Abstract: An inertial sensor and a method therefor. The inertial sensor includes: a first substrate; a medium layer stacked on the first substrate; a first electric-conductive layer stacked on the medium layer, first openings being formed in the first electric-conductive layer and spaced from one another; second electric-conductive layers being bonded to the first electric-conductive layer through bonding structures, a gap being formed between adjacent second electric-conductive layers, which are connected to each other by a connection part, and second openings being formed in each of the second electric-conductive layers and spaced from one another; and a second substrate covering the first substrate, a closed space being formed between the second substrate and the first substrate. Compared with a traditional single-layer structure, the die size is reduced, the manufacturing cost is reduced, and the integration of device into portable consumer applications is improved, and XY axis sensitivity is improved.

Abstract: An MEMS sensor and a method therefor. The MEMS sensor includes a buried electrode layer; a top electrode layer spaced from the buried electrode layer, a cavity being formed between the buried electrode layer and the top electrode layer; and a device layer received the cavity. The device layer includes movable mass blocks spaced from one another, each of which is supported on the buried electrode layer through a respective anchor portion, a preset gap is formed between each movable mass block and the top electrode layer, and the preset gap formed by one of the movable mass blocks is different from the preset gap formed by another one of the movable mass blocks. This structure allows for greater flexibility in design and provides higher sensitivity and larger actuation force on the sensor, and die size reduction is achieved while achieving more complex designs with higher accuracy and miniaturization.

Abstract: The present invention relates to an accelerometer, which comprises a substrate and detecting devices. The substrate is provided with supporting anchor points and electrode fixing anchor points; the detecting device comprises two detecting plates and corresponding detecting electrodes, and the detecting electrodes are connected to the electrode fixing anchor points through connecting arms; the detecting plate is elastically connected to the supporting anchor point, the two detecting plates are asymmetrically arranged with respect to axes of the supporting anchor points, and the two detecting plates are parallel to each other and in opposite directions; and the detecting electrodes and the detecting plates are arranged at intervals to form a detecting capacitor.

Abstract: The present invention provides a dual-axis gyroscope and an electronic device. The dual-axis gyroscope comprises first mass blocks, second mass blocks, a driving unit and a detecting unit. Tightly coupled connections are formed between adjacent first mass blocks, and between adjacent second mass blocks, thus improving the accuracy of displacement ratios of the first mass blocks and the second mass blocks, and enhancing the operational accuracy and stability of the dual-axis gyroscope. Furthermore, the requirement for the machining precision of the first mass blocks and the second mass blocks is reduced, thus lowering the manufacturing cost of the dual-axis gyroscope and the electronic device.

Abstract: A MEMS device and a method for manufacturing the MEMS device are provided. The MEMS device includes a cap sheet and a device sheet. The device sheet includes a silicon substrate, at least two device structure layers, and at least one conductive structure layer, and each two adjacent device structure layers are coupled via a corresponding conductive structure layer. The device sheet defines a functional cavity having a first region, a second region, and a third region. The at least two device structure layers and the at least one conductive structure layer each are across the first region, the second region, and the third region, and the at least two device structure layers and the at least one conductive structure layer cooperatively form a first movable structure in the first region, define an anchor point in the second region, and form a second movable structure in the third region.

Abstract: An accelerometer includes a substrate. The substrate includes anchor points. An external coupling unit is annular and is parallel to the substrate. A first torsion plate is disposed on an inner side of the external coupling unit and is connected to the anchor points. Inner coupling beams are disposed on a side, close to the anchor points, of the first torsion plate. A second torsion plate is disposed on the inner side of the external coupling unit and is connected to the anchor points, the second torsion plate is connected to the first torsion plate through two of the inner coupling beams, the second torsion plate and the first torsion plate are mutually embedded, the first torsion plate and the second torsion plate are symmetrical about a first axis of symmetry. The accelerometer reduces cross coupling reduced, and accuracy and anti-interference performance of the accelerometer are improved.

Abstract: The present invention provides an MEMS gyroscope and an electronic product. The MEMS gyroscope comprises a plurality of first mass blocks, a second mass block and coupling parts, wherein the plurality of first mass blocks are located at two opposite sides of the second mass block in a first direction; and each coupling part comprises a coupling link and a plurality of connecting beams connected to two ends of the coupling link, the connecting beams are flexible beams, and the coupling part is positioned between the first mass blocks and the second mass block and connects the first mass blocks with the second mass block. Through the arrangement of the coupling links, strong coupling can be realized between the first mass blocks and the second mass block, so that the anti-interference performance of the MEMS gyroscope is enhanced during work and the working stability is improved.