Patents by Inventor Zehao Lu

Zehao Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip cooling platform based on micro-nano structure
    Patent number: 12685165
    Abstract: A chip cooling platform based on a micro-nano structure includes, a platform body, a cooling pipeline, and an outer heat dissipation device. The cooling pipeline is of a closed-loop structure, and part of cooling pipeline is arranged in the platform body. The cooling pipeline is filled with a cooling medium, and a turbulence structure is arranged on an inner wall of the cooling pipeline in the platform body. A first one-way hydraulic pump is mounted on the cooling pipeline outside the platform body. The outer heat dissipation device is configured to dissipate heat from the cooling medium in the cooling pipeline.
    Type: Grant
    Filed: September 13, 2024
    Date of Patent: July 14, 2026
    Assignee: GUANGDONG OCEAN UNIVERSITY
    Inventors: Haowei Li, Weijun Feng, Zehao Lu, Zeming Chen, Runji Xie, Wenguan Li
  • NOVEL CHIP COOLING PLATFORM BASED ON MICRO-NANO STRUCTURE
    Publication number: 20250226287
    Abstract: Provided is a novel chip cooling platform based on a micro-nano structure, including a platform body, a cooling pipeline, and an outer heat dissipation device. The cooling pipeline is of a closed-loop structure, and part of cooling pipeline is arranged in the platform body. The cooling pipeline is filled with a cooling medium, and a turbulence structure is arranged on an inner wall of the cooling pipeline in the platform body. A first one-way hydraulic pump is mounted on the cooling pipeline outside the platform body. The outer heat dissipation device is configured to dissipate heat from the cooling medium in the cooling pipeline.
    Type: Application
    Filed: September 13, 2024
    Publication date: July 10, 2025
    Inventors: Haowei LI, Weijun FENG, Zehao LU, Zeming CHEN, Runji XIE, Wenguan LI
  • Chip cooling platform based on micro-nano structure
    Patent number: 12278164
    Abstract: The disclosure discloses a chip cooling platform based on micro-nano structure, including a platform body, a cooling pipeline and an outer heat dissipation device, where the cooling pipeline is in a closed-loop structure, and part of the cooling pipeline is arranged in the platform body; the cooling pipeline is filled with cooling medium, and an inner wall of the cooling pipeline located in the platform body is provided with a turbulence structure; and a unidirectional hydraulic pump I is installed on the cooling pipeline arranged outside the platform body; the outer heat dissipation device is used for radiating the cooling medium in the cooling pipeline.
    Type: Grant
    Filed: December 11, 2024
    Date of Patent: April 15, 2025
    Assignee: GUANGDONG OCEAN UNIVERSITY
    Inventors: Haowei Li, Weijun Feng, Zehao Lu, Zeming Chen, Runji Xie, Wenguan Li