Abstract: Systems and techniques of monitoring, assessing and determining the quality of software components and/or their associated features that may be designed and built to be run on a plurality of hardware devices. Such hardware devices may be devices made by different manufacturers. In addition, certain of these manufacturers may be device partners with the software maker. Software product and/or components may be subjected to test runs on various hardware devices and the results may be correlated. This pass/fail data may also be correlated against a number of additional factors—e.g., the market share of device products for which a software product has a minimum level of acceptable or passing rates.

Abstract: A photovoltaic structure having a reduced mismatch, and a system, method and computer program for reducing mismatch in a photovoltaic structure are provided. The photovoltaic structure has a plurality of photovoltaic elements arranged in a plurality of rows and a plurality of columns. The photovoltaic elements are electrically connected to one another in a plurality of parallel circuits connected together. At least two of the photovoltaic elements from one of the rows are connected in different parallel circuits to reduce partial shading loss for a plurality of time instants. The system, method and computer program provide a connection matrix for the photovoltaic structure based on irradiance levels for the photovoltaic elements to enable connection of the photovoltaic elements to one another to reduce partial shading loss for a plurality of time instants.

Abstract: A photovoltaic structure is provided. The photovoltaic structure has photovoltaic elements that can be electrically connected to one another to reduce mismatch. The photovoltaic elements can be electrically connected based on sorting the photovoltaic elements by irradiance level, minimizing mismatch, or maximizing output power. Where sorting is used, the photovoltaic elements can be connected in a serpentine arrangement.

Abstract: A heating chuck assembly for wafer processing is provided, including heating modalities for same. The assembly generally includes hermetically sealed opposingly paired discs, and housed therebetween, a ceramic element interposed between first and second heating elements. The first heating element is adjacent a first disc of the opposingly paired discs so as to be paired therewith, the second heating element adjacent a second disc of the opposingly paired discs so as to be paired therewith. The assembly further contemplates the inclusion of temperature sensing/measuring and controlling devices, in the context of a heating chuck system.