Abstract: The present application provides a semiconductor device and a manufacturing method thereof and a memory system. The manufacturing method of the semiconductor device includes: forming a dielectric layer on a stack layer, wherein memory channel structures penetrating through the stack layer along a first direction are disposed in the stack layer, and the first direction is parallel to a stacking direction of the stack layer; forming a plurality of openings penetrating through the dielectric layer along the first direction, with the rest of the dielectric layer forming top selective gate cut lines, wherein the plurality of openings are arranged as being spaced apart along a second direction, one of the top selective gate cut lines is located between two adjacent ones of the openings in the second direction, and the first direction intersects the second direction; and forming a top selective gate layer in the plurality of openings.

Abstract: Memory device, memory system and formation method are provided. The method includes forming a sacrificial layer over a dielectric-pair stack, the sacrificial layer containing a top selective gate (TSG) cut structure over the dielectric-pair stack; forming a channel plug structure including a lower plug portion in the dielectric-pair stack and an upper plug portion through the sacrificial layer; forming a barrier layer at least enveloping the upper plug portion of the channel plug structure after a removal of the sacrificial layer; and forming a semiconductor layer over the dielectric-pair stack to embed the TSG cut structure, the barrier layer, and the upper plug portion of the channel plug structure.

Abstract: Memory device, memory system, and formation method are provided. The formation method includes providing a dielectric-pair stack containing a channel layer extending there-through, and forming a sacrificial layer in the dielectric-pair stack and in contact with the channel layer; forming a semiconductor layer over the dielectric-pair stack, the semiconductor layer containing a top selective gate (TSG) cut structure; forming a trench through the semiconductor layer to expose the sacrificial layer; forming a barrier layer on sidewalls of the semiconductor layer exposed by the trench; forming a recess by removing the sacrificial layer; and forming a channel plug structure in the trench and the recess.

Abstract: Three-dimensional (3D) memory devices and methods for forming the same are disclosed. In certain aspects, a 3D memory device includes a first semiconductor structure including alternating first dielectric layers and first conductive layers, an array common source (ACS) film over the first semiconductor structure, a second semiconductor structure over the ACS film, and a channel structure extending in the first semiconductor structure, the ACS film, and the second semiconductor structure in a first direction. The second semiconductor structure includes alternating second dielectric layers and second conductive layers. The channel structure is electrically connected to the ACS film.

Abstract: A multimedia browsing method and apparatus, a device, and a medium. The method comprises: receiving a caption browsing request of target multimedia; acquiring at least two multimedia segments of the target multimedia and caption segments corresponding to the multimedia segments, wherein the multimedia segments correspond to at least one caption segment; and displaying the multimedia segments in a first display area in a content display interface, and displaying, in a second display area, the caption segment corresponding to the multimedia segments. The method can implement that a plurality of multimedia segments of multimedia and a plurality of corresponding caption segments are completely displayed in different display areas, respectively, so that a user can quickly browse the caption content of the multimedia in the scenario where multimedia playback is not convenient, thereby satisfying the reading requirements of the user on the multimedia content in a special scenario.