Patents by Inventor Zhaohui Pei

Zhaohui Pei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9138857
    Abstract: A chemical-mechanical polishing machine includes a work table, polishing platen mounted onto the work table, pad conditioner and slurry-delivery device mounted on the work table and disposed near the polishing platen, and polishing-head support mounted on the work table and including a base plate and supporting side plates. The base plate is formed with a groove in a “thickness” direction. A loading and unloading table is mounted on the work table, disposed below the base plate, and opposed to the polishing platen. A polishing head is rotatably disposed on the polishing-head support, movable in the longitudinal direction, and passes through the groove to extend downwardly. A robotic manipulator is disposed near the work table for placing a wafer on the loading and unloading table and taking the wafer away from it. A chemical-mechanical polishing apparatus includes an array of a plurality of the machine.
    Type: Grant
    Filed: June 8, 2011
    Date of Patent: September 22, 2015
    Assignee: HWATSING TECHNOLOGY CO., LTD.
    Inventors: Xinchun Lu, Zhenjie Xu, Yongyong He, Tongqing Wang, Pan Shen, Dewen Zhao, Hegeng Mei, Lianqing Zhang, Zhaohui Pei, Jianbin Luo
  • Publication number: 20130130601
    Abstract: A chemical-mechanical polishing machine includes a work table, polishing platen mounted onto the work table, pad conditioner and slurry-delivery device mounted on the work table and disposed near the polishing platen, and polishing-head support mounted on the work table and including a base plate and supporting side plates. The base plate is formed with a groove in a “thickness” direction. A loading and unloading table is mounted on the work table, disposed below the base plate, and opposed to the polishing platen. A polishing head is rotatably disposed on the polishing-head support, movable in the longitudinal direction, and passes through the groove to extend downwardly. A robotic manipulator is disposed near the work table for placing a wafer on the loading and unloading table and taking the wafer away from it. A chemical-mechanical polishing apparatus includes an array of a plurality of the machine.
    Type: Application
    Filed: June 8, 2011
    Publication date: May 23, 2013
    Inventors: Xinchun Lu, Zhenjie Xu, Yongyong He, Tongqing Wang, Pan Shen, Dewen Zhao, Hegeng Mei, Lianqing Zhang, Zhaohui Pei, Jianbin Luo