Abstract: Rapid curing of polymer layers on semiconductor substrates is facilitated using variable frequency microwave energy. A semiconductor substrate having a polymer layer thereon is placed in a microwave furnace cavity, and then swept with a range of microwave frequencies. The range of frequencies includes a central frequency selected to rapidly heat the polymer layer. The range of frequencies is selected to generate a plurality of modes within the cavity. The sweep rate is selected so as to avoid damage to the semiconductor substrate and/or any components thereon. The microwave power may be adjusted during frequency sweeping to control the temperature of the polymer layer and the semiconductor substrate. Effluent produced during the curing of the polymer layer may be removed from the furnace cavity.

Abstract: Systems and methods for monitoring workpiece and workpiece material characteristics using microwave energy are disclosed. A system includes a chamber, including means for generating variable frequency microwave energy; means for positioning a workpiece within the chamber; means for subjecting the workpiece to a plurality of different microwave frequencies; and means for monitoring characteristics of the workpiece. One or more characteristics of a workpiece, or workpiece material, may be monitored by positioning the workpiece within a chamber having means for generating variable frequency microwave energy; subjecting the workpiece to microwave irradiation at a plurality of frequencies; detecting power reflection for each one of the plurality of microwave frequencies to provide power reflection data; and comparing the power reflection data to a predetermined set of power reflection data.

Abstract: The present invention provides a process for assembling electronics which allows for rapid heating and fast curing, and avoids subjecting the components to potentially damaging cure conditions. The process includes applying conductive or non-conductive curable thermoplastic or thermosetting resins, having adhesive properties, to a surface of the substrate or electrical component or both. One or more electrical components may be mounted on the substrate using the adhesive properties of the resin. The resin is then subjected to variable frequency microwave irradiation selected to cure the resin without adversely affecting the substrate or electrical components.