Patents by Inventor Ze Sheng Ye

Ze Sheng Ye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8179037
    Abstract: A high power LED module assembly may include at least one high power LED module each of which includes a MCPCB and a high power LED disposed on the MCPCB, a flex tube which includes a base engaging with each of the high power LED modules and a cover enclosing the base; wherein the high power LED module assembly further comprises at least one heat sink each of which is correspondingly connected to the bottom of each high power LED modules; and wherein the cover is engaged with the heat sink and encloses the base, the high power LED module and all other sides of the heat sink than the bottom side thereof which is exposed to ambient environment.
    Type: Grant
    Filed: December 31, 2009
    Date of Patent: May 15, 2012
    Assignee: Osram AG
    Inventors: Chi Man Chan, Xi Yuan He, Chin You Yue, Ze Sheng Ye
  • Patent number: 7994516
    Abstract: The present invention discloses an LED module comprising: a waterproof enclosure; an LED accommodated in the waterproof enclosure; a wire for coupling the LED module with other LED modules and a driver; and a radiating unit set in the bottom of the waterproof enclosure and exposed to the external environment. The invention further provides an LED chain comprising the above said LED module and a driver coupled with the LED module. The LED chain according to the invention may have a high waterproof level, for example, IP65. The heat generated during the operation of the high power LED module may be transmitted to the external environment in time via a heat sink set on the LED module, thereby effective thermal management for the LED module and a long service life of the LED module may be obtained. Moreover, the finish surface of the driver may be made handsome by encapsulating the driver through the low pressure molding.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: August 9, 2011
    Assignee: OSRAM Gesellschaft mit beschränkter Haftung
    Inventors: Chi Man Chan, Huajian Fan, Yu Bao He, Xi Yuan He, Ze Sheng Ye, Max Yue
  • Publication number: 20100171405
    Abstract: A high power LED module assembly may include at least one high power LED module each of which includes a MCPCB and a high power LED disposed on the MCPCB, a flex tube which includes a base engaging with each of the high power LED modules and a cover enclosing the base; wherein the high power LED module assembly further comprises at least one heat sink each of which is correspondingly connected to the bottom of each high power LED modules; and wherein the cover is engaged with the heat sink and encloses the base, the high power LED module and all other sides of the heat sink than the bottom side thereof which is exposed to ambient environment.
    Type: Application
    Filed: December 31, 2009
    Publication date: July 8, 2010
    Applicant: OSRAM GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG
    Inventors: Chi Man Chan, Xi Yuan He, Chin You Yue, Ze Sheng Ye
  • Publication number: 20090272986
    Abstract: The present invention discloses an LED module comprising: a waterproof enclosure; an LED accommodated in the waterproof enclosure; a wire for coupling the LED module with other LED modules and a driver; and a radiating unit set in the bottom of the waterproof enclosure and exposed to the external environment. The invention further provides an LED chain comprising the above said LED module and a driver coupled with the LED module. The LED chain according to the invention may have a high waterproof level, for example, IP65. The heat generated during the operation of the high power LED module may be transmitted to the external environment in time via a heat sink set on the LED module, thereby effective thermal management for the LED module and a long service life of the LED module may be obtained. Moreover, the finish surface of the driver may be made handsome by encapsulating the driver through the low pressure molding.
    Type: Application
    Filed: March 31, 2009
    Publication date: November 5, 2009
    Applicant: OSRAM Gesellschaft mit beschrankter Haftung
    Inventors: Chi Man Chan, Huajian Fan, Yu Bao He, Xi Yuan He, Ze Sheng Ye, Max Yue