Abstract: A switching module includes a substrate, a switching element, a first control part, a second control part, a first power part and a second power part. The switching element is disposed on the substrate. The switching element includes a first control terminal, a second control terminal, a first power terminal and a second power terminal. The first control part is connected with the first control terminal of the switching element. The second control part is connected with the second control terminal of the switching element. A projection area of the first control part on a reference plane intersects with a projection area of the second control part on the reference plane at one or more first intersections. The first power part is connected with the first power terminal of the switching element. The second power part is connected with the second power terminal of the switching element.

Abstract: The present disclosure provides a magnetic element, including: a magnetic column extending along a first direction; a first winding surrounding the magnetic column, connected to a first terminal located on a first side of the magnetic element, and the first terminal has a first projection of the first terminal on a first side surface of the magnetic element; and a second winding surrounding the magnetic column and at least partially outside the first winding, wherein the second winding has a first projection of the second winding on the first side surface of the magnetic element, the first projection of the first terminal is at least partially outside the first projection of the second winding, the second winding is a flatwise-wound winding, and the number of turns of the first winding is greater than or equal to the number of turns of the second winding.

Abstract: The present disclosure provides a magnetic element, including: a magnetic core with at least one magnetic column extending along a first direction; a first winding surrounding the magnetic column; a second winding at least partially surrounding the first winding; and a third winding at least partially surrounding the second winding. The number of turns of the second winding is less than or equal to the number of turns of the first winding. The number of turns of the third winding is less than or equal to the number of turns of the first winding.

Abstract: The present disclosure relates to an embedded packaging module comprising a first semiconductor device, a first packaging layer and a first wiring layer, the first semiconductor device having a first and a second face, at least two positioning bulges and at least one bonding pad being provided on the first face of the first semiconductor device; the first packaging layer being formed on both the first face and a surface adjacent to the first face, the positioning bulges being positioned in the first packaging layer, at least one first via hole being provided in the first packaging layer, the bottom of the first via hole being positioned in the bonding pad and contacting with the bonding pad; the first wiring layer being positioned on the side of the first packaging layer away from the first semiconductor device and being electrically connected with the bonding pad through the first via hole.

Abstract: A switching module includes a substrate, a switching element, a first control part, a second control part, a first power part and a second power part. The switching element is disposed on the substrate. The switching element includes a first control terminal, a second control terminal, a first power terminal and a second power terminal. The first control part is connected with the first control terminal of the switching element. The second control part is connected with the second control terminal of the switching element. A projection area of the first control part on a reference plane intersects with a projection area of the second control part on the reference plane at one or more first intersections. The first power part is connected with the first power terminal of the switching element. The second power part is connected with the second power terminal of the switching element.

Abstract: There is provided a magnetic core component and the gap control method thereof. The magnetic core component includes a first magnetic component, a second magnetic component and a first gap control structure disposed therebetween. The first gap control structure includes thixotropic material and is applied on the first magnetic component and is cured, the second magnetic component is disposed on the cured first gap control structure, and a gap between the first magnetic component and the second magnetic component is controlled by an effective height of the first gap control structure. The gap control structure has minimum variability after it is cured, and its effective height can be always kept at a required gap height.

Abstract: the present disclosure relates to an embedded packaging module comprising a first semiconductor device, a first packaging layer and a first wiring layer, the first semiconductor device having a first and a second face, at least two positioning bulges and at least one bonding pad being provided on the first face of the first semiconductor device; the first packaging layer being formed on both the first face and a surface adjacent to the first face, the positioning bulges being positioned in the first packaging layer, at least one first via hole being provided in the first packaging layer, the bottom of the first via hole being positioned in the bonding pad and contacting with the bonding pad; the first wiring layer being positioned on the side of the first packaging layer away from the first semiconductor device and being electrically connected with the bonding pad through the first via hole.

Abstract: There is provided a magnetic core component and the gap control method thereof. The magnetic core component includes a first magnetic component, a second magnetic component and a first gap control structure disposed therebetween. The first gap control structure includes thixotropic material and is applied on the first magnetic component and is cured, the second magnetic component is disposed on the cured first gap control structure, and a gap between the first magnetic component and the second magnetic component is controlled by an effective height of the first gap control structure. The gap control structure has minimum variability after it is cured, and its effective height can be always kept at a required gap height.

Abstract: There is provided a magnetic core component and the gap control method thereof. The magnetic core component includes a first magnetic component, a second magnetic component and a first gap control structure disposed therebetween. The first gap control structure includes thixotropic material and is applied on the first magnetic component and is cured, the second magnetic component is disposed on the cured first gap control structure, and a gap between the first magnetic component and the second magnetic component is controlled by an effective height of the first gap control structure. The gap control structure has minimum variability after it is cured, and its effective height can be always kept at a required gap height.