Abstract: This application relates to a chip-to-module cable assembly, includes a first joint, a second joint and a first flexible PCB cable, the flexible PCB cable, including flexible material parts located on upper and lower layers and a connection portion located on a middle layer, wherein the connection portion comprises two rigid material portions respectively located at end portions of the flexible material parts on the upper and lower layers and a hollow portion between the two rigid material portions, the flexible material parts each comprises at least one conducting wire, one end of each of the at least one conducting wire is connected to a first interface terminal of the first joint, and another end of the conducting wire is connected to a second interface terminal of a second joint.

Abstract: One embodiment of the invention, is a heating system, including a heat source for heating a medium, a circulation system for circulating heated medium; a control system for controlling the temperature to which the medium is heated in accordance with a temperature set point. An energy monitor generates a measure of energy consumed by the system, which is arranged for a predetermined period to set a fixed temperature set point. For a subsequent period the temperature set point is set dependent on the energy used in the predetermined period.