Patents by Inventor Zeming Wang

Zeming Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11686658
    Abstract: A pin-on-plate friction and wear test device includes a high temperature heating chamber and a cooling pin. The high temperature heating chamber is fastened horizontally to the mobile base. The axis of the cooling pin is perpendicular to the upper surface of the mobile base. The electric resistance heating plate is located in the bottom closed space under the friction sample plate in the high temperature heating chamber. The electric resistance heats the fixed sample to experiment temperature. The inner layout of pin is a circling cooling channel where the cooling medium adjusts and cools the temperature of the sample. Thermocouples are separately distributed in the temperature measuring groove of the high temperature heating chamber and the temperature measuring hole of the cooling pin for real-time temperature measurement. The device can simulate the friction and wear properties of the high-strength steel plate and hot-stamping die in the differential temperature environment.
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: June 27, 2023
    Assignee: JIANGSU UNIVERSITY
    Inventors: Wei Chen, Peng Cao, Yishu Cao, Ying Bai, Wei Zhang, Zeming Wang
  • Publication number: 20220349794
    Abstract: A pin-on-plate friction and wear test device includes a high temperature heating chamber and a cooling pin. The high temperature heating chamber is fastened horizontally to the mobile base. The axis of the cooling pin is perpendicular to the upper surface of the mobile base. The electric resistance heating plate is located in the bottom closed space under the friction sample plate in the high temperature heating chamber. The electric resistance heats the fixed sample to experiment temperature. The inner layout of pin is a circling cooling channel where the cooling medium adjusts and cools the temperature of the sample. Thermocouples are separately distributed in the temperature measuring groove of the high temperature heating chamber and the temperature measuring hole of the cooling pin for real-time temperature measurement. The device can simulate the friction and wear properties of the high-strength steel plate and hot-stamping die in the differential temperature environment.
    Type: Application
    Filed: July 7, 2021
    Publication date: November 3, 2022
    Applicant: JIANGSU UNIVERSITY
    Inventors: Wei CHEN, Peng CAO, Yishu CAO, Ying BAI, Wei ZHANG, Zeming WANG
  • Patent number: D945635
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: March 8, 2022
    Inventor: Zeming Wang