Abstract: A bilayer thin film resistor and a method of fabricating such as resistor. A layer of a resistive material such as titanium tungsten is sputter deposited on a substrate before depositing a relatively thick overlayer of a material such as chromium silicon monoxide to form a bilayer resistor. Whereas the sheet resistance of a chromium silicon monoxide layer by itself would be relatively unpredictable and unreproducible, the sheet resistance and the uniformity of the bilayer can be accurately controlled by making small adjustments to the scan rate of the titanium tungsten to control the thickness of the underlayer. Optionally, the titanium tungsten underlayer can be sputter etched to increase to sheet resistance of the bilayer, and also to increase heat stability so as to decrease the drop in sheet resistance during subsequent thermal processing.