Abstract: An inductive device is comprised of a plurality of dielectric wafers having conductive patterns disposed thereon and being formed into a laminate structure. The laminate structure includes a ferromagnetic core encased within the dielectric material. The conductive patterns are interconnected using vias to create a conductive structure, such as windings, about the core. During fabrication of the device, the core is pressurized to maintain high-permeability characteristics. As a result, inductive devices such as transformers and inductors can be made having small dimensions and high inductive values.

Abstract: Disclosed is a heat sink for cooling an integrated circuit package. The heat sink comprises a single thin sheet of material having two oppositely facing major surfaces. These two major surfaces have a common perimeter defining a plurality of spaced-apart finger-shaped portions of the thin sheet of material that extend radially from a central portion of the sheet. The central portion is convex for attachment to the integrated circuit package; and the finger-shaped portions are formed to extend out of the plane of the central portion to become cooling fins for the central portion.

Abstract: A tool for removing soldered IC packages comprises a block of heat-conducting material having a plurality of cylinder-shaped holes with parallel axes; a plurality of heat-conducting rods, each of which has one end that slides in a respective one of said holes; an insulator containing the block having a lid with another plurality of holes which are aligned with at least some of the rods in the block; and means for moving the rods that align with the holes in the lid partway through such holes by distances of unequal length so they can conduct heat from the block to respective I/O pins on the package that lie in multiple planes.