Abstract: Provided herein are compounds, compositions, and methods useful for modulating the integrated stress response (ISR) and for treating related diseases; disorders and conditions.

Abstract: An automated three-dimensional refrigerated warehouse for a meat industry is provided. A refrigerated warehouse body is provided with two groups of chain wheels, a chain is sleeved on each group of chain wheels, and a plurality of mounting blocks are uniformly mounted on the chain. The mounting blocks are connected to suspension rods, a supporting table is connected between bottom ends of the suspension rods, an opening is provided in a middle of the supporting table, and a loading cart is placed on the supporting table. The refrigerated warehouse body is connected to two supporting plates, a first electric push rod is arranged above each of the two supporting plates, and top ends of the two first electric push rods are provided with mounting plates. Top ends of the two mounting plates are provided with a horizontal second electric push rod and a horizontal third electric push rod respectively.

Abstract: An automated three-dimensional refrigerated warehouse for a meat industry is provided. A refrigerated warehouse body is provided with two groups of chain wheels, a chain is sleeved on each group of chain wheels, and a plurality of mounting blocks are uniformly mounted on the chain. The mounting blocks are connected to suspension rods, a supporting table is connected between bottom ends of the suspension rods, an opening is provided in a middle of the supporting table, and a loading cart is placed on the supporting table. The refrigerated warehouse body is connected to two supporting plates, a first electric push rod is arranged above each of the two supporting plates, and top ends of the two first electric push rods are provided with mounting plates. Top ends of the two mounting plates are provided with a horizontal second electric push rod and a horizontal third electric push rod respectively.

Abstract: The present invention discloses a quad flat no lead package and a production method thereof. The quad flat no lead package comprises a lead frame carrier consisting of a carrier pit and three circles of leads arranged around the carrier pit, wherein the three circles of leads respectively consist of a plurality of leads that are disconnected mutually; an IC chip is adhered in the carrier pit; and an inner lead chemical nickel and porpezite plated layer is plated on all the leads; the inner lead chemical nickel and porpezite plated layer is arranged in the same direction as the IC chip; the IC chip is connected with the inner lead chemical nickel and porpezite plated layer through a bonding wire; and the IC chip, the ends of all the leads plated with the inner lead chemical plating nickel and palladium metal layers and the bonding wire are all packaged in a plastic package.

Abstract: The present invention discloses a quad flat no lead package and a production method thereof. The quad flat no lead package comprises a lead frame carrier consisting of a carrier pit and three circles of leads arranged around the carrier pit, wherein the three circles of leads respectively consist of a plurality of leads that are disconnected mutually; an IC chip is adhered in the carrier pit; and an inner lead chemical nickel and porpezite plated layer is plated on all the leads; the inner lead chemical nickel and porpezite plated layer is arranged in the same direction as the IC chip; the IC chip is connected with the inner lead chemical nickel and porpezite plated layer through a bonding wire; and the IC chip, the ends of all the leads plated with the inner lead chemical plating nickel and palladium metal layers and the bonding wire are all packaged in a plastic package.