Abstract: Methods for adhesive bonding are disclosed. The methods includes contacting a substrate with an activator composition which includes a reactive solvent, such as methyl ethyl ketone or acrylic-based monomers, and a reducing agent, such that the treated substrate has a working time of greater than about four weeks, and contacting the substrate with adhesive compositions to result in adhesive bonding.

Abstract: An infiltrant system for rapid prototyping processes. The infiltrant system generally includes a resin component and a hardener component. The resin component typically includes an epoxy resin, and a diluent. The hardener component typically includes an amine, optionally an amide, and optionally a catalyst. High strength infiltrant systems, flexible infiltrant systems, and a method for infiltrating a part are also described.