Patents by Inventor Zakaria Abdullah

Zakaria Abdullah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adjustable pick-up head and method for manufacturing a device
    Patent number: 9196521
    Abstract: An adjustable pick-up head, a collet head, a method to adjust a pick-up head and a method of manufacturing a device are disclosed. In one embodiment a pick-up head includes a shank having a holder and an intermediate body connected to the holder by a first joint. The pick-up head further includes a collet head connected to the intermediate body by a second joint.
    Type: Grant
    Filed: November 5, 2012
    Date of Patent: November 24, 2015
    Assignee: Infineon Technologies AG
    Inventors: Abdul Rahman Mohamed, Subaramaniym Senivasan, Zakaria Abdullah, Ralf Otremba
  • Adjustable Pick-up Head and Method for Manufacturing a Device
    Publication number: 20140123454
    Abstract: An adjustable pick-up head, a collet head, a method to adjust a pick-up head and a method of manufacturing a device are disclosed. In one embodiment a pick-up head includes a shank having a holder and an intermediate body connected to the holder by a first joint. The pick-up head further includes a collet head connected to the intermediate body by a second joint.
    Type: Application
    Filed: November 5, 2012
    Publication date: May 8, 2014
    Applicant: Infineon Technologies AG
    Inventors: Abdul Rahman Mohamed, Subaramaniym Senivasan, Zakaria Abdullah, Ralf Otremba
  • Semiconductor package with ribbon with metal layers
    Patent number: 8022558
    Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip and a ribbon. The ribbon includes a first metal layer and a second metal layer. The first metal layer is welded to the first chip and the second metal layer is attached to the second chip.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: September 20, 2011
    Assignee: Infineon Technologies AG
    Inventors: Chee Soon Law, Fong Lim, Zakaria Abdullah