Abstract: An antenna module includes a first antenna layer, including at least one main radiation unit including at least two main radiation patches symmetrically arranged and spaced apart from each other and at least one feeder portion located at or corresponds to a gap between adjacent two of the main radiation patches; a second antenna layer, stacked with the first antenna layer and including a reference ground arranged opposite to the main radiation patches and at least one microstrip insulated from the reference ground; at least one first electrically conductive member, electrically connected to the main radiation patches and the reference ground; and at least one second electrically conductive member, with an end being electrically connected to the feeder portion and another end being electrically connected to another end of the microstrip. An end of the microstrip is electrically connected to a radio frequency transceiver chip.

Abstract: An RF antenna includes a first substrate having a first top surface and a first bottom surface and a second substrate having a second top surface and a second bottom surface, wherein the first substrate is disposed on top of the second substrate, the second bottom surface including a ground plane disposed thereon. The RF antenna further includes a low-band (LB) radiation element disposed on the first top surface of the first substrate. The LB radiation element is to resonate within a first frequency band to transmit and receive RF signals associated with the first frequency band. The RF antenna further includes multiple high-band (HB) radiation elements disposed between the first bottom surface of the first substrate and the second top surface of the second substrate. Each HB radiation element is to resonate within a second frequency band to transmit and receive RF signals associated with the second frequency band.

Abstract: A new antenna array of the invention which has simple structure, small volume and can adopt a variety of realization forms, it can be easily integrated in the PCB of the mobile terminal using surface mount technology (SMT) or multi-layer PCB integration and other forms of technology. The antenna array is compact and can be configured with different number of antenna elements to meet the gain requirements. The antenna array is small in size and has a wide antenna bandwidth that can cover multiple 5G millimeter-wave bands while maintaining a directional high antenna gain and a stable radiation pattern. The antenna array can satisfy the millimeter-wave 5G communication requirements such as high gain, beam forming characteristics, beam scanning characteristics, and can be easily integrated into a portable mobile terminal.

Abstract: A novel antenna element includes a PCB, a radiating element disposed on the surface of the PCB, and a feed structure. The radiating element is constituted by a magnetic dipole and an electric dipole. The magnetic dipole comprises a first magnetic dipole conductive part disposed on the first surface, a second magnetic dipole conductive part disposed on the second surface, and a first metal via array which penetrates the PCB and is connected with edges of the first and second magnetic dipole conductive parts. The electric dipole is constituted by a first electric dipole conductive part which is connected with the first magnetic dipole conductive part and a second electric dipole conductive part which is connected with the second magnetic dipole conductive part. The feed structure is connected with the first magnetic dipole conductive part and the magnetic dipole extends to the ground.

Abstract: An RF antenna includes a first substrate having a first top surface and a first bottom surface and a second substrate having a second top surface and a second bottom surface, wherein the first substrate is disposed on top of the second substrate, the second bottom surface including a ground plane disposed thereon. The RF antenna further includes a low-band (LB) radiation element disposed on the first top surface of the first substrate. The LB radiation element is to resonate within a first frequency band to transmit and receive RF signals associated with the first frequency band. The RF antenna further includes multiple high-band (HB) radiation elements disposed between the first bottom surface of the first substrate and the second top surface of the second substrate. Each HB radiation element is to resonate within a second frequency band to transmit and receive RF signals associated with the second frequency band.

Abstract: A new antenna array of the invention which has simple structure, small volume and can adopt a variety of realization forms, it can be easily integrated in the PCB of the mobile terminal using surface mount technology (SMT) or multi-layer PCB integration and other forms of technology. The antenna array is compact and can be configured with different number of antenna elements to meet the gain requirements. The antenna array is small in size and has a wide antenna bandwidth that can cover multiple 5G millimeter-wave bands while maintaining a directional high antenna gain and a stable radiation pattern. The antenna array can satisfy the millimeter-wave 5G communication requirements such as high gain, beam forming characteristics, beam scanning characteristics, and can be easily integrated into a portable mobile terminal.

Abstract: A novel antenna element includes a PCB, a radiating element disposed on the surface of the PCB, and a feed structure. The radiating element is constituted by a magnetic dipole and an electric dipole. The magnetic dipole comprises a first magnetic dipole conductive part disposed on the first surface, a second magnetic dipole conductive part disposed on the second surface, and a first metal via array which penetrates the PCB and is connected with edges of the first and second magnetic dipole conductive parts. The electric dipole is constituted by a first electric dipole conductive part which is connected with the first magnetic dipole conductive part and a second electric dipole conductive part which is connected with the second magnetic dipole conductive part. The feed structure is connected with the first magnetic dipole conductive part and the magnetic dipole extends to the ground.