Patents by Inventor Zenchi Hayashi

Zenchi Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6930584
    Abstract: A microminiature power converter includes a semiconductor substrate on which a semiconductor integrated circuit is formed, a thin film magnetic induction element, and a capacitor. The thin film magnetic induction element includes a magnetic insulating substrate, and a solenoid coil conductor in which a first conductor is formed on a first principal plane of the magnetic insulating substrate, a second conductor is formed on a second principal plane of the magnetic insulating substrate, and a connection conductor is formed in a through hole passing through the magnetic insulating substrate are connected. A relationship of a length L of the magnetic insulating substrate in a direction vertical to a magnetic field generated by the solenoid coil and a length d of the coil conductor is d?L/2.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: August 16, 2005
    Assignee: Fuji Electric Device Technology Co., Ltd.
    Inventors: Masaharu Edo, Zenchi Hayashi
  • Publication number: 20050094302
    Abstract: On top of a silicon substrate, a polyimide film with a thickness of 10 ?m is formed. On top of this, a magnetic thin film that is a polyimide film containing Fe fine particles and that has a thickness of 20 ?m is formed. On top of this magnetic thin film, a patterned Ti/Au film and a Ti/Au connection conductor are formed. On top of this, a polyimide film with a thickness of 10 ?m, and a Cu coil with a height 35 ?m, width 90 ?m, space 25 ?m, and a polyimide layer that fills the spaces in the Cu coil are formed. On top of this, via a polyimide film with a thickness of 10 ?m, a magnetic thin film that is a polyimide film containing Fe particles and that has a thickness of 20 ?m is formed. This thin film inductor has a small alternating current resistance. The present invention provides a magnetic thin film that is well suited for mass production, can be manufactured easily, can be made into a thick film, has soft magnetic qualities, and is inexpensive.
    Type: Application
    Filed: December 14, 2004
    Publication date: May 5, 2005
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Kazuo Matsuzaki, Taku Furuta, Kazumi Takagiwa, Zenchi Hayashi
  • Patent number: 6835576
    Abstract: On top of a silicon substrate, a polyimide film with a thickness of 10 &mgr;m is formed. On top of this, a magnetic thin film that is a polyimide film containing Fe fine particles and that has a thickness of 20 &mgr;m is formed. On top of this magnetic thin film, a patterned Ti/Au film and a Ti/Au connection conductor are formed. On top of this, a polyimide film with a thickness of 10 &mgr;m, and a Cu coil with a height 35 &mgr;m, width 90 &mgr;m, space 25 &mgr;m, and a polyimide layer that fills the spaces in the Cu coil are formed. On top of this, via a polyimide film with a thickness of 10 &mgr;m, a magnetic thin film that is a polyimide film containing Fe particles and that has a thickness of 20 &mgr;m is formed. This thin film inductor has a small alternating current resistance. The present invention provides a magnetic thin film that is well suited for mass production, can be manufactured easily, can be made into a thick film, has soft magnetic qualities, and is inexpensive.
    Type: Grant
    Filed: May 1, 2001
    Date of Patent: December 28, 2004
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Kazuo Matsuzaki, Taku Furuta, Kazumi Takagiwa, Zenchi Hayashi
  • Publication number: 20040208032
    Abstract: A microminiature power converter includes a semiconductor substrate on which a semiconductor integrated circuit is formed, a thin film magnetic induction element, and a capacitor. The thin film magnetic induction element includes a magnetic insulating substrate, and a solenoid coil conductor in which a first conductor is formed on a first principal plane of the magnetic insulating substrate, a second conductor is formed on a second principal plane of the magnetic insulating substrate, and a connection conductor is formed in a through hole passing through the magnetic insulating substrate are connected. A relationship of a length L of the magnetic insulating substrate in a direction vertical to a magnetic field generated by the solenoid coil and a length d of the coil conductor is d≧L/2.
    Type: Application
    Filed: January 16, 2004
    Publication date: October 21, 2004
    Inventors: Masaharu Edo, Zenchi Hayashi
  • Publication number: 20020090755
    Abstract: On top of a silicon substrate, a polyimide film with a thickness of 10 &mgr;m is formed. On top of this, a magnetic thin film that is a polyimide film containing Fe fine particles and that has a thickness of 20 &mgr;m is formed. On top of this magnetic thin film, a patterned Ti/Au film and a Ti/Au connection conductor are formed. On top of this, a polyimide film with a thickness of 10 &mgr;m, and a Cu coil with a height 35 &mgr;m, width 90 &mgr;m, space 25 &mgr;m, and a polyimide layer that fills the spaces in the Cu coil are formed. On top of this, via a polyimide film with a thickness of 10 &mgr;m, a magnetic thin film that is a polyimide film containing Fe particles and that has a thickness of 20 &mgr;m is formed. This thin film inductor has a small alternating current resistance. The present invention provides a magnetic thin film that is well suited for mass production, can be manufactured easily, can be made into a thick film, has soft magnetic qualities, and is inexpensive.
    Type: Application
    Filed: May 1, 2001
    Publication date: July 11, 2002
    Inventors: Kazuo Matsuzaki, Taku Furuta, Kazumi Takagiwa, Zenchi Hayashi