Patents by Inventor Ze-Cheng Hou

Ze-Cheng Hou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11225044
    Abstract: A method for forming a porous copper composite is provided. At least two carbon nanostructure reinforced copper composite substrates are provided. The at least two carbon nanostructure reinforced copper composite substrates are stacked to form a composite substrate. An active metal layer is disposed on a surface of the composite substrate to form a first a composite structure. The first composite structure is pressed to form a second composite structure. The second composite structure is annealed to form a third composite structure. The third composite structure is de-alloyed to form a porous copper composite.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: January 18, 2022
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yuan-Feng Liu, Ze-Cheng Hou, Lu Chen, Lin Zhu, Wen-Zhen Li
  • Patent number: 11196035
    Abstract: An anode of the lithium ion battery is provided. The anode of the lithium ion battery comprises a nanoporous copper substrate and a copper oxide nanosheet array. The copper oxide nanosheet array is disposed on one surface of the nanoporous copper substrate, and the nanoporous copper substrate is chemically bonded to the copper oxide nanosheet array.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: December 7, 2021
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yuan-Feng Liu, Ze-Cheng Hou, Lu Chen, Lin Zhu, Wen-Zhen Li
  • Patent number: 11158843
    Abstract: A method for making nanoporous nickel composite material comprises: providing a cathode plate and a copper-containing anode plate, electroplating a copper material layer a surface of the cathode plate; laying a carbon nanotube layer on the copper material layer, and forming an overlapped structure of the copper material layer and the carbon nanotube laye; the cathode plate and the overlapped structure are used as a cathode, and a nickel-containing anode plate is used as an anode, plating a nickel material layer on the overlapped structure to form sandwich structure; repeating steps S1 to S3 to obtain a carbon nanotube-reinforced copper-nickel alloy; rolling and annealing the carbon nanotube-reinforced copper-nickel alloy; and etching the carbon nanotube-reinforced copper-nickel alloy to form the nanoporous nickel composite material.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: October 26, 2021
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Ze-Cheng Hou, Yuan-Feng Liu, Lin Zhu, Wen-Zhen Li
  • Publication number: 20210146656
    Abstract: An aluminum matrix composite is provided. The aluminum matrix composite comprises at least one reinforcement layer and an aluminum layer. The at least one reinforcement layer comprises a plurality of reinforcement sheets.
    Type: Application
    Filed: January 27, 2021
    Publication date: May 20, 2021
    Inventors: YUAN-FENG LIU, Ze-Cheng Hou, LU CHEN, LIN ZHU, WEN-ZHEN LI
  • Patent number: 10940672
    Abstract: A method for forming an aluminum matrix composite is provided. At least one reinforcement layer and an aluminum layer are provided. The at least one reinforcement layer is disposed on at least one surface of the aluminum layer to form a first composite structure. The first composite structure is pressed to form a second composite structure. A process of alternatively folding and pressing the second composite structure is repeated to form the aluminum matrix composite.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: March 9, 2021
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yuan-Feng Liu, Ze-Cheng Hou, Lu Chen, Lin Zhu, Wen-Zhen Li
  • Patent number: 10844508
    Abstract: A method of making a nanoporous copper is provided. A copper alloy layer and at least one active metal layer are provided. The copper alloy layer comprises a first surface and a second surface. The at least one active metal layer is located on the first surface and the second surface to form a structure. The structure is processed to form a composite structure. A process of folding and pressing the composite structure is repeated to form a precursor. The precursor is corroded to form the nanoporous copper.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: November 24, 2020
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yue-Feng Meng, Lun-Qiao Xiong, Yuan-Feng Liu, Ze-Cheng Hou, Hong-Ying Fu, Lin Zhu, Wen-Zhen Li
  • Publication number: 20200321602
    Abstract: A method for making nanoporous nickel composite material comprises: providing a cathode plate and a copper-containing anode plate, electroplating a copper material layer a surface of the cathode plate; laying a carbon nanotube layer on the copper material layer, and forming an overlapped structure of the copper material layer and the carbon nanotube laye; the cathode plate and the overlapped structure are used as a cathode, and a nickel-containing anode plate is used as an anode, plating a nickel material layer on the overlapped structure to form sandwich structure; repeating steps S1 to S3 to obtain a carbon nanotube-reinforced copper-nickel alloy; rolling and annealing the carbon nanotube-reinforced copper-nickel alloy; and etching the carbon nanotube-reinforced copper-nickel alloy to form the nanoporous nickel composite material.
    Type: Application
    Filed: April 26, 2019
    Publication date: October 8, 2020
    Inventors: Ze-Cheng Hou, YUAN-FENG LIU, LIN ZHU, WEN-ZHEN LI
  • Publication number: 20200276784
    Abstract: A method for forming a porous copper composite is provided. At least two carbon nanostructure reinforced copper composite substrates are provided. The at least two carbon nanostructure reinforced copper composite substrates are stacked to form a composite substrate. An active metal layer is disposed on a surface of the composite substrate to form a first a composite structure. The first composite structure is pressed to form a second composite structure. The second composite structure is annealed to form a third composite structure. The third composite structure is de-alloyed to form a porous copper composite.
    Type: Application
    Filed: April 23, 2019
    Publication date: September 3, 2020
    Applicants: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YUAN-FENG LIU, Ze-Cheng Hou, LU CHEN, LIN ZHU, WEN-ZHEN LI
  • Publication number: 20200280049
    Abstract: A method for forming a current collector is provided. At least two carbon nanostructure reinforced copper composite substrates are provided. The at least two carbon nanostructure reinforced copper composite substrates are stacked to form a composite substrate. An active metal layer is disposed on a surface of the composite substrate to form a first a composite structure. The first composite structure is pressed to form a second composite structure. The second composite structure is annealed to form a third composite structure. The third composite structure is de-alloyed to form a porous copper composite.
    Type: Application
    Filed: April 23, 2019
    Publication date: September 3, 2020
    Inventors: YUAN-FENG LIU, Ze-Cheng Hou, LU CHEN, LIN ZHU, WEN-ZHEN LI
  • Publication number: 20200164620
    Abstract: A method for forming an aluminum matrix composite is provided. At least one reinforcement layer and an aluminum layer are provided. The at least one reinforcement layer is disposed on at least one surface of the aluminum layer to form a first composite structure. The first composite structure is pressed to form a second composite structure. A process of alternatively folding and pressing the second composite structure is repeated to form the aluminum matrix composite.
    Type: Application
    Filed: February 27, 2019
    Publication date: May 28, 2020
    Inventors: YUAN-FENG LIU, Ze-Cheng Hou, LU CHEN, LIN ZHU, WEN-ZHEN LI
  • Publication number: 20200102227
    Abstract: A nanoporous copper supported copper oxide nanosheet array composite is provided. The nanoporous copper supported copper oxide nanosheet array composite comprises a nanoporous copper substrate and a copper oxide nanosheet array. The copper oxide nanosheet array is disposed on one surface of the nanoporous copper substrate, and the nanoporous copper substrate is chemically bonded to the copper oxide nanosheet array.
    Type: Application
    Filed: February 15, 2019
    Publication date: April 2, 2020
    Inventors: YUAN-FENG LIU, ZE-CHENG HOU, LU CHEN, LIN ZHU, WEN-ZHEN LI
  • Publication number: 20200106085
    Abstract: An anode of the lithium ion battery is provided. The anode of the lithium ion battery comprises a nanoporous copper substrate and a copper oxide nanosheet array. The copper oxide nanosheet array is disposed on one surface of the nanoporous copper substrate, and the nanoporous copper substrate is chemically bonded to the copper oxide nanosheet array.
    Type: Application
    Filed: February 15, 2019
    Publication date: April 2, 2020
    Inventors: YUAN-FENG LIU, ZE-CHENG HOU, LU CHEN, LIN ZHU, WEN-ZHEN LI
  • Publication number: 20190203376
    Abstract: A method of making a nanoporous copper is provided. A copper alloy layer and at least one active metal layer are provided. The copper alloy layer comprises a first surface and a second surface. The at least one active metal layer is located on the first surface and the second surface to form a structure. The structure is processed to form a composite structure. A process of folding and pressing the composite structure is repeated to form a precursor. The precursor is corroded to form the nanoporous copper.
    Type: Application
    Filed: September 21, 2018
    Publication date: July 4, 2019
    Inventors: Yue-Feng Meng, LUN-QIAO XIONG, Yuan-Feng Liu, Ze-Cheng Hou, HONG-YING FU, LIN ZHU, WEN-ZHEN LI