Patents by Inventor Zhan Wu

Zhan Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250158886
    Abstract: Embodiments of this application provide a device configuration method. A first network device parses a plurality of configuration templates based on a YANG model to obtain an effective configuration template, where the plurality of configuration templates all meet a language specification of the YANG model, and the plurality of configuration templates have a template inheritance relationship and/or a template aggregation relationship; associates the effective configuration template with an obtained device configuration parameter; converts the effective configuration template associated with the device configuration parameters into a configuration packet; and delivers the configuration packet to a second network device, to enable the second network device to perform corresponding network configuration based on the configuration packet. Embodiments of this application further provide a network device, a chip, and a computer-readable storage medium.
    Type: Application
    Filed: January 17, 2025
    Publication date: May 15, 2025
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventor: Zhan WU
  • Patent number: 11477067
    Abstract: This application provides a data processing method and a related device, to keep data consistency between a management device and a forwarder in a multi-head management scenario. The method performed by a first management device in the plurality of management devices includes: sending a lock instruction to the forwarder; performing difference comparison between target data of the first management device and corresponding data that is on the forwarder and that corresponds to the target data to obtain a comparison result; and synchronizing the target data with the corresponding data if the first management device determines, by using the comparison result, that the target data and the corresponding data do not match, so that the target data matches the corresponding data.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: October 18, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventor: Zhan Wu
  • Publication number: 20210006452
    Abstract: This application provides a data processing method and a related device, to keep data consistency between a management device and a forwarder in a multi-head management scenario. The method performed by a first management device in the plurality of management devices includes: sending a lock instruction to the forwarder; performing difference comparison between target data of the first management device and corresponding data that is on the forwarder and that corresponds to the target data to obtain a comparison result; and synchronizing the target data with the corresponding data if the first management device determines, by using the comparison result, that the target data and the corresponding data do not match, so that the target data matches the corresponding data.
    Type: Application
    Filed: September 23, 2020
    Publication date: January 7, 2021
    Inventor: Zhan WU
  • Patent number: 9819532
    Abstract: A multi-service node management system includes: at least two service nodes, where each of the service node is disposed with a baseboard management controller (BMC); a module management controller (MMC), having one end configured to perform data communication with the BMC in each service node of the at least two service nodes, and the other end performing data communication with a shared module; and the shared module, on which sharing management is performed by BMCs in the service nodes through an MMC.
    Type: Grant
    Filed: August 24, 2012
    Date of Patent: November 14, 2017
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Jianjun Zhou, Zhan Wu, Lin Xiao
  • Publication number: 20120324088
    Abstract: A multi-service node management system includes: at least two service nodes, where each of the service node is disposed with a baseboard management controller (BMC); a module management controller (MMC), having one end configured to perform data communication with the BMC in each service node of the at least two service nodes, and the other end performing data communication with a shared module; and the shared module, on which sharing management is performed by BMCs in the service nodes through an MMC.
    Type: Application
    Filed: August 24, 2012
    Publication date: December 20, 2012
    Inventors: Jianjun Zhou, Zhan Wu, Lin Xiao
  • Publication number: 20120224313
    Abstract: A cabinet server system includes a cabinet and a subrack located in the cabinet; the subrack includes a backplane; the subrack is capable of housing a removable middle baffle plate; and the subrack is configured to insert a server device of a first width when no middle baffle plate is inserted, and insert a server device of a second width when a middle baffle plate is inserted, where the server device of the first width and the server device of the second width are inserted into the backplane of the subrack, and are connected to other devices through the backplane.
    Type: Application
    Filed: May 14, 2012
    Publication date: September 6, 2012
    Inventors: Hangkong HU, Zhan Wu, Zhenyu Zhuang, Wenfei Tang
  • Patent number: 7610950
    Abstract: A heat dissipation device includes a first base plate (10), a fin group (30) arranged on the first base plate, a first heat pipe (50) attached on the first base plate and the fin group and a second heat pipe (60) attached on the first base plate and extending across the fin group. Each of the first and second heat pipes includes an absorbing section and a dissipating section. The absorbing sections of the first and second heat pipes are L-shaped and oriented in opposite directions and dissipating sections of the first and second heat pipes are oriented perpendicular to each other, whereby heat from the first base plate attached with an electronic component can take more different dissipating-paths from the first base plate to the fin group.
    Type: Grant
    Filed: November 8, 2006
    Date of Patent: November 3, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jun Cao, Zhan Wu, Shi-Wen Zhou
  • Patent number: 7447025
    Abstract: A heat dissipation device (1) includes a heat sink (10), a fan (20), and an air cooling member (30). Airflow produced by the fan is led to the heat sink after passing through the air cooling member. The air cooling member can lower the temperature of the airflow below an average temperature of an atmosphere surrounding the heat dissipation device.
    Type: Grant
    Filed: November 1, 2005
    Date of Patent: November 4, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu
  • Patent number: 7409751
    Abstract: A clip includes a body having a first end and a second end. A connecting member extends through the first end of the body. A hook plate is attached to a bottom of the connecting member and an actuating member is pivotally coupled to an upper end of the connecting member. The actuating member is pivotable relative to the hook plate in a first direction so that the actuating member is turnable relative to the hook plate between a locked position and an unlocked position. Furthermore, the actuating member is turnable about an axis of the connecting member in a second direction different from the first direction.
    Type: Grant
    Filed: July 13, 2006
    Date of Patent: August 12, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu
  • Patent number: 7397663
    Abstract: A clip includes a body, an actuating member, a first hook plate and a second hook plate. The body includes a supporting portion and a pair of spaced arms extending from opposite sides of the supporting portion. The actuating member includes a cam supported on the supporting portion. The first hook plate is detachably coupled to a distal end of the arms of the body. The second hook plate extends through the supporting portion and is pivotally coupled to the cam of the actuating member. The actuating member is turnable relative to the second hook plate between a locked position and an unlocked position.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: July 8, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhou, Guo Chen, Zhan Wu
  • Patent number: 7382047
    Abstract: A heat dissipation device (1) includes a heat sink (10), a fan (20), and a cooling member (30). The heat sink includes a base, a plurality of fins extending from the base and at least one heat pipe thermally connecting the base and the fins. The cooling member is provided with a fin assembly thereon and includes a cold surface attached to one side of the fins and a condensing portion of the at least one heat pipe to make the one side of the fins and the condensing portion have a lower temperature.
    Type: Grant
    Filed: December 27, 2005
    Date of Patent: June 3, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu
  • Publication number: 20080105411
    Abstract: A heat dissipation device includes a first base plate (10), a fin group (30) arranged on the first base plate, a first heat pipe (50) attached on the first base plate and the fin group and a second heat pipe (60) attached on the first base plate and extending across the fin group. Each of the first and second heat pipes includes an absorbing section and a dissipating section. The absorbing sections of the first and second heat pipes are L-shaped and oriented in opposite directions and dissipating sections of the first and second heat pipes are oriented perpendicular to each other, whereby heat from the first base plate attached with an electronic component can take more different dissipating-paths from the first base plate to the fin group.
    Type: Application
    Filed: November 8, 2006
    Publication date: May 8, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Jun Cao, Zhan Wu, Shi-Wen Zhou
  • Patent number: 7342795
    Abstract: A heat sink assembly includes a heat spreader (10), a plurality of fins (12) extending from the spreader, fasteners (20) and securement sleeves (30) fixed to the fasteners. The fastener includes a head (200) and a shaft (204) having a threaded bottom end (208). The sleeve comprises a cylindrical wall (302), an upper open end (304) and a lower open end (306). The sleeve further has an annular pedestal (308) perpendicularly connected with the wall and extending in the lower open end. The head is received in the wall and contacts the pedestal. The shaft extends through the spreader. A compressed spring (22) is providing between the head and the spreader for urging the spreader downwardly to engage with a heat generating electronic device.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: March 11, 2008
    Assignees: Fu zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu
  • Publication number: 20080050196
    Abstract: A fastener assembly for securing a heat dissipation device to a CPU mounted on a printed circuit board, includes a sleeve, a bolt, and a coil spring. The sleeve includes a hollow body, a top head and a pair of lower resilient flat extensions. The resilient flat extension has a barb projecting outwards therefrom and is deformable radially. The bolt includes a shaft, a joining part at an end thereof and a threaded part formed at an opposite end thereof. The shaft is received in the hollow body of the sleeve with the joining part fastened to the hollow body, whilst the threaded part projects out of the hollow body. The coil spring surrounds the sleeve and is held between the head of the sleeve and the barbs of the sleeve; the coil spring is deformable axially along a length of the sleeve.
    Type: Application
    Filed: December 27, 2006
    Publication date: February 28, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: JUN CAO, ZHAN WU, SHI-WEN ZHOU, CHUN-CHI CHEN
  • Patent number: 7331379
    Abstract: A heat dissipation device includes a fin set, a sinuous heat pipe transferring heat to different parts of the fin set, and a base thermally contacting the heat pipe. The heat pipe has a middle U-shaped portion and two L-shaped portions at two sides of the U-shaped portion, respectively. The base is for contacting with a heat generating electronic device and transferring heat from the electronic device to the heat pipe and the fin set. The fin set defines a passageway in a middle of thereof. The U-shaped portion of the heat pipe is received in the passageway of the fin set and thermally engages with the fin set.
    Type: Grant
    Filed: November 23, 2005
    Date of Patent: February 19, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu
  • Publication number: 20080024986
    Abstract: A clip includes a body, an actuating member, a first hook plate and a second hook plate. The body includes a supporting portion and a pair of spaced arms extending from opposite sides of the supporting portion. The actuating member includes a cam supported on the supporting portion. The first hook plate is detachably coupled to a distal end of the arms of the body. The second hook plate extends through the supporting portion and is pivotally coupled to the cam of the actuating member. The actuating member is turnable relative to the second hook plate between a locked position and an unlocked position.
    Type: Application
    Filed: July 28, 2006
    Publication date: January 31, 2008
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhou, Guo Chen, Zhan Wu
  • Publication number: 20080010788
    Abstract: A clip includes a body having a first end and a second end. A connecting member extends through the first end of the body. A hook plate is attached to a bottom of the connecting member and an actuating member is pivotally coupled to an upper end of the connecting member. The actuating member is pivotable relative to the hook plate in a first direction so that the actuating member is turnable relative to the hook plate between a locked position and an unlocked position. Furthermore, the actuating member is turnable about an axis of the connecting member in a second direction different from the first direction.
    Type: Application
    Filed: July 13, 2006
    Publication date: January 17, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHUN-CHI CHEN, Shi-Wen Zhou, Zhan Wu
  • Patent number: 7312994
    Abstract: A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.
    Type: Grant
    Filed: October 6, 2005
    Date of Patent: December 25, 2007
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu, Bing-Wen Zhou, Hong-Wei Du
  • Publication number: 20070247820
    Abstract: A memory module assembly includes a memory card having a circuit board and a plurality of electronic components mounted on the circuit board. A pair of shells sandwich the memory card therebetween. A first pair of clips sandwich the memory card and the pair of shells therebetween. A fastener extends through the first pair of clips, the pair of shells and the circuit board and holds the first pair of clips toward each other. The first pair of clips each has a pressing portion pressing a corresponding shell of the pair of shells toward the memory card. A second pair of clips each clamps the pair of shells toward the memory card. Thermal tapes thermally connect the electronic components and the shells.
    Type: Application
    Filed: April 24, 2006
    Publication date: October 25, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHUN-CHI CHEN, SHI-WEN ZHOU, ZHAN WU
  • Patent number: D555109
    Type: Grant
    Filed: August 17, 2005
    Date of Patent: November 13, 2007
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu