Patents by Inventor Zang Kyu Lim

Zang Kyu Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8178374
    Abstract: A thin film patterning method comprising: depositing a first thin film and applying a photoresist layer on the first thin film; exposing and developing the photoresist layer to define first, second and third regions, wherein the photoresist layer in the first region is thicker than that in the second region, and no photoresist layer is left in the third region; over-etching to remove the first thin film in the third region and form an over-etched region in the peripheral region of the first region; removing a part of the photoresist layer to expose the first thin film in the second region; depositing a second thin film so that the first thin film contacts the second thin film in the second region; and lifting off the photoresist layer to remove the second thin film in the first region and exposing the substrate in the over-etched region of the first region.
    Type: Grant
    Filed: October 1, 2009
    Date of Patent: May 15, 2012
    Assignee: Beijing Boe Optoelectronics Technology Co., Ltd.
    Inventors: Tae Yup Min, Zang Kyu Lim, Sung Hun Song, Xuesong Gao
  • Publication number: 20100093122
    Abstract: A thin film patterning method comprising: depositing a first thin film and applying a photoresist layer on the first thin film; exposing and developing the photoresist layer to define first, second and third regions, wherein the photoresist layer in the first region is thicker than that in the second region, and no photoresist layer is left in the third region; over-etching to remove the first thin film in the third region and form an over-etched region in the peripheral region of the first region; removing a part of the photoresist layer to expose the first thin film in the second region; depositing a second thin film so that the first thin film contacts the second thin film in the second region; and lifting off the photoresist layer to remove the second thin film in the first region and exposing the substrate in the over-etched region of the first region.
    Type: Application
    Filed: October 1, 2009
    Publication date: April 15, 2010
    Inventors: Tae Yup MIN, Zang Kyu LIM, Sung Hun SONG, Xuesong GAO