Abstract: A navigation-communication-integrated metamaterial sonar for underwater vehicles is provided, and belongs to the field of ocean detection and communication. The metamaterial sonar is a metamaterial composite structure including a group of disc array with the same diameters, a disc backboard and water gaps. By adjusting the period p of the disc array, a board thickness t1 of each disc, the thickness g of each water gap, the radius w1 of the disc array, the radius w2 and the thickness t2 of the backboard, the working states of underwater navigation and underwater acoustic communication may be flexibly switched by changing working frequencies, and the navigation-communication-integrated sonar may be realized.

Abstract: An antenna assembly and an electronic device are provided. A first antenna element includes a first radiator, a ground branch, and a first signal source. A joint of a first radiating branch and a second radiating branch is a first feed point. The first signal source is electrically connected to the first feed point. The ground branch, the first signal source, and the first radiating branch form a first sub-antenna. The ground branch, the first signal source, and the second radiating branch form a second sub-antenna. The first sub-antenna is configured to transmit/receive electromagnetic wave signals of a first target band under excitation of the first signal source. The second sub-antenna is configured to transmit/receive electromagnetic wave signals of a second target band under excitation of the first signal source. The first target band at least partially overlaps with the second target band.

Abstract: An antenna assembly and an electronic device are provided. The antenna assembly includes a substrate, a radiating patch, and a matching structure. The radiating patch is disposed on the substrate. The matching structure is configured to be electrically connected with a radio frequency (RF) signal circuit at one end of the matching structure, and the matching structure is provided with a first coupling piece at the other end of the matching structure. The first coupling piece is in capacitive coupling with the radiating patch. The first coupling piece is configured to feed a RF signal generated by the RF signal circuit into the radiating patch, to excite the radiating patch to generate multiple resonant modes. At least one resonant mode in the multiple resonant modes is generated by the capacitive coupling between the first coupling piece and the radiating patch.

Abstract: Provided are an antenna apparatus and an electronic device. A first coupling gap is formed between one end of a second radiator and a first radiator, and the other end of the second radiator is provided with a first ground terminal. One end of a third radiator is connected to the first ground terminal, and the other end thereof extends in a direction away from the second radiator. The third radiator is provided with a second ground terminal spaced apart from the first ground terminal. At least part of the first radiator and the second radiator jointly generate a first resonance. A part of the third radiator located on a side of the second ground terminal away from the first ground terminal generates a second resonance.

Abstract: An inductor assembly and a manufacturing method for an inductor assembly are provided. The inductor assembly includes a circuit board, a magnetic component, and a winding wire.

Abstract: The invention, which relates to the technical field of circuit boards, specifically discloses a method for manufacturing an embedded circuit board, an embedded circuit board, and an application thereof. The method includes: providing a substrate, wherein an electronic component is embedded in the substrate, a pad is arranged on a side surface of the electronic component, and an end surface of the pad is flush with a same side surface of the substrate; forming a metallic layer on a side surface of the substrate adjacent to the pad by sputtering, evaporation, electroplating or chemical vapor deposition; and patterning the metallic layer to obtain a circuit board covered with the metallic layer on the pad, wherein the metallic layer on the pad protrudes beyond the same side surface of the substrate.

Abstract: The present disclosure provides a circuit board and a method for manufacturing the circuit board. The circuit board may include: a base board, an embedded component, and an attached component. The base board may define a groove, the embedded component can be disposed in the groove. The attached component can be attached to at least one surface of the base board and connected to the embedded component.

Abstract: The invention, which relates to the technical field of inductance embedding, specifically discloses an embedded circuit board. The embedded circuit board includes: at least layer of sub-body, where preset positions of the sub-bodies are provided with through slots; and an inductance element embedded within the slots and configured to be spaced apart from sidewalls of the slots. In the above manner, it is possible to make the embedded circuit board of the present application structurally compact, highly integrated, widely applicable, and safe and reliable.

Abstract: The present application provides a circuit board and a manufacturing method therefor. The circuit board includes: a core board, at least one chip, a first circuit layer, and a first insulating layer. A groove body is formed on the core board. The chip is provided in the groove body. The chip is provided with a first lead-out terminal. The first circuit layer is provided on at least one side of the core board. The first insulating layer is provided between the core board and the first circuit layer. The first lead-out terminal passes through the first insulating layer and is connected to the first circuit layer, so that the chip is electrically connected to the first circuit layer. Thus, the wiring between the chip and the circuit is more flexible.

Abstract: A circuit board is provided, including: a core board, defining a plurality of slots, the plurality of slots including a plurality of first sub-slots and a plurality of second sub-slots disposed beneath the first sub-slots. Each of the second sub-slots is located beneath a corresponding first sub-slot of the first sub-slots; and a plurality of chip assemblies, arranged in the slots and including a plurality of first chips located in the first sub-slots and a plurality of second chips located in the second sub-slots. Each of the first chips is connected in series with one of the second chips at a corresponding position to form a plurality of chipsets; the chipsets are connected in parallel with each other; an end of the chipsets is connected to a first power signal layer, and the other end of the plurality of chipsets is connected to a ground layer.

Abstract: The present disclosure relates to the technical field of circuit boards, and provides an embedded circuit board and a method for manufacturing the embedded circuit board. The embedded circuit board includes: a first outer wiring board, a base board, and a second outer wiring board. The base board has at least one groove, the first outer wiring board, the base board and the second outer wiring board define through holes to form a resonant chamber. A minimal distance between the side walls of the groove and the side walls of the adjacent through holes is 50 um-400 um. An electronic device is received in the groove.

Abstract: The invention, which relates to the technical field of inductance embedding, specifically discloses an embedded circuit board. The embedded circuit board includes: at least layer of sub-body, where preset positions of the sub-bodies are provided with through slots; and an inductance element embedded within the slots and configured to be spaced apart from sidewalls of the slots. In the above manner, it is possible to make the embedded circuit board of the present application structurally compact, highly integrated, widely applicable, and safe and reliable.

Abstract: The invention, which relates to the technical field of circuit boards, specifically discloses a method for manufacturing an embedded circuit board, an embedded circuit board, and an application thereof. The method includes: providing a substrate, wherein an electronic component is embedded in the substrate, a pad is arranged on a side surface of the electronic component, and an end surface of the pad is flush with a same side surface of the substrate; forming a metallic layer on a side surface of the substrate adjacent to the pad by sputtering, evaporation, electroplating or chemical vapor deposition; and patterning the metallic layer to obtain a circuit board covered with the metallic layer on the pad, wherein the metallic layer on the pad protrudes beyond the same side surface of the substrate.

Abstract: An embedded circuit board includes a baseboard defining a recess, an electronic component disposed in the recess, and a package body covering an outer surface of the electronic component to separate the electronic component and a sidewall of the recess. The package body is made of a plastic enveloping material and the plastic enveloping material includes a base material and at least one of silicon dioxide, silicon carbide, silicon nitride and crystalline silicon powder.

Abstract: The present disclosure provides a circuit board and a method for manufacturing the circuit board. The circuit board may include: a base board, an embedded component, and an attached component. The base board may define a groove, the embedded component can be disposed in the groove. The attached component can be attached to at least one surface of the base board and connected to the embedded component.

Abstract: A circuit board is provided, including: a core board, defining a plurality of slots, the plurality of slots including a plurality of first sub-slots and a plurality of second sub-slots disposed beneath the first sub-slots. Each of the second sub-slots is located beneath a corresponding first sub-slot of the first sub-slots; and a plurality of chip assemblies, arranged in the slots and including a plurality of first chips located in the first sub-slots and a plurality of second chips located in the second sub-slots. Each of the first chips is connected in series with one of the second chips at a corresponding position to form a plurality of chipsets; the chipsets are connected in parallel with each other; an end of the chipsets is connected to a first power signal layer, and the other end of the plurality of chipsets is connected to a ground layer.

Abstract: The present disclosure relates to the technical field of circuit boards, and provides an embedded circuit board and a method for manufacturing the embedded circuit board. The embedded circuit board includes: a first outer wiring board, a base board, and a second outer wiring board. The base board has at least one groove, the first outer wiring board, the base board and the second outer wiring board define through holes to form a resonant chamber. A minimal distance between the side walls of the groove and the side walls of the adjacent through holes is 50 um-400 um. An electronic device is received in the groove.