Abstract: The present application provides a buffer structure, a display module, and a display device. The buffer structure includes a silicon-based pressure-sensitive adhesive layer, and the silicon-based pressure-sensitive adhesive layer is doped with graphene. Doping the graphene in the silicon-based pressure-sensitive adhesive layer allows thermal conductivity of the buffer structure to be effectively improved, and allows mechanical strength of the buffer structure to be enhanced, thereby improving buffer performance of the buffer structure and improving a film printing effect.

Abstract: Disclosed are a flexible display screen and a flexible display device. The flexible display screen includes a flexible display panel and a driver chip, the flexible display panel includes a support portion, a first heat insulation layer, a heat dissipation layer, and a second heat insulation layer which are arranged in sequence along a direction from back to a light-emitting surface, the support portion is provided with a recess, and the driver chip is received in the recess.

Abstract: Disclosed are a flexible display screen and a flexible display device. The flexible display screen includes a flexible display panel and a driver chip, the flexible display panel includes a support portion, a first heat insulation layer, a heat dissipation layer, and a second heat insulation layer which are arranged in sequence along a direction from back to a light-emitting surface, the support portion is provided with a recess, and the driver chip is received in the recess.

Abstract: A driver circuit carrier, a display panel, and a manufacturing method are provided. The driver circuit carrier includes a substrate, and a number of first pins arranged on at least one surface of the substrate. The first pins are arranged along a first reference line. An imaginary extending line of at least one of the first pins intersects with a second reference line perpendicular to the first reference line.

Abstract: Embodiments of the present disclosure provide a positioning structure and a flexible printed circuit. The positioning structure includes a flexible substrate having a positioning hole therein and a reinforcing layer disposed on the flexible substrate and located within a preset range around a periphery of the positioning hole to reinforce the positioning hole, and the reinforcing layer includes a first hole corresponding to the positioning hole. In the positioning structure according to the embodiments of the present disclosure, the strength of the positioning hole is improved and an undesirable deformation phenomenon of the positioning hole under action of external forces is prevented, by disposing the positioning hole on the flexible substrate and laying the reinforcing layer in the preset range around the periphery of the positioning hole.

Abstract: A driver circuit carrier, a display panel, and a manufacturing method are provided. The driver circuit carrier includes a substrate, and a number of first pins arranged on at least one surface of the substrate. The first pins are arranged along a first reference line. An imaginary extending line of at least one of the first pins intersects with a second reference line perpendicular to the first reference line.