Abstract: UV curable (meth)acrylate compositions incorporating a thiol-containing component show increased surface reaction conversions and thus have improved, dry to the touch surface cure properties.

Abstract: Adhesive compositions having optical clarity are disclosed. The compositions include saturated epoxy-functionalized compound; a heat cure system which includes an alicyclic anhydride and a cationic catalyst; a predominantly hydrophobic cross-linking (meth)acrylate in amounts sufficient to control the crosslinking density of the composition; and a photoinitiator to allow for initial fixturing of the composition prior to thermal cure. The compositions provide an optical transmittance of at least 95% and a yellowness (*b) of <1%.

Abstract: Provided are flux-compatible epoxy-phenol adhesive compositions useful as a low gap underfill and novel phenols useful therein. The flux-compatible epoxy-phenol adhesive compositions include an epoxy component including an epoxy compound having a cycloaliphatic, alicyclic or mixed cycloaliphatic-aromatic backbone, a multifunctional phenolic component, and a catalyst. The flux-compatible compositions are useful as an underfilling sealant which (1) rapidly fills the underfill space in a semiconductor device, such as a flip chip assembly, (2) enables the device to be securely connected to a circuit board by short-time heat curing and with good productivity, and (3) demonstrates excellent solder reflow resistance.

Abstract: Provided are flux-compatible epoxy-anhydride compositions useful as low-gap underfill adhesives. The flux-compatible epoxy-anhydride compositions include an epoxy component and an anhydride composition comprising a monofunctional anhydride and at least one difunctional anhydride and optionally at least one polyfunctional anhydride. The flux-compatible compositions are useful as an underfilling sealant which (1) rapidly fills the underfill space in a semiconductor device, such as a flip chip assembly, (2) enables the device to be securely connected to a circuit board by short-time heat curing and with good productivity, and (3) demonstrates excellent solder reflow resistance.

Abstract: Disclosed herein are methods of making an adhesive composition, the methods comprising providing a polyurethane acrylate and combining with a vinyl ether and co-curing the combination to form an adhesive composition, wherein after curing the adhesive composition has a modulus at ?20° C. of less than about 10.0 mPa and a creep recovery of greater than about 50%. Also disclosed are the resulting adhesive compositions.