Patents by Inventor Zhan Wu
Zhan Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250158886Abstract: Embodiments of this application provide a device configuration method. A first network device parses a plurality of configuration templates based on a YANG model to obtain an effective configuration template, where the plurality of configuration templates all meet a language specification of the YANG model, and the plurality of configuration templates have a template inheritance relationship and/or a template aggregation relationship; associates the effective configuration template with an obtained device configuration parameter; converts the effective configuration template associated with the device configuration parameters into a configuration packet; and delivers the configuration packet to a second network device, to enable the second network device to perform corresponding network configuration based on the configuration packet. Embodiments of this application further provide a network device, a chip, and a computer-readable storage medium.Type: ApplicationFiled: January 17, 2025Publication date: May 15, 2025Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventor: Zhan WU
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Patent number: 11477067Abstract: This application provides a data processing method and a related device, to keep data consistency between a management device and a forwarder in a multi-head management scenario. The method performed by a first management device in the plurality of management devices includes: sending a lock instruction to the forwarder; performing difference comparison between target data of the first management device and corresponding data that is on the forwarder and that corresponds to the target data to obtain a comparison result; and synchronizing the target data with the corresponding data if the first management device determines, by using the comparison result, that the target data and the corresponding data do not match, so that the target data matches the corresponding data.Type: GrantFiled: September 23, 2020Date of Patent: October 18, 2022Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventor: Zhan Wu
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Publication number: 20210006452Abstract: This application provides a data processing method and a related device, to keep data consistency between a management device and a forwarder in a multi-head management scenario. The method performed by a first management device in the plurality of management devices includes: sending a lock instruction to the forwarder; performing difference comparison between target data of the first management device and corresponding data that is on the forwarder and that corresponds to the target data to obtain a comparison result; and synchronizing the target data with the corresponding data if the first management device determines, by using the comparison result, that the target data and the corresponding data do not match, so that the target data matches the corresponding data.Type: ApplicationFiled: September 23, 2020Publication date: January 7, 2021Inventor: Zhan WU
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Patent number: 9819532Abstract: A multi-service node management system includes: at least two service nodes, where each of the service node is disposed with a baseboard management controller (BMC); a module management controller (MMC), having one end configured to perform data communication with the BMC in each service node of the at least two service nodes, and the other end performing data communication with a shared module; and the shared module, on which sharing management is performed by BMCs in the service nodes through an MMC.Type: GrantFiled: August 24, 2012Date of Patent: November 14, 2017Assignee: Huawei Technologies Co., Ltd.Inventors: Jianjun Zhou, Zhan Wu, Lin Xiao
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Publication number: 20120324088Abstract: A multi-service node management system includes: at least two service nodes, where each of the service node is disposed with a baseboard management controller (BMC); a module management controller (MMC), having one end configured to perform data communication with the BMC in each service node of the at least two service nodes, and the other end performing data communication with a shared module; and the shared module, on which sharing management is performed by BMCs in the service nodes through an MMC.Type: ApplicationFiled: August 24, 2012Publication date: December 20, 2012Inventors: Jianjun Zhou, Zhan Wu, Lin Xiao
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Publication number: 20120224313Abstract: A cabinet server system includes a cabinet and a subrack located in the cabinet; the subrack includes a backplane; the subrack is capable of housing a removable middle baffle plate; and the subrack is configured to insert a server device of a first width when no middle baffle plate is inserted, and insert a server device of a second width when a middle baffle plate is inserted, where the server device of the first width and the server device of the second width are inserted into the backplane of the subrack, and are connected to other devices through the backplane.Type: ApplicationFiled: May 14, 2012Publication date: September 6, 2012Inventors: Hangkong HU, Zhan Wu, Zhenyu Zhuang, Wenfei Tang
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Patent number: 7610950Abstract: A heat dissipation device includes a first base plate (10), a fin group (30) arranged on the first base plate, a first heat pipe (50) attached on the first base plate and the fin group and a second heat pipe (60) attached on the first base plate and extending across the fin group. Each of the first and second heat pipes includes an absorbing section and a dissipating section. The absorbing sections of the first and second heat pipes are L-shaped and oriented in opposite directions and dissipating sections of the first and second heat pipes are oriented perpendicular to each other, whereby heat from the first base plate attached with an electronic component can take more different dissipating-paths from the first base plate to the fin group.Type: GrantFiled: November 8, 2006Date of Patent: November 3, 2009Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Jun Cao, Zhan Wu, Shi-Wen Zhou
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Patent number: 7447025Abstract: A heat dissipation device (1) includes a heat sink (10), a fan (20), and an air cooling member (30). Airflow produced by the fan is led to the heat sink after passing through the air cooling member. The air cooling member can lower the temperature of the airflow below an average temperature of an atmosphere surrounding the heat dissipation device.Type: GrantFiled: November 1, 2005Date of Patent: November 4, 2008Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu
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Patent number: 7409751Abstract: A clip includes a body having a first end and a second end. A connecting member extends through the first end of the body. A hook plate is attached to a bottom of the connecting member and an actuating member is pivotally coupled to an upper end of the connecting member. The actuating member is pivotable relative to the hook plate in a first direction so that the actuating member is turnable relative to the hook plate between a locked position and an unlocked position. Furthermore, the actuating member is turnable about an axis of the connecting member in a second direction different from the first direction.Type: GrantFiled: July 13, 2006Date of Patent: August 12, 2008Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu
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Patent number: 7397663Abstract: A clip includes a body, an actuating member, a first hook plate and a second hook plate. The body includes a supporting portion and a pair of spaced arms extending from opposite sides of the supporting portion. The actuating member includes a cam supported on the supporting portion. The first hook plate is detachably coupled to a distal end of the arms of the body. The second hook plate extends through the supporting portion and is pivotally coupled to the cam of the actuating member. The actuating member is turnable relative to the second hook plate between a locked position and an unlocked position.Type: GrantFiled: July 28, 2006Date of Patent: July 8, 2008Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Chun-Chi Chen, Shi-Wen Zhou, Guo Chen, Zhan Wu
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Patent number: 7382047Abstract: A heat dissipation device (1) includes a heat sink (10), a fan (20), and a cooling member (30). The heat sink includes a base, a plurality of fins extending from the base and at least one heat pipe thermally connecting the base and the fins. The cooling member is provided with a fin assembly thereon and includes a cold surface attached to one side of the fins and a condensing portion of the at least one heat pipe to make the one side of the fins and the condensing portion have a lower temperature.Type: GrantFiled: December 27, 2005Date of Patent: June 3, 2008Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu
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Publication number: 20080105411Abstract: A heat dissipation device includes a first base plate (10), a fin group (30) arranged on the first base plate, a first heat pipe (50) attached on the first base plate and the fin group and a second heat pipe (60) attached on the first base plate and extending across the fin group. Each of the first and second heat pipes includes an absorbing section and a dissipating section. The absorbing sections of the first and second heat pipes are L-shaped and oriented in opposite directions and dissipating sections of the first and second heat pipes are oriented perpendicular to each other, whereby heat from the first base plate attached with an electronic component can take more different dissipating-paths from the first base plate to the fin group.Type: ApplicationFiled: November 8, 2006Publication date: May 8, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: Jun Cao, Zhan Wu, Shi-Wen Zhou
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Patent number: 7342795Abstract: A heat sink assembly includes a heat spreader (10), a plurality of fins (12) extending from the spreader, fasteners (20) and securement sleeves (30) fixed to the fasteners. The fastener includes a head (200) and a shaft (204) having a threaded bottom end (208). The sleeve comprises a cylindrical wall (302), an upper open end (304) and a lower open end (306). The sleeve further has an annular pedestal (308) perpendicularly connected with the wall and extending in the lower open end. The head is received in the wall and contacts the pedestal. The shaft extends through the spreader. A compressed spring (22) is providing between the head and the spreader for urging the spreader downwardly to engage with a heat generating electronic device.Type: GrantFiled: October 5, 2005Date of Patent: March 11, 2008Assignees: Fu zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu
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Publication number: 20080050196Abstract: A fastener assembly for securing a heat dissipation device to a CPU mounted on a printed circuit board, includes a sleeve, a bolt, and a coil spring. The sleeve includes a hollow body, a top head and a pair of lower resilient flat extensions. The resilient flat extension has a barb projecting outwards therefrom and is deformable radially. The bolt includes a shaft, a joining part at an end thereof and a threaded part formed at an opposite end thereof. The shaft is received in the hollow body of the sleeve with the joining part fastened to the hollow body, whilst the threaded part projects out of the hollow body. The coil spring surrounds the sleeve and is held between the head of the sleeve and the barbs of the sleeve; the coil spring is deformable axially along a length of the sleeve.Type: ApplicationFiled: December 27, 2006Publication date: February 28, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: JUN CAO, ZHAN WU, SHI-WEN ZHOU, CHUN-CHI CHEN
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Patent number: 7331379Abstract: A heat dissipation device includes a fin set, a sinuous heat pipe transferring heat to different parts of the fin set, and a base thermally contacting the heat pipe. The heat pipe has a middle U-shaped portion and two L-shaped portions at two sides of the U-shaped portion, respectively. The base is for contacting with a heat generating electronic device and transferring heat from the electronic device to the heat pipe and the fin set. The fin set defines a passageway in a middle of thereof. The U-shaped portion of the heat pipe is received in the passageway of the fin set and thermally engages with the fin set.Type: GrantFiled: November 23, 2005Date of Patent: February 19, 2008Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu
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Publication number: 20080024986Abstract: A clip includes a body, an actuating member, a first hook plate and a second hook plate. The body includes a supporting portion and a pair of spaced arms extending from opposite sides of the supporting portion. The actuating member includes a cam supported on the supporting portion. The first hook plate is detachably coupled to a distal end of the arms of the body. The second hook plate extends through the supporting portion and is pivotally coupled to the cam of the actuating member. The actuating member is turnable relative to the second hook plate between a locked position and an unlocked position.Type: ApplicationFiled: July 28, 2006Publication date: January 31, 2008Applicant: Foxconn Technology Co., Ltd.Inventors: Chun-Chi Chen, Shi-Wen Zhou, Guo Chen, Zhan Wu
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Publication number: 20080010788Abstract: A clip includes a body having a first end and a second end. A connecting member extends through the first end of the body. A hook plate is attached to a bottom of the connecting member and an actuating member is pivotally coupled to an upper end of the connecting member. The actuating member is pivotable relative to the hook plate in a first direction so that the actuating member is turnable relative to the hook plate between a locked position and an unlocked position. Furthermore, the actuating member is turnable about an axis of the connecting member in a second direction different from the first direction.Type: ApplicationFiled: July 13, 2006Publication date: January 17, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHUN-CHI CHEN, Shi-Wen Zhou, Zhan Wu
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Patent number: 7312994Abstract: A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.Type: GrantFiled: October 6, 2005Date of Patent: December 25, 2007Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu, Bing-Wen Zhou, Hong-Wei Du
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Publication number: 20070247820Abstract: A memory module assembly includes a memory card having a circuit board and a plurality of electronic components mounted on the circuit board. A pair of shells sandwich the memory card therebetween. A first pair of clips sandwich the memory card and the pair of shells therebetween. A fastener extends through the first pair of clips, the pair of shells and the circuit board and holds the first pair of clips toward each other. The first pair of clips each has a pressing portion pressing a corresponding shell of the pair of shells toward the memory card. A second pair of clips each clamps the pair of shells toward the memory card. Thermal tapes thermally connect the electronic components and the shells.Type: ApplicationFiled: April 24, 2006Publication date: October 25, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHUN-CHI CHEN, SHI-WEN ZHOU, ZHAN WU
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Patent number: D555109Type: GrantFiled: August 17, 2005Date of Patent: November 13, 2007Assignee: Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu