Abstract: Disclosed are a pixel circuit and a method for driving the pixel circuit. The pixel circuit includes a driving transistor, a first transistor, a second transistor, a third transistor, a driving capacitor and a light-emitting element.

Abstract: A method for manufacturing an array substrate is provided. The method includes the following. A signal transmission line and a gate electrode are formed on an underlayment, and are separated with a gap therebetween. A gate insulation layer and an active layer are formed on the signal transmission line and the gate electrode. An organic insulation layer is formed on the gate insulation layer and the active layer. The organic insulation layer is patterned to form a penetration hole corresponding to the signal transmission line. Then the gate insulation layer is etched to expose the signal transmission line by using the patterned organic insulation layer as a mask. A first conductive layer is formed on the penetration hole to be electrically connected with the signal transmission line.

Abstract: Disclosed are a pixel circuit and a method for driving the pixel circuit. The pixel circuit includes a driving transistor, a first transistor, a second transistor, a third transistor, a driving capacitor and a light-emitting element.

Abstract: This application discloses a method of forming a flexible substrate using a detachment apparatus. The flexible substrate includes a debonding region, and one or more edge regions located in proximity to one or more edges of the flexible substrate. The detachment apparatus detaches the one or more edge regions of the flexible substrate from a rigid carrier that is configured to support the flexible substrate device, and detach the debonding region of the flexible substrate from the rigid carrier to which a bottom surface of the debonding region is configured to adhere. Specifically, the detachment apparatus detaches the debonding region by contacting the top surface of the flexible substrate at a plurality of suction locations located on the debonding region of the flexible substrate, and applying detachment force at the plurality of suction locations to peel the flexible substrate off the rigid carrier.

Abstract: This application discloses a flexible substrate device that includes a flexible substrate and a plurality of electronic devices. The flexible substrate includes a top surface and a bottom surface opposite to the top surface, and the plurality of electronic devices formed on the top surface of the flexible substrate. The bottom surface further includes one or more strong adhesion regions and one or more normal adhesion regions that are distinct from the one or more strong adhesion regions. Each of the one or more strong adhesion regions and the one or more normal adhesion regions are configured to attach to a rigid carrier with first adhesion strength and second adhesion strength, respectively. The first adhesion strength is substantially larger than the second adhesion strength. In some embodiments, the flexible substrate device is a thin film transistor (TFT) device, and the plurality of electronic devices includes a TFT array.

Abstract: An electronic expansion valve is provided, wherein a piston component and a valve needle component are located at the same side of a valve core seat. When refrigerant flows forwards, the piston component closes the bypass through hole, the refrigerant flows to a side of the vertical connecting pipe via the valve core valve port, and the valve needle component moves in the axial direction to regulate an opening of the valve core valve port. When the refrigerant flows reversely, the piston component moves upwards in the axial direction to open the bypass through hole, and the refrigerant flows to a side of the transverse connecting pipe via the bypass through hole. The electronic expansion valve ensures that the valve needle component seals the valve core valve port easily in a high pressure state when the refrigerant flows forwards, and reduces axial and radial dimensions of the valve seat.

Abstract: A thin film transistor (TFT) device is provided. The TFT device includes a first conductive layer including a gate electrode and a connection pad. The TFT device further includes a first dielectric layer covering the gate electrode, and a semiconductor layer disposed on the dielectric layer and overlapping the gate electrode. The TFT device further includes a second dielectric layer disposed on the semiconductor layer and the first dielectric layer so as to expose first and second portions of the semiconductor layer and the connection pad. The TFT device further includes a second conductive layer which includes a source electrode portion covering the first portion of the semiconductor layer; a pixel electrode portion extending to the source electrode portion; a drain electrode portion covering the second portion of the semiconductor layer; and an interconnection portion disposed on the connection pad and extending to the drain electrode portion.

Abstract: A thermal expansion valve with one-way control function includes a valve body having an inlet passage and an out passage, a temperature sensor installed on one end of the valve body, and a first valve core component installed in an inside chamber of the valve body. The first valve core component includes a first valve core and a valve rod against the temperature sensor. The valve body also includes an accommodation component extending from said the inlet passage into the valve body and coaxially installed with the inlet passage. The accommodation component has a second valve port connected with the inside chamber. The accommodation component has a second valve core component having a supporting piece and a second valve core matching the second valve port. The processing of the structure is convenient and the assembly of the second valve core component is simple and reliable.

Abstract: A substrate-less display device is disclosed. The substrate-less display device includes a barrier stack. The barrier stack includes a plurality of inorganic barrier films and a plurality of polymer films. The inorganic barrier films and the polymer films are alternatively disposed. The substrate-less display device further includes a thin-film-transistor (TFT) device layer disposed on the barrier stack, a display medium layer disposed on the TFT device layer, and an encapsulation layer disposed on the display medium layer.

Abstract: An electronic expansion valve comprising a screw rod and a motor provided with an output shaft. The output shaft is transmissively connected to the screw rod via a gear system. The gear system is supported on a gear base. The screw rod passes through the gear base. The electronic expansion valve also comprises a valve base provided with valve cavity and a motor housing arranged on the exterior of the motor. The gear base is further arranged within the valve cavity. The upper end part of the valve base is further connected to the lower end part of the motor housing. The structural design of the electronic expansion valve reduces the number of sealed parts for same, thus effectively lowering the probability of leakage and simplifying the assembly structure thereof.

Abstract: An electronic expansion valve is provided, a sleeve is fixed in a main valve cavity of the electronic expansion valve, and a valve core seat is axially movably provided in the sleeve; a circumferential side wall of the sleeve is provided with a sleeve flow passage, and a circumferential side wall of the valve core seat is provided with a valve core seat side hole; and when the refrigerant flows forward, the valve core seat closes the main valve port to disconnect a communication between the sleeve flow passage and the valve core seat side hole, and the refrigerant flows to the valve core valve port through the sleeve flow passage; and when the refrigerant flows reversely, the valve core seat moves upward to open the main valve port to communicate the valve core seat side hole with the sleeve flow passage.

Abstract: An electronic expansion valve is provided, which includes a main valve cavity. A sleeve is fixed in the main valve cavity. A lower end part of the sleeve is supported by a valve seat, and the lower end part of the sleeve surrounds a main valve port. A valve core seat is axially movably arranged in the sleeve. A lower part of the valve needle component extends into the sleeve to open and close the valve core valve port. A circumferential side wall of the sleeve is provided with a first communicating hole close to the main valve port and a second communicating hole away from the main valve port. The structural design of the electronic expansion valve may prevent an excessive impact on a valve core seat caused by the refrigerant with high pressure when the refrigerant flows forward, thereby preventing the eccentricity of the valve core seat.

Abstract: A thin film transistor (TFT) device is provided. The TFT device includes a first conductive layer including a gate electrode and a connection pad. The TFT device further includes a first dielectric layer covering the gate electrode, and a semiconductor layer disposed on the dielectric layer and overlapping the gate electrode. The TFT device further includes a second dielectric layer disposed on the semiconductor layer and the first dielectric layer so as to expose first and second portions of the semiconductor layer and the connection pad. The TFT device further includes a second conductive layer which includes a source electrode portion covering the first portion of the semiconductor layer; a pixel electrode portion extending to the source electrode portion; a drain electrode portion covering the second portion of the semiconductor layer; and an interconnection portion disposed on the connection pad and extending to the drain electrode portion.

Abstract: A substrate-less display device is disclosed. The substrate-less display device includes a barrier stack. The barrier stack includes a plurality of inorganic barrier films and a plurality of polymer films. The inorganic barrier films and the polymer films are alternatively disposed. The substrate-less display device further includes a thin-film-transistor (TFT) device layer disposed on the barrier stack, a display medium layer disposed on the TFT device layer, and an encapsulation layer disposed on the display medium layer.

Abstract: An electronic expansion valve is provided, a sleeve is fixed in a main valve cavity of the electronic expansion valve, and a valve core seat is axially movably provided in the sleeve; a circumferential side wall of the sleeve is provided with a sleeve flow passage, and a circumferential side wall of the valve core seat is provided with a valve core seat side hole; and when the refrigerant flows forward, the valve core seat closes the main valve port to disconnect a communication between the sleeve flow passage and the valve core seat side hole, and the refrigerant flows to the valve core valve port through the sleeve flow passage; and when the refrigerant flows reversely, the valve core seat moves upward to open the main valve port to communicate the valve core seat side hole with the sleeve flow passage

Abstract: An electronic expansion valve is provided, which includes a main valve cavity. A sleeve is fixed in the main valve cavity. A lower end part of the sleeve is supported by a valve seat, and the lower end part of the sleeve surrounds a main valve port. A valve core seat is axially movably arranged in the sleeve. A lower part of the valve needle component extends into the sleeve to open and close the valve core valve port. A circumferential side wall of the sleeve is provided with a first communicating hole close to the main valve port and a second communicating hole away from the main valve port. The structural design of the electronic expansion valve may prevent an excessive impact on a valve core seat caused by the refrigerant with high pressure when the refrigerant flows forward, thereby preventing the eccentricity of the valve core seat.

Abstract: An electronic expansion valve is provided, wherein a piston component and a valve needle component are located at the same side of a valve core seat. When refrigerant flows forwards, the piston component closes the bypass through hole, the refrigerant flows to a side of the vertical connecting pipe via the valve core valve port, and the valve needle component moves in the axial direction to regulate an opening of the valve core valve port. When the refrigerant flows reversely, the piston component moves upwards in the axial direction to open the bypass through hole, and the refrigerant flows to a side of the transverse connecting pipe via the bypass through hole.

Abstract: A thermal expansion valve with one-way control function includes a valve body having an inlet passage and an out passage, a temperature sensor installed on one end of said valve body, and a first valve core component installed in an inside chamber of said valve body. Said first valve core component includes a first valve core and a valve rod against said temperature sensor. Said valve body also includes an accommodation component extending from said inlet passage into said valve body and coaxially installed with said inlet passage. Said accommodation component has a second valve port connected with said inside chamber. Said accommodation component has a second valve core component having a supporting piece and a second valve core matching said second valve port. The processing of the structure is convenient and the assembly of the second valve core component is simple and reliable.