Abstract: A cross-coupling control method for moving beam of gantry machine tool is disclosed, which relates to the technical field of CNC machine tool control. The cross-coupling control method includes: Step 1: establishing a crossbeam dynamics model considering a ram on the crossbeam, and at the same time simplifying the model for an observer design; step 2: realizing a PID control parameter adjustment of motors at both ends in accordance with a method of parameter tuning of a unilateral servo control system; using a servo system with the same control parameters to jointly drive the crossbeam up and down, realizing the synchronous control and realizing PID control parameter tuning for both end motors. The disclosure not only reduces the synchronization error caused by the torsion of the crossbeam, but also solves the synchronization error caused by the asymmetric load on both sides, and improves the system robustness and stability.

Abstract: The present application discloses a manufacturing method for a display module and a display screen. The method includes: forming a semiconductor device by pre-processing a semiconductor epitaxial wafer; forming a first transparent layer on a substrate surface of the semiconductor device; forming a first opening exposing the substrate by etching the first transparent layer; forming a first quantum dot layer on the substrate surface exposed by the first opening and the surface of the first transparent layer; etching away the first quantum dot layer in the outer region of the first opening, and remaining the first quantum dot layer inside the first opening; and forming a DBR film layer that filters blue light.

Abstract: Provided herein is a tungsten-rhenium composite thin film thermocouple based on a surface micropillar array with gas holes. A tungsten-rhenium thin film thermocouple is arranged on a surface of a flat alumina ceramic substrate. Two tails of the tungsten-rhenium thin film thermocouple are respectively connected to a lead wire. A surface of the tungsten-rhenium thin film thermocouple is arrayed with a plurality of micron alumina micropillars to form an alumina micropillar array. Air is filled between the micron alumina micropillars to form the gas holes. The flat alumina ceramic substrate, the tungsten-rhenium thin film thermocouple and the alumina micropillar array form a three-layered laminated structure.

Abstract: Provided herein is a tungsten-rhenium composite thin film thermocouple based on a surface micropillar array with gas holes. A tungsten-rhenium thin film thermocouple is arranged on a surface of a flat alumina ceramic substrate. Two tails of the tungsten-rhenium thin film thermocouple are respectively connected to a lead wire. A surface of the tungsten-rhenium thin film thermocouple is arrayed with a plurality of micron alumina micropillars to form an alumina micropillar array. Air is filled between the micron alumina micropillars to form the gas holes. The flat alumina ceramic substrate, the tungsten-rhenium thin film thermocouple and the alumina micropillar array form a three-layered laminated structure.

Abstract: Provided are a set of primer pair and probe, having the oligonucleotide sequences as shown in SEQ ID NO: 1, SEQ ID NO: 2 and SEQ ID NO: 3, and a set of primer pair and probe of reference sequence, having the oligonucleotide sequences as shown in SEQ ID NO: 4, SEQ ID NO: 5 and SEQ ID NO: 6. Further provided is the use of the set of primer pair and probe for detecting the common deleted region “chr9:21970277-21985225,hg19”, of CDKN2A in the preparation of a kit for quantitatively detecting the deletion of a human CDKN2A gene copy in a DNA sample to be tested. The new method and the specific primer pair and probe can simply, conveniently and specifically detect the deletion of the CDKN2A gene copy in the sample, and have higher sensitivity than conventional detection methods for copy deletion.

Abstract: An image processing method and device, a camera apparatus and a storage medium are provided. The image processing method includes: acquiring an initial image, and the initial image corresponds to an RGB data format; dividing the initial image into a plurality of image blocks; converting each image block in the plurality of image blocks from the RGB data format into a YUV data format, wherein Y is a luminance value, and U and V are chromatic value; inverting a luminance value Y of a target image block into a darkness value D, and the target image block is at least one of the plurality of image blocks; coding DUV data of the target image block and YUV data of a non-inverted image block so as to obtain target image data of the initial image.

Abstract: A thin-film thermocouple probe includes a columnar substrate, a tungsten-26% rhenium film and an indium oxide (In2O3) film. A side surface of the columnar substrate is provided with a first straight groove and a second straight groove. The tungsten-26% rhenium film is arranged on a front end surface of the columnar substrate and in the first straight groove. The indium oxide film is arranged on the front end surface of the columnar substrate and in the second straight groove. The indium oxide film on the front end surface of the columnar substrate is connected to the tungsten-26% rhenium film on the front end surface of the columnar substrate. A first metal lead wire is connected to the tungsten-26% rhenium film, and a second metal lead wire is connected to the indium oxide film. A method of preparing the thin-film thermocouple probe is provided.

Abstract: A thin-film thermocouple probe includes a columnar substrate, a tungsten-26% rhenium film and an indium oxide (In2O3) film. A side surface of the columnar substrate is provided with a first straight groove and a second straight groove. The tungsten-26% rhenium film is arranged on a front end surface of the columnar substrate and in the first straight groove. The indium oxide film is arranged on the front end surface of the columnar substrate and in the second straight groove. The indium oxide film on the front end surface of the columnar substrate is connected to the tungsten-26% rhenium film on the front end surface of the columnar substrate. A first metal lead wire is connected to the tungsten-26% rhenium film, and a second metal lead wire is connected to the indium oxide film. A method of preparing the thin-film thermocouple probe is provided.

Abstract: A passive-matrix light-emitting diodes on silicon (LEDoS) micro-display is presented herein. The LEDoS micro-display comprises a passive-matrix micro-light-emitting diode (LED) array comprising passive-matrix micro-light-emitting diodes (LEDs), and a display driver configured to apply column signals to columns of LED pixels of the passive-matrix micro-LED array and scan signals to rows of the LED pixels, wherein the passive-matrix micro-LED array is flip-chip bonded to the display driver based on solder bumps located at peripheral areas of the passive-matrix micro-LED array.

Abstract: Provided in the present invention are a method using in vitro measurement of the content of methylation or demethylation of GFRa1 CpG islands to estimate a risk of tumorigenesis and of tumor metastasis, or postoperative life expectancy, and a nucleotide sequence used.

Abstract: Provided in the present invention are a method using in vitro measurement of the content of methylation or demethylation of GFRa1 CpG islands to estimate a risk of tumorigenesis and of tumor metastasis, or postoperative life expectancy, and a nucleotide sequence used.

Abstract: Provided in the present invention are a method using in vitro measurement of the content of methylation or demethylation of GFRa1 CpG islands to estimate a risk of tumorigenesis and of tumor metastasis, or postoperative life expectancy, and a nucleotide sequence used.

Abstract: Image projection utilizing light-emitting diodes on a silicon (LEDoS) substrate is described herein. LEDoS devices selectively activate LED pixels to produce light. Light can excite color conversion materials of the LEDoS devices to form color images. Images can be projected onto a projection surface.

Abstract: A high-resolution, Active Matrix (AM) programmed monolithic Light Emitting Diode (LED) micro-array is fabricated using flip-chip technology. The fabrication process includes fabrications of an LED micro-array and an AM panel, and combining the resulting LED micro-array and AM panel using the flip-chip technology. The LED micro-array is grown and fabricated on a sapphire substrate and the AM panel can be fabricated using CMOS process. LED pixels in a same row share a common N-bus line that is connected to the ground of AM panel while p-electrodes of the LED pixels are electrically separated such that each p-electrode is independently connected to an output of drive circuits mounted on the AM panel. The LED micro-array is flip-chip bonded to the AM panel so that the AM panel controls the LED pixels individually and the LED pixels exhibit excellent emission uniformity. According to this constitution, incompatibility between the LED process and the CMOS process can be eliminated.

Abstract: A light emitting diode (“LED”) lighting apparatus has several components for providing lighting including a boost circuit for driving a plurality of LED strips. The boost circuit is used to boost an input voltage to a predefined voltage, where the predefined voltage is greater than the input voltage. Each of the LED strips has a set of serially-connected LEDs coupled to a transparent backing. The sets of LEDs are serially connected to each other. The predefined voltage is applied to the strips via the serial connection to drive the LEDs of the strips.

Abstract: A light emitting diode (“LED”) lighting system comprises an LED lighting fixture having LEDs, a network interface cable, and one or more controllers. The network interface cable has multiple pairs of wires. A certain one of the one or more LED controllers is connected to the LED lighting fixture via the network interface cable. The certain one of the one or more LED controllers powers the LED lighting fixture via the network interface cable.

Abstract: Provided in the present invention are a method using in vitro measurement of the content of methylation or demethylation of GFRal CpG islands to estimate a risk of tumorigenesis and of tumor metastasis, or postoperative life expectancy, and a nucleotide sequence used.

Abstract: A light emitting diode (“LED”) lighting apparatus has vents to cool the LED lighting apparatus. The LED lighting apparatus comprises one or more strips, a base having vents, and one or more glass tubes. Each strip has LEDs and a transparent backing. The vents comprise a central vent and side vents, were the central vent and certain ones of the side vents are connected to allow for gas flow. The one or more strips and the one or more glass tubes are coupled to the base, where the one or more glass tubes encapsulate the one or more strips. The central vent is disposed adjacent to the one or more glass tubes, and a heat transfer medium within selected ones of the one or more glass tubes flows out of the selected ones of the one or more glass tubes for cooling.

Abstract: Structures for LED light bulbs comprise a driver board and a lighting structure having one or more LEDs disposed thereon. The driver board, in a Y shape, can be the circuit board and has a positive terminal and a negative terminal for receiving electrical power. The Y-shaped driver board having two prongs connects to the light structure to power the LEDs thereon. The lighting structure can be in the form of a grid having the LEDs disposed thereon.

Abstract: A passive-matrix light-emitting diodes on silicon (LEDoS) micro-display is presented herein. The LEDoS micro-display comprises a passive-matrix micro-light-emitting diode (LED) array comprising passive-matrix micro-light-emitting diodes (LEDs), and a display driver configured to apply column signals to columns of LED pixels of the passive-matrix micro-LED array and scan signals to rows of the LED pixels, wherein the passive-matrix micro-LED array is flip-chip bonded to the display driver based on solder bumps located at peripheral areas of the passive-matrix micro-LED array.