Abstract: A cross-cut tester includes a handle with a receiving cavity, and a plurality of blades received in the receiving cavity. One end of the handle defines an opening. The cross-cut tester further includes a plurality of gaskets received in the receiving cavity. The gaskets and the blades are positioned one-by-one, and are detachably fixed in the receiving cavity. The cross-cut tester of the present disclosure can effectively improve the efficiency of drawing lines and reduce the cost.

Abstract: A cross-cut tester includes a handle with a receiving cavity, and a plurality of blades received in the receiving cavity. One end of the handle defines an opening. The cross-cut tester further includes a plurality of gaskets received in the receiving cavity. The gaskets and the blades are positioned one-by-one, and are detachably fixed in the receiving cavity. The cross-cut tester of the present disclosure can effectively improve the efficiency of drawing lines and reduce the cost.

Abstract: A test system for generating a test file includes an information obtaining module, a file header generation module, an identification module, and a measuring module. The information obtaining module reads an original information of an electronic component. The file header generation module generates a file header according to the original information. The identification module determines a manufacturing process of the electronic component according to the original information, and generates test items according to the manufacturing process. The measuring module activates measuring program according to the manufacturing process to measure the electronic device for obtain a measuring result corresponding to the test items.

Abstract: A method for forming a thin film, electrically blowable fuse with reproducible blowing wattage using a sacrificial metal patch over a fuse dielectric layer and two etch processes; wherein the first etch process is selective to the metal patch and the second etch process is selective to the fuse dielectric layer. A fuse element, having an element width, is formed over a semiconductor structure, and a fuse dielectric layer is formed over the fuse element. A sacrificial metal patch is formed on the fuse dielectric layer; wherein the patch width being greater than the fuse element width. A second dielectric layer is formed on the sacrificial metal patch, and additional metal layers and dielectric layers may be formed over the second dielectric layer, but only the dielectric layers will remain over the fuse element.