Abstract: Methods and apparatuses for passivating a fin field effect transistor (FinFET) semiconductor device and performing a gate etch using integrated atomic layer deposition (ALD) and etch processes are described herein. Methods include performing a partial gate etch, depositing a passivation layer on exposed surfaces of semiconductor fins and a gate layer by ALD, and performing a final gate etch to form one or more gate structures of the FinFET semiconductor device. The etch, deposition, and etch processes are performed in the same plasma chamber. The passivation layer is deposited on sidewalls of the gate layer to maintain a gate profile of the one or more gate structures during etching.

Abstract: A sensing apparatus includes a light source to transmit a light beam, an input switch, a first sensing element, a second sensing element, and a detector. The input switch receives the light beam and includes a phase change material having a first state and a second state. The first sensing element receives the light beam from the input switch when the phase change material is in the first state and produces a first change in the light beam in response to a presence of a first analyte. The second sensing element receives the light beam from the input switch when the phase change material is in the second state and produces a second change in the light beam in response to a presence of a second analyte. The detector detects the first change and/or the second change in the light beam.

Abstract: Methods and apparatuses for passivating a fin field effect transistor (FinFET) semiconductor device and performing a gate etch using integrated atomic layer deposition (ALD) and etch processes are described herein. Methods include performing a partial gate etch, depositing a passivation layer on exposed surfaces of semiconductor fins and a gate layer by ALD, and performing a final gate etch to form one or more gate structures of the FinFET semiconductor device. The etch, deposition, and etch processes are performed in the same plasma chamber. The passivation layer is deposited on sidewalls of the gate layer to maintain a gate profile of the one or more gate structures during etching.

Abstract: A sensing apparatus includes a light source to transmit a light beam, an input switch, a first sensing element, a second sensing element, and a detector. The input switch receives the light beam and includes a phase change material having a first state and a second state. The first sensing element receives the light beam from the input switch when the phase change material is in the first state and produces a first change in the light beam in response to a presence of a first analyte. The second sensing element receives the light beam from the input switch when the phase change material is in the second state and produces a second change in the light beam in response to a presence of a second analyte. The detector detects the first change and/or the second change in the light beam.

Abstract: An automation testing system for testing a motherboard includes a frame, a first jig plate, a second jig plate, a platform, a first driving mechanism, a second driving mechanism and a console computer. The frame includes a track, a debug docking board is detachably disposed on the first jig plate for docking with the motherboard, the platform is slidably installed on the track and disposed between the first jig plate and the second jig plate, and the platform is for holding the motherboard. The console computer controls the first driving mechanism to drive the platform to move in a first direction along the track, and controls the second driving mechanism to drive the second jig plate to move in a second direction perpendicular to the first direction.

Abstract: An automation testing system for testing a motherboard includes a frame, a first jig plate, a second jig plate, a platform, a first driving mechanism, a second driving mechanism and a console computer. The frame includes a track, a debug docking board is detachably disposed on the first jig plate for docking with the motherboard, the platform is slidably installed on the track and disposed between the first jig plate and the second jig plate, and the platform is for holding the motherboard. The console computer controls the first driving mechanism to drive the platform to move in a first direction along the track, and controls the second driving mechanism to drive the second jig plate to move in a second direction perpendicular to the first direction.