Patents by Inventor Zaizhong XIA

Zaizhong XIA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11604035
    Abstract: Embodiments of the present invention relate to a heat dissipation apparatus and relates to the field of heat dissipation technologies, so as to solve a problem that heat dissipation efficiency of heat dissipation fins of an existing heat dissipation apparatus is low. In embodiments of the present invention, the heat dissipation apparatus includes a base plate, where multiple main fins are disposed on the base plate, and multiple auxiliary fins are disposed on the main fins; a gap exists between the auxiliary fins and the base plate; and a blocking structure is disposed and fastened on the base plate and/or the main fins, and the blocking structure can make cooling airflow first flow along the auxiliary fins and then flow along gaps between adjacent main fins and flow out. The present invention is mainly used in the field of communication accessories.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: March 14, 2023
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Zaizhong Xia, Yun Tang, Wen Fang
  • Patent number: 10627172
    Abstract: A heat dissipation apparatus, including a base plate, a guide fin group, and a heat dissipation fin group, where the guide fin group is formed on a surface of the base plate, the guide fin group is disposed with at least two guide fins that are disposed at an interval, and the at least two guide fins extend along a surface of the base plate from an edge of the base plate, and a flow path for flowing of an airflow is formed between two adjacent guide fins, and the heat dissipation fin group includes at least one heat dissipation fin, where the at least one heat dissipation fin is fixedly connected to the top of the at least two guide fins to dissipate heat of the at least two guide fins. The heat dissipation apparatus further includes, guide fins and a stopper fin.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: April 21, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Zaizhong Xia, Shuainan Lin, Yuening Li
  • Publication number: 20170314877
    Abstract: A heat dissipation apparatus, including a base plate, a guide fin group, and a heat dissipation fin group, where the guide fin group is formed on a surface of the base plate, the guide fin group is disposed with at least two guide fins that are disposed at an interval, and the at least two guide fins extend along a surface of the base plate from an edge of the base plate, and a flow path for flowing of an airflow is formed between two adjacent guide fins, and the heat dissipation fin group includes at least one heat dissipation fin, where the at least one heat dissipation fin is fixedly connected to the top of the at least two guide fins to dissipate heat of the at least two guide fins. The heat dissipation apparatus further includes, guide fins and a stopper fin.
    Type: Application
    Filed: July 17, 2017
    Publication date: November 2, 2017
    Inventors: Zaizhong Xia, Shuainan Lin, Yuening Li
  • Patent number: 9528774
    Abstract: A heat dissipation apparatus including multiple heat exchange sheets. A first path and a second path are formed between the multiple heat exchange sheets, and the first path includes a first countercurrent channel, a guide channel, and a first-outlet cross-flow channel; the second path includes a second countercurrent channel and a second-inlet cross-flow channel. One part of a first fluid that enters the first path enters the first countercurrent channel and mainly performs countercurrent heat exchange with a second fluid that is in the second countercurrent channel, and the other part passes the guide channel and rapidly performs cross-flow heat exchange.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: December 27, 2016
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Zaizhong Xia, Wen Fang, Yun Tang
  • Publication number: 20150305195
    Abstract: Embodiments of the present invention provide a heat dissipation apparatus. The heat dissipation apparatus includes multiple heat exchange sheets, a first path and a second path are formed between the multiple heat exchange sheets, and the first path includes a first countercurrent channel, a guide channel, and a first-outlet cross-flow channel; the second path includes a second countercurrent channel and a second-inlet cross-flow channel. One part of a first fluid that enters the first path enters the first countercurrent channel and mainly performs countercurrent heat exchange with a second fluid that is in the second countercurrent channel, and the other part passes the guide channel and rapidly performs cross-flow heat exchange, so that heat exchange efficiency can be improved.
    Type: Application
    Filed: April 22, 2015
    Publication date: October 22, 2015
    Inventors: Zaizhong XIA, Wen FANG, Yun TANG
  • Publication number: 20150090435
    Abstract: Embodiments of the present invention relate to a heat dissipation apparatus and relates to the field of heat dissipation technologies, so as to solve a problem that heat dissipation efficiency of heat dissipation fins of an existing heat dissipation apparatus is low. In embodiments of the present invention, the heat dissipation apparatus includes a base plate, where multiple main fins are disposed on the base plate, and multiple auxiliary fins are disposed on the main fins; a gap exists between the auxiliary fins and the base plate; and a blocking structure is disposed and fastened on the base plate and/or the main fins, and the blocking structure can make cooling airflow first flow along the auxiliary fins and then flow along gaps between adjacent main fins and flow out. The present invention is mainly used in the field of communication accessories.
    Type: Application
    Filed: October 28, 2014
    Publication date: April 2, 2015
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Zaizhong XIA, Yun TANG, Wen FANG