Patents by Inventor Zelong LI

Zelong LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240071859
    Abstract: A chip package structure is provided and includes a PCB, a chip, a package cover, a thermal interface material layer, and a heat sink. The chip is welded to the PCB. The package cover is disposed on the PCB. The chip is packaged in the package cover. The thermal interface material layer covers the chip, and is attached to an inner top surface of the package cover. The heat sink is disposed on the PCB. An assembly space is formed between the heat sink and the PCB. The heat sink includes a contact plate. A lower end face of the contact plate abuts against an outer top surface of the package cover. A projection of the abutting member in a height direction of the chip package structure covers the chip, and is located in a region enclosed by an edge of the outer top surface of the package cover.
    Type: Application
    Filed: October 24, 2023
    Publication date: February 29, 2024
    Inventors: Zelong Jiao, Chungang Li, Chengpeng Yang
  • Patent number: 11863595
    Abstract: A method and apparatus for matching users, a computer device, and a storage medium are provided. The method includes: receiving a matching request sent by a first user; searching, in response to the matching request, second users adapted to the first user; selecting a second user of the second users as a target user according to the second link value to create a voice session with the first user; recording behavior data between the first user and the target user in the voice session; and updating a first link value and a second link value of the target user according to the behavior data and the second link value of the target user. The method and apparatus for matching users can greatly reduce cost and improve efficiency.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: January 2, 2024
    Assignee: TIYA PTE. LTD.
    Inventors: Minjie Zeng, Zelong Li
  • Publication number: 20220272130
    Abstract: A method and apparatus for matching users, a computer device, and a storage medium are provided. The method includes: receiving a matching request sent by a first user; searching, in response to the matching request, second users adapted to the first user; selecting a second user of the second users as a target user according to the second link value to create a voice session with the first user; recording behavior data between the first user and the target user in the voice session; and updating a first link value and a second link value of the target user according to the behavior data and the second link value of the target user. The method and apparatus for matching users can greatly reduce cost and improve efficiency.
    Type: Application
    Filed: June 11, 2021
    Publication date: August 25, 2022
    Applicant: TIYA PTE. LTD.
    Inventors: Minjie ZENG, Zelong LI
  • Patent number: 11181773
    Abstract: A backlight module. The backlight module comprises: an LED chip (1), a transparent support (2), and a packaging adhesive (3); an accommodating groove (21) is provided on the transparent support (2), and the LED chip (1) is provided at the bottom of the accommodating groove (21); the packaging adhesive (3) is located in the accommodating groove (21) and covers a light-exiting surface of the LED chip (1). The LED chip (1) and the packaging adhesive (3) are provided in the accommodating groove (21), so that the transparent support (2) and the packaging adhesive (3) enlarge a light-exiting angle of the LED chip (1), thereby reducing the number of the LED chips (1) in the backlight module and reducing the production costs.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: November 23, 2021
    Inventors: Zelong Li, Daiqing Wang, Kewen Qiang, Honglei Ji
  • Publication number: 20210240040
    Abstract: A backlight module. The backlight module comprises: an LED chip (1), a transparent support (2), and a packaging adhesive (3); an accommodating groove (21) is provided on the transparent support (2), and the LED chip (1) is provided at the bottom of the accommodating groove (21); the packaging adhesive (3) is located in the accommodating groove (21) and covers a light-exiting surface of the LED chip (1). The LED chip (1) and the packaging adhesive (3) are provided in the accommodating groove (21), so that the transparent support (2) and the packaging adhesive (3) enlarge a light-exiting angle of the LED chip (1), thereby reducing the number of the LED chips (1) in the backlight module and reducing the production costs.
    Type: Application
    Filed: December 17, 2019
    Publication date: August 5, 2021
    Inventors: Zelong LI, Daiqing WANG, Kewen Qiang, Honglei JI
  • Patent number: D975109
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: January 10, 2023
    Assignee: TIYA PTE. LTD.
    Inventors: Zelong Li, Xiaosong Wei
  • Patent number: D1023030
    Type: Grant
    Filed: January 12, 2022
    Date of Patent: April 16, 2024
    Assignee: TIYA PTE. LTD.
    Inventors: Zichun Liu, Zelong Li
  • Patent number: D1023050
    Type: Grant
    Filed: January 12, 2022
    Date of Patent: April 16, 2024
    Assignee: TIYA PTE. LTD.
    Inventors: Zichun Liu, Zelong Li