Patents by Inventor Zatoon Begum

Zatoon Begum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Combined adhesion promotion and direct metallization process
    Patent number: 6790334
    Abstract: A combined adhesion promotion method of a metal to a non-conductive substrate and directly metallizing the non-conductive substrate with the metal. The method involves texturing a non-conductive substrate with a cobalt etch followed by applying a sulfide to the textured non-conductive substrate to provide an electrically conductive surface on the non-conductive substrate. After the surface of the non-conductive substrate has been made electrically conductive, the surface of the non-conductive substrate can be directly metallized. The method reduces the number of process steps for direct metallization of a non-conductive substrate. Thus, the method is more efficient in contrast to conventional methods of metallizing a non-conductive substrate.
    Type: Grant
    Filed: August 2, 2002
    Date of Patent: September 14, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Zatoon Begum, Martin T. Goosey, John E. Graves, Mark A. Poole, Amrik Singh
  • Combined adhesion promotion and direct metallization process
    Publication number: 20030047458
    Abstract: A combined adhesion promotion method of a metal to a non-conductive substrate and directly metallizing the non-conductive substrate with the metal. The method involves texturing a non-conductive substrate with a cobalt etch followed by applying a sulfide to the textured non-conductive substrate to provide an electrically conductive surface on the non-conductive substrate. After the surface of the non-conductive substrate has been made electrically conductive, the surface of the non-conductive substrate can be directly metallized. The method reduces the number of process steps for direct metallization of a non-conductive substrate. Thus, the method is more efficient in contrast to conventional methods of metallizing a non-conductive substrate.
    Type: Application
    Filed: August 2, 2002
    Publication date: March 13, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Zatoon Begum, Martin T. Goosey, John E. Graves, Mark A. Poole, Amrik Singh