Patents by Inventor Zhang PAN

Zhang PAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128956
    Abstract: An integrated circuit includes an input circuit coupled to a first voltage supply, and configured to receive a first input signal, and to generate at least a second or a third input signal, and a level shifter circuit coupled to the input circuit and a second voltage supply, and configured to receive a first enable signal, the second or third input signal, and to generate a first signal responsive to the first enable signal, the second or third input signal. The input circuit includes a first set of transistors having a first threshold voltage. The first set of transistors includes a first set of active regions extending in a first direction. The level shifter circuit includes a second set of transistors having a second threshold voltage. The second set of transistors includes a second set of active regions extending in the first direction.
    Type: Application
    Filed: December 12, 2023
    Publication date: April 18, 2024
    Inventors: Jing DING, Zhang-Ying YAN, Qingchao MENG, Lei PAN
  • Publication number: 20240086264
    Abstract: In one embodiment, a vehicle operating system (VOS) that can be partially ported to different types of microcontroller units (MCUs) includes at least one multiprocessor unit (MPU) with an operating system kernel running thereon, and at least one microcontroller unit (MCU) with multiple cores. Each core includes a set of unified application programming interfaces (APIs) for loading one or more MCU drivers corresponding to a type of the MCU, and one or more I/O drivers corresponding to a type of each of the one or more I/O devices associated with the MCU. The set of unified APIs includes at least one API for each service, and can vertically integrate a device path for the service from a hardware layer of the core to the service layer of the core. The VOS further includes multiple pairs of hardware-protected memories associated with each core to enable interprocess communication between the cores.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 14, 2024
    Inventors: Haofeng KOU, Davy HUANG, Manjiang ZHANG, Helen K. PAN
  • Publication number: 20240086238
    Abstract: A multiprocessor unit (MPU) in an autonomous driving vehicle (ADV) can provide hard real-time performance. In an embodiment, the MPU can include a hypervisor used to virtualize multiple cores of the MPU, which can further be partitioned into two sets of cores that are isolated from each other. The first set of cores are designated to run real-time related services as trusted applications directly on the hypervisor, and the real-time related services are given higher priority than kernel-level threads on the first set of cores. The second set of cores are designated to run a kernel of an operating system (e.g., Linux). Further, the kernel is patched using a hard real-time open source package to achieve hard real-time performance. An open source package can be used for interprocess communication (IPC) between different electronic control units (ECU) in the ADV.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 14, 2024
    Inventors: Haofeng KOU, Davy HUANG, Manjiang ZHANG, Helen K. PAN
  • Patent number: 11189492
    Abstract: A semiconductor structure and its fabrication method are provided in the present disclosure. The method includes providing a base substrate, forming a plurality of discrete core layers on the base substrate, forming an isolation layer on a top surface of a core layer, forming a sacrificial layer on the base substrate and exposing a top surface of the isolation layer, removing the isolation layer after forming the sacrificial layer, removing the sacrificial layer after removing the isolation layer, forming a mask layer on a sidewall surface of the core layer after removing the sacrificial layer, and removing the core layer after forming the mask layer.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: November 30, 2021
    Assignees: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventors: Zhang Pan, Ting Zhang
  • Publication number: 20210325351
    Abstract: The present invention discloses a chromatographic analysis device based on a multifunctional integrated probe, and a use method of the chromatographic analysis device. The chromatographic analysis device integrates chromatographic sampling, sample injection and separation functions into the integrated probe. Meanwhile, the present invention further discloses a method for performing microsample analysis by the chromatographic analysis device based on the multifunctional integrated probe. The present invention has the main advantages as follows: the device is high in integration level, small in dead volume, simple in structure, convenient to use and particularly suitable for microsample analysis with a small sample amount, provides a new chromatographic sample injection mode for chromatographic analysis, and provides an ideal platform for chromatographic analysis and on-site chromatographic analysis of a trace amount of samples.
    Type: Application
    Filed: December 2, 2019
    Publication date: October 21, 2021
    Inventors: Qun FANG, Di Qiong JIN, Jian Zhang PAN, Guan Sheng DU
  • Publication number: 20210224234
    Abstract: The present application relates to a method for evaluating an operation of a distribution network based on data capture and Spark. The method includes: acquiring a packet from a terminal, and mirroring the packet through a mirroring port of a switch to acquire a mirror packet of the packet; analyzing the mirror packet, acquiring a 101/104 protocol packet, and storing the 101/104 protocol packet into an HDFS; acquiring the 101/104 protocol packet from the HDFS, parsing the 101/104 protocol packet on a Spark platform to acquire a parameter in the 101/104 protocol packet, and analyzing and processing the parameter to obtain a key indicator for evaluating the operation of the distribution network; and displaying the key indicator through a web page.
    Type: Application
    Filed: December 16, 2019
    Publication date: July 22, 2021
    Inventors: ZHANG Pan, Menghan WU, Ning JIANG, Xudong WANG, Guodong LI, Yi DING, Yan QI, Yanxin SHI, Xuejun SHANG, Wei FAN, Ning KANG, Zhijun ZHANG, Jie ZHANG, Tao LI
  • Publication number: 20210098256
    Abstract: A semiconductor structure and its fabrication method are provided in the present disclosure. The method includes providing a base substrate, forming a plurality of discrete core layers on the base substrate, forming an isolation layer on a top surface of a core layer, forming a sacrificial layer on the base substrate and exposing a top surface of the isolation layer, removing the isolation layer after forming the sacrificial layer, removing the sacrificial layer after removing the isolation layer, forming a mask layer on a sidewall surface of the core layer after removing the sacrificial layer, and removing the core layer after forming the mask layer.
    Type: Application
    Filed: September 18, 2020
    Publication date: April 1, 2021
    Inventors: Zhang PAN, Ting ZHANG