Patents by Inventor Zefei LI

Zefei LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240113140
    Abstract: A ridge recognition substrate and a ridge recognition apparatus. The ridge recognition substrate includes: a base substrate including a photosensitive area, and a light-shielding area located on at least one side of the photosensitive area; a plurality of photosensitive devices, arranged in the photosensitive area in an array; each photosensitive device includes a first electrode, a photoelectric conversion structure and a second electrode arranged in layers, the photoelectric conversion structure is electrically connected with the first electrode, and the photoelectric conversion structure directly contacts with the second electrode; and dummy devices, arranged in the light-shielding area in an array, each dummy device including a third electrode, an equivalent dielectric layer and a fourth electrode, the third electrode and the first electrode is in the same layer, the fourth electrode is located at the side of the layer where the second electrode is located facing away from the base substrate.
    Type: Application
    Filed: May 26, 2021
    Publication date: April 4, 2024
    Inventors: Yajie FENG, Cheng LI, Yue GENG, Kuiyuan WANG, Zhonghuan LI, Yi DAI, Chaoyang QI, Zefei LI, Congcong XI, Xiaoguan LI
  • Publication number: 20240075732
    Abstract: In a peeling system and a peeling method for a flexible fingerprint component provided by the present invention, the flexible fingerprint component is formed on a rigid substrate, and the flexible fingerprint component comprises a flexible substrate, a photosensitive device layer and an optical film sequentially arranged on the flexible substrate, a first chip-on film bonded to the photosensitive device layer on a first side of the optical film, and a second chip-on film bonded to the photosensitive device layer on a second side of the optical film, wherein the optical film is provided with an extension portion beyond the flexible substrate, the second side of the optical film is located on a side opposite to the extension portion, and the first side of the optical film is located on a side adjacent to the extension portion.
    Type: Application
    Filed: February 23, 2021
    Publication date: March 7, 2024
    Inventors: Yi DAI, Cheng LI, Yue GENG, Kuiyuan WANG, Chaoyang QI, Zefei LI, Yajie FENG, Xiaoguan LI, Zhonghuan LI
  • Publication number: 20240071127
    Abstract: An optical sensor array substrate and an optical fingerprint reader are provided. The optical sensor array substrate includes a substrate including a detection area which includes a plurality of photosensitive pixels. Photosensitive pixel includes: a TFT arranged on the substrate; a storage capacitor arranged on the substrate and having a first capacitor plate, and a second capacitor plate electrically connected to the source or drain of the TFT; a photosensitive element, having one end electrically connected to the second capacitor plate; a first electrode layer electrically connected to another end of the photosensitive element. On the substrate, an orthographic projection of the second capacitor plate at least partially overlaps with that of the first electrode layer, and the first capacitor plate is located in the same layer and has the same material as the gate of the TFT.
    Type: Application
    Filed: October 18, 2023
    Publication date: February 29, 2024
    Inventors: Yajie Feng, Cheng Li, Yue Geng, Kuiyuan Wang, Zefei Li, Chaoyang Qi, Yi Dai, Xiaoguan Li, Yingzi Wang
  • Publication number: 20240005694
    Abstract: Provided in the present disclosure are a print recognition module and a display apparatus. The print recognition module includes: a base substrate; a driving circuit layer located on one side of the base substrate and including a plurality of driving transistors arranged in an array; a first insulating layer located on the side of the driving circuit layer that is away from the base substrate and including a plurality of first via holes running through the thickness thereof; a connecting electrode layer located on the side of the first insulating layer that is away from the driving circuit layer and including a plurality of connecting electrodes which are in one-to-one correspondence with first electrodes of the driving transistors; and a plurality of photoelectric conversion portions located on the side of the connecting electrode layer that is away from the first insulating layer.
    Type: Application
    Filed: May 27, 2021
    Publication date: January 4, 2024
    Inventors: Yue GENG, Kuiyuan WANG, Zhonghuan LI, Cheng LI, Yi DAI, Yajie FENG, Chaoyang QI, Zefei LI, Xiaoguan LI, Congcong XI
  • Publication number: 20230395625
    Abstract: A print recognition substrate and a print recognition apparatus. The print recognition substrate includes a base substrate, which includes a data line and a gate line crossing each other; a light shielding structure, located on the base substrate, and including a metal layer, and an orthographic projection of the light shielding structure on the base substrate does not overlap with orthographic projections of the data line and the gate line on the base substrate; a photoelectric conversion structure, located on the side of the light shielding structure away from the base substrate, and an orthographic projection of the photoelectric conversion structure on the base substrate is located in an orthographic projection of the light shielding structure on the base substrate, and a distance between an edge of the photoelectric conversion structure and an edge of the light shielding structure is less than or equal to 3 ?m.
    Type: Application
    Filed: June 3, 2021
    Publication date: December 7, 2023
    Inventors: Yajie FENG, Cheng LI, Yue GENG, Kuiyuan WANG, Zhonghuan LI, Yi DAI, Chaoyang QI, Zefei LI, Xiaoguan LI, Congcong XI
  • Patent number: 11830278
    Abstract: An optical sensor array substrate and an optical fingerprint reader are provided. The optical sensor array substrate includes a substrate including a detection area which includes a plurality of photosensitive pixels. Photosensitive pixel includes: a TFT arranged on the substrate; a storage capacitor arranged on the substrate and having a first capacitor plate, and a second capacitor plate electrically connected to the source or drain of the TFT; a photosensitive element located on one side of the storage capacitor away from the substrate, and having one end electrically connected to the second capacitor plate; a first electrode layer located on one side of the photosensitive element away from the substrate and electrically connected to another end of the photosensitive element. An orthographic projection of the second capacitor plate on the substrate at least partially overlaps with an orthographic projection of the first electrode layer on the substrate.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: November 28, 2023
    Assignees: Beijing BOE Sensor Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Yajie Feng, Cheng Li, Yue Geng, Kuiyuan Wang, Zefei Li, Chaoyang Qi, Yi Dai, Xiaoguan Li, Yingzi Wang
  • Patent number: 11703865
    Abstract: A method for supporting aerial operation over a surface includes obtaining a three-dimensional (3D) representation of the surface; converting the 3D representation of the surface to a two-dimensional (2D) representation of the surface; obtaining a 2D flight path of the aircraft based on the 2D representation of the surface; converting the 2D flight path to a 3D flight path including location coordinates; and controlling the aircraft to conduct a flight mission following the 3D flight path.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: July 18, 2023
    Assignee: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Xumin Wu, Guang Yan, Zhuang Feng, Meng Hu, Zefei Li, Mingxi Wang, Renli Shi
  • Publication number: 20230177866
    Abstract: An optical sensor array substrate and an optical fingerprint reader are provided. The optical sensor array substrate includes a substrate including a detection area which includes a plurality of photosensitive pixels. Photosensitive pixel includes: a TFT arranged on the substrate; a storage capacitor arranged on the substrate and having a first capacitor plate, and a second capacitor plate electrically connected to the source or drain of the TFT; a photosensitive element located on one side of the storage capacitor away from the substrate, and having one end electrically connected to the second capacitor plate; a first electrode layer located on one side of the photosensitive element away from the substrate and electrically connected to another end of the photosensitive element. An orthographic projection of the second capacitor plate on the substrate at least partially overlaps with an orthographic projection of the first electrode layer on the substrate.
    Type: Application
    Filed: November 30, 2020
    Publication date: June 8, 2023
    Inventors: Yajie Feng, Cheng Li, Yue Geng, Kuiyuan Wang, Zefei Li, Chaoyang Qi, Yi Dai, Xiaoguan Li, Yingzi Wang
  • Publication number: 20230178578
    Abstract: The re is provided a fingerprint identification module, including a substrate having a fingerprint identification area and a peripheral area; a photoelectric sensing structure in the fingerprint identification area, and including pixel units; each pixel unit includes a thin film transistor having a gate electrode coupled to a corresponding gate line and a first electrode coupIed to a corresponding signal sensing line; the fingerprint identification area includes a photosensitive region, the pixel unit in the photosensitive region further includes a photoelectric sensor including a third electrode, a photosensitive pattern and a fourth electrode which are sequentially stacked along a direction away from the substrate, and the third electrode is coupled to a second electrode of the thin film transistor in the same pixel unit as that where the photoelectric sensor is located; an area ratio of the photoelectric sensor to the pixel unit corresponding thereto ranges from 40% to 90%.
    Type: Application
    Filed: November 30, 2020
    Publication date: June 8, 2023
    Inventors: Kuiyuan WANG, Cheng LI, Yue GENG, Chaoyang QI, Yi DAI, Zefei LI, Xiaoguan LI, Yajie FENG, Yingzi WANG
  • Patent number: 11587966
    Abstract: A fingerprint acquisition apparatus includes a plurality of photoelectric conversion units and a first shading pattern. The first shading pattern includes at least one first shading block including a first opening, and an orthographic projection of the first opening in the first shading block on the base substrate is within an orthographic projection of a target photoelectric conversion unit corresponding to the first shading block on the base substrate.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: February 21, 2023
    Assignees: Beijing BOE Sensor Technology Co., LTD, BOE Technology Group Co., LTD.
    Inventors: Yajie Feng, Cheng Li, Yue Geng, Kuiyuan Wang, Chaoyang Qi, Yi Dai, Zefei Li
  • Patent number: 11538848
    Abstract: Provided a fingerprint identification substrate and a manufacturing method therefor, a identification method, and a display apparatus. The fingerprint identification substrate includes a substrate and at least two kinds of identification pixels disposed on the substrate, a first identification pixel includes a first photodiode and a second identification pixel includes a second photodiode. The first photodiode includes a first electrode, a first photoelectric conversion layer and a second electrode, the second photodiode includes the first electrode, a second photoelectric conversion layer and the second electrode, and the first photoelectric conversion layer and the second photoelectric conversion layer have different spectral response characteristics to red light or infrared light.
    Type: Grant
    Filed: June 26, 2021
    Date of Patent: December 27, 2022
    Assignees: Beijing BOE Sensor Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Yue Geng, Cheng Li, Zhonghuan Li, Kuiyuan Wang, Yi Dai, Zefei Li, Chaoyang Qi, Yajie Feng, Xiaoguan Li
  • Publication number: 20220164561
    Abstract: The embodiment of the present disclosure discloses a display apparatus. A flexible optical fingerprint recognition component is obtained by arrangement of a flexible substrate, a flexible fingerprint recognition element and a flexible collimation structure to implement flexible foldable display. In addition, the flexible fingerprint recognition element includes a first flexible fingerprint recognition element and a second flexible fingerprint recognition element which are mutually independent, the first flexible fingerprint recognition element corresponds to a first non-bending area of the flexible display module, the second flexible fingerprint recognition element corresponds to a second non-bending area of the flexible display module, and a non-fingerprint recognition area corresponding to the bending area is provided between the first flexible fingerprint recognition element and the second flexible fingerprint recognition element.
    Type: Application
    Filed: June 22, 2021
    Publication date: May 26, 2022
    Inventors: Yi DAI, Cheng LI, Yue GENG, Kuiyuan WANG, Yajie FENG, Zefei LI, Chaoyang QI, Zhonghuan LI
  • Publication number: 20220163812
    Abstract: The present disclosure provides an optical identification module and a display panel. The optical identification module includes a substrate, an identification structure and a collimation optical path structure, where the identification structure is arranged on the substrate, the collimation optical path structure is arranged on a light entering side of the identification structure, the optical identification module further includes a non-visible light filtering structure, and the non-visible light filtering structure is arranged in the collimation optical path structure and configured to filter non-visible light irradiated to the identification structure.
    Type: Application
    Filed: June 23, 2021
    Publication date: May 26, 2022
    Inventors: Zefei LI, Yue GENG, Cheng LI, Zhonghuan LI, Chaoyang QI, Kuiyuan WANG, Yi DAI, Yajie FENG, Xiaoguan LI
  • Publication number: 20220165780
    Abstract: Provided a fingerprint identification substrate and a manufacturing method therefor, a identification method, and a display apparatus. The fingerprint identification substrate includes a substrate and at least two kinds of identification pixels disposed on the substrate, a first identification pixel includes a first photodiode and a second identification pixel includes a second photodiode. The first photodiode includes a first electrode, a first photoelectric conversion layer and a second electrode, the second photodiode includes the first electrode, a second photoelectric conversion layer and the second electrode, and the first photoelectric conversion layer and the second photoelectric conversion layer have different spectral response characteristics to red light or infrared light.
    Type: Application
    Filed: June 26, 2021
    Publication date: May 26, 2022
    Inventors: Yue GENG, Cheng LI, Zhonghuan LI, Kuiyuan WANG, Yi DAI, Zefei LI, Chaoyang QI, Yajie FENG, Xiaoguan LI
  • Publication number: 20220165772
    Abstract: A fingerprint acquisition apparatus includes a plurality of photoelectric conversion units and a first shading pattern. The first shading pattern includes at least one first shading block including a first opening, and an orthographic projection of the first opening in the first shading block on the base substrate is within an orthographic projection of a target photoelectric conversion unit corresponding to the first shading block on the base substrate.
    Type: Application
    Filed: August 16, 2021
    Publication date: May 26, 2022
    Inventors: Yajie Feng, Cheng Li, Yue Geng, Kuiyuan Wang, Chaoyang Qi, Yi Dai, Zefei Li
  • Patent number: 11334077
    Abstract: A method for locating a faulty photovoltaic (PV) panel includes controlling an unmanned aerial vehicle (UAV) to fly and perform image capturing, obtaining image information of the PV panel captured by a camera carried by the UAV, obtaining global positioning (GPS) information of the UAV and attitude information of the camera at a shooting time when the camera captures the image information, and, in response to determining that the image information includes fault information of the PV panel, determining a position of the PV panel according to the GPS information of the UAV and the attitude information of the camera at the shooting time.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: May 17, 2022
    Assignee: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Chao Weng, Zefei Li, Chang Liu, Mingxi Wang
  • Publication number: 20210333794
    Abstract: A method for supporting aerial operation over a surface includes obtaining a representation of the surface that comprises a plurality of flight sections, and identifying a flight path based on the representation of the surface. The flight path allows an aircraft, when following the flight path, to conduct an operation over the flight sections.
    Type: Application
    Filed: May 24, 2021
    Publication date: October 28, 2021
    Inventors: Xumin WU, Guang YAN, Zhuang FENG, Meng HU, Zefei LI, Mingxi WANG, Renli SHI
  • Patent number: 11113529
    Abstract: A method for identifying a photovoltaic panel includes: acquiring a grayscale image of an infrared image captured by a camera mounted on a UAV, the grayscale image including an image of a photovoltaic panel; performing edge extraction processing on an image in the grayscale image to obtain a monochrome image including a plurality of horizontal lines and a plurality of vertical lines, the horizontal lines being lines in a first direction, an average length of the lines in the first direction being greater than a preset length, the vertical lines being lines in a second direction, and an average length of the lines in the second direction being less than the preset length; and identifying the photovoltaic panel in the monochrome image based on a relative positional relationship between the horizontal lines and the vertical lines in the monochrome image.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: September 7, 2021
    Assignee: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Zefei Li, Chao Weng
  • Patent number: 11016488
    Abstract: A method for supporting aerial operation over a surface includes obtaining a representation of the surface that comprises a plurality of flight sections, and identifying a flight path based on the representation of the surface. The flight path allows an aircraft, when following the flight path, to conduct an operation over the flight sections.
    Type: Grant
    Filed: January 3, 2019
    Date of Patent: May 25, 2021
    Assignee: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Xumin Wu, Guang Yan, Zhuang Feng, Meng Hu, Zefei Li, Mingxi Wang, Renli Shi
  • Publication number: 20200201333
    Abstract: A method for locating a faulty photovoltaic (PV) panel includes controlling an unmanned aerial vehicle (UAV) to fly and perform image capturing, obtaining image information of the PV panel captured by a camera carried by the UAV, obtaining global positioning (GPS) information of the UAV and attitude information of the camera at a shooting time when the camera captures the image information, and, in response to determining that the image information includes fault information of the PV panel, determining a position of the PV panel according to the GPS information of the UAV and the attitude information of the camera at the shooting time.
    Type: Application
    Filed: December 27, 2019
    Publication date: June 25, 2020
    Inventors: Chao WENG, Zefei LI, Chang LIU, Mingxi WANG