Patents by Inventor Zhao Xiang

Zhao Xiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEDICAL USE OF COMPOUND FROM GARCINIA ESCULENTA
    Publication number: 20160303069
    Abstract: The present invention provides compound extracted from Garcinia species and the use of said compound in preventing and treating cancer.
    Type: Application
    Filed: April 15, 2016
    Publication date: October 20, 2016
    Inventors: Hong-xi XU, Yuan-zhi LAO, Zhi-jie DING, Hong ZHANG, Kai-xian CHEN, Hong-sheng TAN, Zhao-xiang BIAN, Cheng-yuan LIN, Shi-lin CHEN, Da-jian YANG, Ai-ping LU, Albert Sun Chi CHAN
  • Medical use of compound from
    Patent number: 9468623
    Abstract: The present invention provides compound extracted from Garcinia species and the use of said compound in preventing and treating cancer.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: October 18, 2016
    Assignee: Hong Kong Baptist University
    Inventors: Hong-xi Xu, Yuan-zhi Lao, Zhi-jie Ding, Hong Zhang, Kai-xian Chen, Hong-sheng Tan, Zhao-xiang Bian, Cheng-yuan Lin, Shi-lin Chen, Da-jian Yang, Ai-ping Lu, Albert Sun Chi Chan
  • Pop package structure
    Patent number: 9318407
    Abstract: A package on package (PoP) package structure is disclosed, the structure includes at least two layers of carrier boards that are packaged and stacked in sequence, wherein chips are arranged on the bottom side of the carrier boards, a heat sink is arranged on the bottom side of a carrier board other than a layer-1 carrier board, a pad welded to a system board is arranged on the bottom side of the layer-1 carrier board, and a chip on a carrier board other than a top-layer carrier board is surface-mounted onto the heat sink adjacent to the chip. The heat sink increases the heat dissipation area of the chip, enhances the heat dissipation capabilities of the PoP stacked packages massively, breaks the bottleneck of the high-density integration and miniaturization of the PoP stacked packages, and enhances the packaging density of the PoP stacked packages.
    Type: Grant
    Filed: December 16, 2013
    Date of Patent: April 19, 2016
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Weifeng Liu, Yuming Ye, Zhao Xiang, Zhi Xu
  • Pop Package Structure
    Publication number: 20140097533
    Abstract: A package on package (PoP) package structure is disclosed, the structure includes at least two layers of carrier boards that are packaged and stacked in sequence, wherein chips are arranged on the bottom side of the carrier boards, a heat sink is arranged on the bottom side of a carrier board other than a layer-1 carrier board, a pad welded to a system board is arranged on the bottom side of the layer-1 carrier board, and a chip on a carrier board other than a top-layer carrier board is surface-mounted onto the heat sink adjacent to the chip. The heat sink increases the heat dissipation area of the chip, enhances the heat dissipation capabilities of the PoP stacked packages massively, breaks the bottleneck of the high-density integration and miniaturization of the PoP stacked packages, and enhances the packaging density of the PoP stacked packages.
    Type: Application
    Filed: December 16, 2013
    Publication date: April 10, 2014
    Applicant: Huawei Technologies Co., Ltd.
    Inventors: Weifeng Liu, Yuming Ye, Zhao Xiang, Zhi Xu