Patents by Inventor Zane Drussel

Zane Drussel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board singulation methods
    Patent number: 6886247
    Abstract: Methods to singulate circuit forming regions of a circuit board substrate assembly includes providing a plurality of circuit forming regions including at least one pair of adjacent circuit forming regions separated by at least one opening defined in substrate material between each pair of adjacent circuit forming regions. At least a portion of interconnection regions along singulation axes are removed to singulate the circuit forming regions.
    Type: Grant
    Filed: December 2, 2003
    Date of Patent: May 3, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Zane Drussel, Derek Hinkle
  • Singulation methods and substrates for use with same
    Publication number: 20040107570
    Abstract: A circuit board substrate assembly includes a generally planar circuit board substrate material having a longitudinal axis extending along a length of the substrate material between a first end and a second end thereof. The circuit board substrate material further has a first edge and a second edge extending along the length of the circuit board substrate material between the first end and the second end. A plurality of openings are defined in the substrate material. Each opening extends between a first distance from the first edge of the circuit board substrate and a second distance from the second edge of the circuit board substrate. Further, each opening separates adjacent circuit forming regions lying along the longitudinal axis and has first and second opposing end portions.
    Type: Application
    Filed: December 2, 2003
    Publication date: June 10, 2004
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Zane Drussel, Derek Hinkle
  • Use of a reference fiducial on a semiconductor package to monitor and control a singulation method
    Patent number: 6744134
    Abstract: A semiconductor package singulation process is disclosed. The process comprises the step of using at least a portion of a reference fiducial formed on at least one package in a semiconductor package panel comprising a plurality of interconnected packages, the fiducial used to monitor and to control the semiconductor package singulation process.
    Type: Grant
    Filed: January 4, 2002
    Date of Patent: June 1, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Jay Roberts, Gregory M. Chapman, John VanNortwick, Zane Drussel
  • Singulation methods and substrates for use with same
    Patent number: 6664480
    Abstract: A circuit board substrate assembly includes a generally planar circuit board substrate material having a longitudinal axis extending along a length of the substrate material between a first end and a second end thereof. The circuit board substrate material further has a first edge and a second edge extending along the length of the circuit board substrate material between the first end and the second end. A plurality of openings are defined in the substrate material. Each opening extends between a first distance from the first edge of the circuit board substrate and a second distance from the second edge of the circuit board substrate. Further, each opening separates adjacent circuit forming regions lying along the longitudinal axis and has first and second opposing end portions.
    Type: Grant
    Filed: May 25, 2001
    Date of Patent: December 16, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Zane Drussel, Derek Hinkle
  • Use of a reference fiducial on a semiconductor package to monitor and control a singulation method
    Patent number: 6638831
    Abstract: A semiconductor package singulation process is disclosed. The process comprises the step of using at least a portion of a reference fiducial formed on at least one package in a semiconductor package panel comprising a plurality of interconnected packages, the fiducial used to monitor and to control the semiconductor package singulation process.
    Type: Grant
    Filed: August 31, 2000
    Date of Patent: October 28, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Jay Roberts, Gregory M. Chapman, John VanNortwick, Zane Drussel
  • Use of a reference fiducial on a semiconductor package to monitor and control a singulation method
    Publication number: 20020058396
    Abstract: A semiconductor package singulation process is disclosed. The process comprises the step of using at least a portion of a reference fiducial formed on at least one package in a semiconductor package panel comprising a plurality of interconnected packages, the fiducial used to monitor and to control the semiconductor package singulation process.
    Type: Application
    Filed: January 4, 2002
    Publication date: May 16, 2002
    Inventors: Jay Roberts, Gregory M. Chapman, John VanNortwick, Zane Drussel
  • Singulation methods and substrates for use with same
    Publication number: 20020023774
    Abstract: A circuit board substrate assembly includes a generally planar circuit board substrate material having a longitudinal axis extending along a length of the substrate material between a first end and a second end thereof. The circuit board substrate material further has a first edge and a second edge extending along the length of the circuit board substrate material between the first end and the second end. A plurality of openings are defined in the substrate material. Each opening extends between a first distance from the first edge of the circuit board substrate and a second distance from the second edge of the circuit board substrate. Further, each opening separates adjacent circuit forming regions lying along the longitudinal axis and has first and second opposing end portions.
    Type: Application
    Filed: May 25, 2001
    Publication date: February 28, 2002
    Inventors: Zane Drussel, Derek Hinkle
  • Singulation methods and substrates for use with same
    Patent number: 6239380
    Abstract: A circuit board substrate assembly includes a generally planar circuit board substrate material having a longitudinal axis extending along a length of the substrate material between a first end and a second end thereof. The circuit board substrate material further has a first edge and a second edge extending along the length of the circuit board substrate material between the first end and the second end. A plurality of openings are defined in the substrate material. Each opening extends between a first distance from the first edge of the circuit board substrate and a second distance from the second edge of the circuit board substrate. Further, each opening separates adjacent circuit forming regions lying along the longitudinal axis and has first and second opposing end portions.
    Type: Grant
    Filed: August 24, 1999
    Date of Patent: May 29, 2001
    Assignee: Micron Technology, Inc.
    Inventors: Zane Drussel, Derek Hinkle
  • Singulation methods
    Patent number: 6047470
    Abstract: A circuit board substrate assembly includes a generally planar circuit board substrate material having a longitudinal axis extending along a length of the substrate material between a first end and a second end thereof. The circuit board substrate material further has a first edge and a second edge extending along the length of the circuit board substrate material between the first end and the second end. A plurality of openings are defined in the substrate material. Each opening extends between a first distance from the first edge of the circuit board substrate and a second distance from the second edge of the circuit board substrate. Further, each opening separates adjacent circuit forming regions lying along the longitudinal axis and has first and second opposing end portions.
    Type: Grant
    Filed: August 20, 1997
    Date of Patent: April 11, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Zane Drussel, Derek Hinkle