions are selected from the group consisting of: a state dimension, a magnitude dimension, and a temporal dimension. In some embodiments, the processing module is further configured to process user-defined programmatic dimensions into user-defined programmatic actions. In some embodiments, user-defined programmatic actions are coupled to graphical environments, the graphical environments configured to provide a graphic feedback response based on user-defined programmatic actions.

Abstract: An electronic device housing comprising a device enclosure with electronic components mounted inside the enclosure is disclosed. Mounted between the electronic device housing and the device enclosure is a thermally reflective electrical insulator configured to reduce external heating of the enclosure by the electronic components contained therein. Such an arrangement reflects heat generated by internal electronic components back inside the device enclosure, thereby reducing the external temperature of the electronic device housing. The electronic device housing, for example, pertains to a portable computer. Additionally, a method for reducing the external temperature of a computer housing for a portable computer is disclosed.

Abstract: An electronic device housing comprising a device enclosure with electronic components mounted inside the enclosure is disclosed. Mounted between the electronic device housing and the device enclosure is a thermally reflective electrical insulator configured to reduce external heating of the enclosure by the electronic components contained therein. Such an arrangement reflects heat generated by internal electronic components back inside the device enclosure, thereby reducing the external temperature of the electronic device housing. The electronic device housing, for example, pertains to a portable computer. Additionally, a method for reducing the external temperature of a computer housing for a portable computer is disclosed.