Abstract: Thermosetting epoxy-terminated oxazolidinone ring containing polymers which are obtainable by reacting at least one polyisocyanate compound with at least one hydroxy group containing epoxy resin and/or a combination of at least one epoxy resin and at least one di- or multifunctional nucleophilic compound that is capable of forming crosslinks between epoxy groups. The polymers have an onset glass transition temperature of at least about 45° C. and are capable of showing an onset glass transition temperature in the cured state at least about 160° C. Powder coating compositions comprising these polymers are also disclosed.

Abstract: A resin composition comprising oligomers having a molar ratio of isocyanurate to oxazolidinone greater than 1:1, wherein the weight average molecular weight of the oligomers is less than or equal to 3000, as measured by gel permeation chromatography. Such resin compositions may be combined with a hardener to form a curable composition. Also disclosed is a process for forming a resin composition, including: reacting diisocyanates to form isocyanurates; reacting isocyanate groups in the isocyanurates and unreacted diisocyanates with an epoxy precursor to form a resin composition comprising oligomers having: a molar ratio of isocyanurate to oxazolidinone greater than 1:1; wherein the weight average molecular weight of the oligomers is less than or equal to 3000, as measured by gel permeation chromatography. Such compositions may be useful in prepregs and laminates.

Abstract: Thermosetting epoxy-terminated oxazolidinone ring containing polymers which are obtainable by reacting at least one polyisocyanate compound with at least one hydroxy group containing epoxy resin and/or a combination of at least one epoxy resin and at least one di- or multifunctional nucleophilic compound that is capable of forming crosslinks between epoxy groups. The polymers have an onset glass transition temperature of at least about 45° C. and are capable of showing an onset glass transition temperature in the cured state at least about 160° C. Powder coating compositions comprising these polymers are also disclosed.

Abstract: Epoxy resins which are relatively low in total bound halide are prepared by concurrently and continuously adding a mixture of (1) a mixture of an epihalohydrin, a compound containing an average of more than one group reactive with a vicinal epoxide group and a solvent and (2) an aqueous or organic solution of an alkali or alkaline earth metal hydroxide; to (3) a mixture of epihalohydrin and a solvent.

Abstract: The total halide content of epoxy resins is reduced by heating a resin containing undesirable halide dissolved in a solvent mixture containing at least one polar aprotic solvent in the presence of an alkali metal hydroxide for a time sufficient to reduce the total halide content.

Abstract: Glycidyl derivatives of compounds containing --OH, --NH.sub.2 and/or --COOH groups are prepared by reacting in the presence of a mixture of solvents, at least one of which is a polar aprotic solvent, an excess of an epihalohydrin with a compound containing --OH, --NH.sub.2 and/or --COOH groups while continuously or incrementally adding an alkali metal hydroxide to the mixture and removing water from the reaction by codistillation with epihalohydrin and the solvents.

Abstract: The aromatic hydroxyl groups of aromatic hydroxyl-containing compounds can be allylated to greater than 95% conversion by reacting the alkali metal salt of said aromatic hydroxyl-containing compounds with an allyl halide such as allyl chloride in the presence of a polar aprotic solvent such as dimethylformamide. These compounds are useful in preparing epoxy resins containing a low halogen content.

Abstract: Monomers and oligomers containing a plurality of vinylbenzyl ether groups are prepared by reacting a material containing a plurality of aromatic hydroxyl groups such as tetramethyltetrabromobisphenol A with a vinylbenzyl halide such as vinylbenzyl chloride in the presence of a polar aprotic solvent such as dimethylformamide. The monomers and oligomers prepared by this process have an improvement in one or more properties selected from dielectric constant (before and/or after moisture absorption) or thermal stability. Also disclosed are new monomers and oligomers containing a plurality of vinylbenzyl ether groups such as bis(vinylbenzyl)ether of dicyclopentadienyl bisdimethylphenol.