Patents by Inventor Zhao YIFAN

Zhao YIFAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE INCLUDING SOLDER BALL
    Publication number: 20140319681
    Abstract: There is provided a semiconductor package comprising: a chip mounted on a substrate; and at least one solder ball formed under the substrate, wherein the solder ball comprises: a solder layer; a shell surrounded by the solder layer; and a phase change material contained in the shell.
    Type: Application
    Filed: April 15, 2014
    Publication date: October 30, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Du MAOHUA, Zhao YIFAN