Abstract: In wire bonding a semiconductor chip to the lead frame or other substrate, increase of productivity is achieved by letting the capillary which guides the wire between the wiring points (4, 5) move faster along its trajectory in the two travel stages (s1, s2). The capillary's drives in the horizontal (x, y) and vertical (z) directions are programmed by presetting the speed (vH) of the horizontal component of the movement and then calculating the vertical speed (vV) as a dependent variable based on the given trajectory. In determining said horizontal speed (vH) to be preset, the maximum horizontal and/or vertical acceleration values (aH*, aV*) associated with the drive mechanism are taken into account. Further time can be saved by letting the horizontal travel begin during the first travel stage (s1) and, by simultaneous vertical and horizontal travel, producing a steady transition (point k') from the first stage (s1) to the second (s2).

Abstract: An ultraviolet-light sensitive photodiode device comprises a first semiconductor photodiode for producing a first current when illuminated by light and a second semiconductor photodiode for producing a second current when illuminated by light. The first and second photodiodes are electrically connected to produce a signal proportional to the difference between the first and second currents. The first and second photodiodes are substantially equal in sensitivity to visible and infrared light, while the first photodiode is more sensitive to ultraviolet light than the second photodiode. Thus, the photosensitive device resulting from connecting the two photodiodes has a spectrally narrow sensitivity to ultraviolet light.