Patents by Inventor Zbigniew A. Szczepaniak

Zbigniew A. Szczepaniak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners
    Patent number: 6632893
    Abstract: The present invention provides a toughened thermosetting resin composition useful as an underfilling sealant composition which fills the underfill space in a semiconductor device, and includes a semiconductor chip mounted on a carrier substrate, enabling the semiconductor device to be securely connected to a circuit board by short-time heat curing. The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component, a latent hardener component, and a polysulfide-based toughening component. The latent hardener component includes a cyanate ester component and an imidazole component.
    Type: Grant
    Filed: November 19, 2001
    Date of Patent: October 14, 2003
    Assignee: Henkel Loctite Corporation
    Inventors: Mark M. Konarski, Zbigniew A. Szczepaniak
  • Toughened thermosetting resin compositions useful as underfill sealants
    Publication number: 20020058778
    Abstract: The present invention provides a toughened thermosetting resin composition useful as an underfilling sealant composition which rapidly fills the underfill space in a semiconductor device, which includes a semiconductor chip mounted on a carrier substrate, enables the semiconductor device to be securely connected to a circuit board by short-time heat curing and with good productivity, and demonstrates acceptable heat shock properties (or thermal cycle properties). The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component, a latent hardener component, and a polysulfide-based toughening component. The latent hardener component includes a cyanate ester component and an imidazole component.
    Type: Application
    Filed: November 19, 2001
    Publication date: May 16, 2002
    Applicant: LOCTITE CORPORATION
    Inventors: Mark M. Konarski, Zbigniew A. Szczepaniak
  • Thermosetting resin compositions useful as underfill sealants
    Patent number: 6342577
    Abstract: The present invention provides a thermosetting resin composition useful as an underfilling sealant composition which rapidly fills the underfill space in a semiconductor device, such as a flip chip assembly which includes a semiconductor chip mounted on a carrier substrate, enables the semi-conductor to be securely connected to a circuit board by short-time heat curing and with good productivity, and demonstrates acceptable heat shock properties (or thermal cycle properties). The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component and a latent hardener component. The latent hardener component includes a cyanate ester component and an imidizole component.
    Type: Grant
    Filed: May 28, 1999
    Date of Patent: January 29, 2002
    Assignee: Loctite Corporation
    Inventors: Mark M. Konarski, Zbigniew A. Szczepaniak