Abstract: The present disclosure discloses a liquid-cooled cold plate device, comprising a microchannel cold plate for dissipating heat of the electronic system, at least two microchannel groups, disposed inside the microchannel cold plate; at least one liquid inlet, provided on the microchannel cold plate and used for the cooling liquid to flow in; at least one liquid outlet provided on the microchannel cold plate and used for the cooling liquid to flow out; the cooling liquid entering the liquid inlet is divided into one cooling liquid branch; the cooling liquid branch flows bidirectionally through the microchannels group. The present disclosure uses a combination of microchannel cold plates and microchannel groups, greatly improves the heat dissipation efficiency, reduces the influence of thermal cascade, thus is beneficial to the efficient heat dissipation of electronic system.

Abstract: The present disclosure discloses a liquid-cooled cold plate device, comprising a microchannel cold plate for dissipating heat of the electronic system, at least two microchannel groups, disposed inside the microchannel cold plate; at least one liquid inlet, provided on the microchannel cold plate and used for the cooling liquid to flow in; at least one liquid outlet provided on the microchannel cold plate and used for the cooling liquid to flow out; the cooling liquid entering the liquid inlet is divided into one cooling liquid branch; the cooling liquid branch flows bidirectionally through the microchannels group. The present disclosure uses a combination of microchannel cold plates and microchannel groups, greatly improves the heat dissipation efficiency, reduces the influence of thermal cascade, thus is beneficial to the efficient heat dissipation of electronic system.