Abstract: In one embodiment, a computer system creates a first template VM that includes a first OS VMDK and a first software binary VMDK, and clones the first template VM to create a linked clone VM. The linked clone VM executes a guest OS by accessing the first OS VMDK and a software application by accessing the first software binary VMDK. The computer system further creates a second template VM that includes a second software binary VMDK, where the second software binary VMDK includes one or more upgrades to the software application that are not included in the first software binary VMDK. The computer system then detaches the first software binary VMDK from the linked clone VM and attaches the second software binary VMDK to the linked clone VM. The linked clone VM thereafter executes the software application by accessing the second software binary VMDK.

Abstract: A lighting assembly that includes an outer housing defining an outer housing axis, an inner housing defining an inner housing axis and a light member positioned in the inner housing. The outer housing includes a front surface having a front opening and an inner surface that defines an adjustment cavity having a truncated spherical shape. The inner housing has a truncated spherical shape and is at least partially received within the adjustment cavity. The inner housing defines a light recess therein and includes a front cover having an aperture defined therein. The front cover at least partially defines the light recess. The light member defines a light axis. The light axis and the inner housing axis are not co-axial and not parallel and form an angle therebetween. The inner housing is adjustable between a home position and a plurality of adjustment positions.

Abstract: A rubstrip for protecting an exposed surface, such as a surface in the interior of an aircraft. The rubstrip is configured to house a light source within its interior. In some embodiments, an exterior of the rubstrip is formed with at least one passageway configured to emit light from the light source. The rubstrip is configured both to protect the surface from damage and to protect the housed light source from damage.

Abstract: The disclosure relates to an audio playing method adapted for an electronic device. The audio playing method includes (a) providing the electronic device, the electronic device comprising a processor, an audio playing program executed by the processor, and a storage system comprising a playlist comprising a plurality of audio files; (b) invoking and running the audio playing program; (c) accessing the playlist and selecting an audio file; (d) determining if the audio file selected has been previously selected as a prompt signal of the electronic device; (e) accessing another audio file in the playlist if the audio file has been previously selected as a prompt signal; and (f) playing the audio file if the audio file has not been previously selected as a prompt signal.

Abstract: A buffer apparatus and a thin film deposition system are provided. The buffer apparatus is connected between a liquid material supply apparatus and a deposition machine. The buffer apparatus includes a container and a baffle. The container is used for containing a liquid material supplied from the liquid material supply apparatus. The top of the container has an input hole and an output hole. The baffle is disposed in the container and located under the input hole.

Abstract: A method for conversion treating a surface of a magnesium alloy workpiece includes the steps of degreasing, acid pickling, alkali pickling, and chemical converting. A phosphating solution is used in the step of chemical converting and includes the following solution concentrations: 2.89 gram/liter to 8.67 gram/liter of phosphoric acid, 0.3 gram/liter to 1.0 gram/liter of carbamide, 0.39 gram/liter to 1.56 gram/liter of nitric acid, 6 gram/liter to 30 gram/liter of manganese dihydrogen phosphate, and 0.2 gram/liter to 0.6 gram/liter of tannin.

Abstract: A method for conversion treating a surface of a magnesium alloy workpiece includes the steps of degreasing, acid pickling, alkali pickling, and chemical converting. A phosphating solution is used in the step of chemical converting and includes the following solution concentrations: 2.89 gram/liter to 8.67 gram/liter of phosphoric acid, 0.3 gram/liter to 1.0 gram/liter of carbamide, 0.39 gram/liter to 1.56 gram/liter of nitric acid, 6 gram/liter to 30 gram/liter of manganese dihydrogen phosphate, and 0.2 gram/liter to 0.6 gram/liter of tannin.

Abstract: An exemplary phosphating solution is used for conversion treating a surface of a magnesium alloy workpiece. The phosphating solution includes: 2.89 gram/liter to 8.67 gram/liter of phosphoric acid, 0.3 gram/liter to 1.0 gram/liter of carbamide, 0.39 gram/liter to 1.56 gram/liter of nitric acid, 6 gram/liter to 30 gram/liter of manganese dihydrogen phosphate, and 0.2 gram/liter to 0.6 gram/liter of tannin. A method for conversion treating a surface of a magnesium alloy workpiece is also provided.

Abstract: A heat dissipation device for dissipating heat from a heat-generating device includes a heat-absorbing plate, a heat pipe assembly attached to the heat-absorbing plate and a fin set attached to the heat pipe assembly. The fin set includes a plurality of fins and has a contacting surface cooperatively formed by bottom edges of the fins and attached to the heat pipe assembly. The heat pipe assembly includes heat pipes with evaporating sections and condensing sections located away from the evaporating sections. The evaporating sections of the heat pipes are covered by the heat-absorbing plate and the condensing sections of the heat pipes are exposed outside of the heat-absorbing plate. The heat pipes absorb heat from the heat-generating device via the heat-absorbing plate, and directly transfer the heat to the fin set.

Abstract: A buffer apparatus and a thin film deposition system are provided. The buffer apparatus is connected between a liquid material supply apparatus and a deposition machine. The buffer apparatus includes a container and a baffle. The container is used for containing a liquid material supplied from the liquid material supply apparatus. The top of the container has an input hole and an output hole. The baffle is disposed in the container and located under the input hole.

Abstract: A menu controlling method implemented by a central processing unit includes displaying an original menu including menu options, receiving a touch operation, and identifying a plurality of touch points corresponding to the received touch inputs, calculating a display size of one menu option, and a covered size of an touch area formed by the touch points, calculating a ratio of the display size to the covered size, detecting whether the calculated ratio is less than a predetermined ratio, and magnifying the menu if the calculated ratio is less than a predetermined ratio.

Abstract: The disclosure relates to an audio playing method adapted for an electronic device. The audio playing method includes (a) providing the electronic device, the electronic device comprising a processor, an audio playing program executed by the processor, and a storage system comprising a playlist comprising a plurality of audio files; (b) invoking and running the audio playing program; (c) accessing the playlist and selecting an audio file; (d) determining if the audio file selected has been previously selected as a prompt signal of the electronic device; (e) accessing another audio file in the playlist if the audio file has been previously selected as a prompt signal; and (f) playing the audio file if the audio file has not been previously selected as a prompt signal.

Abstract: A heat sink assembly (10) compatible with an ATX motherboard (20) and a BTX motherboard (30), includes a heat sink and a plurality of fasteners (15) extending through the heat sink. The heat sink includes a base (12) defining a slot (1220) therein. The fastener is capable of sliding along the slot between a first position to a second position to make the heat sink assembly in accordance with the preferred embodiment of the present invention to be adapted for use with the ATX motherboard or the BTX motherboard.

Abstract: An exemplary acid pickling solution for treating a surface of a magnesium alloy workpiece. The acid pickling solution consists of 5 g/l to 30 g/l of citric acid, 1.5 g/l to 6 g/l of surface active agent, wherein the surface active agent is a water-soluble and silicone free agent. A method for treating a surface of a magnesium alloy workpiece is also provided.

Abstract: An exemplary phosphating solution is used for conversion treating a surface of a magnesium alloy workpiece. The phosphating solution includes: 2.89 gram/liter to 8.67 gram/liter of phosphoric acid, 0.3 gram/liter to 1.0 gram/liter of carbamide, 0.39 gram/liter to 1.56 gram/liter of nitric acid, 6 gram/liter to 30 gram/liter of manganese dihydrogen phosphate, and 0.2 gram/liter to 0.6 gram/liter of tannin. A method for conversion treating a surface of a magnesium alloy workpiece is also provided.

Abstract: An exemplary magnesium alloy article includes a main body and a phosphate film formed on a surface of the magnesium alloy main body. The phosphate film contains carbon, oxygen, magnesium, aluminum, phosphorus, and manganese. A method for fabricating the present magnesium alloy article is also provided.

Abstract: A heat dissipation device for dissipating heat from a heat-generating device includes a heat-absorbing plate, a heat pipe assembly attached to the heat-absorbing plate and a fin set attached to the heat pipe assembly. The fin set includes a plurality of fins and has a contacting surface cooperatively formed by bottom edges of the fins and attached to the heat pipe assembly. The heat pipe assembly includes heat pipes with evaporating sections and condensing sections located away from the evaporating sections. The evaporating sections of the heat pipes are covered by the heat-absorbing plate and the condensing sections of the heat pipes are exposed outside of the heat-absorbing plate. The heat pipes absorb heat from the heat-generating device via the heat-absorbing plate, and directly transfer the heat to the fin set.

Abstract: A method for cleaning a reaction chamber having a pedestal and a carrier ring is provided. First, the pedestal and the carrier ring are cleaned with a high pressure gas. Next, the carrier ring is moved to leave the pedestal, and a low pressure gas is provided to clean the pedestal, the carrier ring, and an area lay between the pedestal and the carrier ring. Thereafter, a full flush is performed to clean the pedestal and the carrier ring.

Abstract: A heat dissipation device includes a base and a fin set thermally contacting the base. The base has a receiving portion for contacting to and absorbing heat from an electronic device and an extension portion surrounding the receiving portion. A first heat pipe is thermally engaged with the base. The first heat pipe is sinuous and includes a plurality of sections thermally engaged with the extension portion and the receiving portion of the base. A second heat pipe is thermally engaged with the extension portion and the receiving portion of the base. A middle linear section of the first heat pipe and an adjacent linear section of the second heat pipe are mounted to the base and located corresponding to the receiving portion of the base.

Abstract: A heat sink assembly (10) compatible with an ATX motherboard (20) and a BTX motherboard (30), includes a heat sink and a plurality of fasteners (15) extending through the heat sink. The heat sink includes a base (12) defining a slot (1220) therein. The fastener is capable of sliding along the slot between a first position to a second position to make the heat sink assembly in accordance with the preferred embodiment of the present invention to be adapted for use with the ATX motherboard or the BTX motherboard.