Abstract: Methods, devices, and systems for light detection are provided. In one aspect, a light detection device includes a light emitter array, a light detector array, and a controller. The light emitter array includes a plurality of light emitters configured to output transmission signals. The light detector array includes a plurality of light detectors configured to detect echo signals of the transmission signals reflected off an obstacle. The light emitter array and the light detector array are configured to form a plurality of detection channels, and each detection channel includes at least one light emitter and at least one light detector. The controller is configured to, during a signal transmission process, select multiple light emitters to emit light in parallel. Fields of view (FOVs) of the multiple light emitters that emit light in parallel are separate from each other within a detection distance.

Abstract: Disclosed are a leadframe, a bracket and an LED device. The leadframe includes a first photo-etched metal part, having a first electrode and a chip placement layer thereon, which has a greater length for short and long edges than those of the first electrode; and a second photo-etched metal part, composed of a second electrode and a connection layer thereon, which has a greater length for short and long edges than those of the second electrode; wherein a first long edge of the chip placement layer is flush with a first long edge of the first electrode, and a first long edge of the connection layer is flush with a first long edge of the second electrode; and wherein the chip placement layer and the connection layer are provided with L-shaped pins at corners of their first long edges to cover sidewalls of the corresponding corners.

Abstract: A laser radar includes: an emitter including a laser array being configured to emit a plurality of laser beams for detecting a target object (OB); a receiver including a detector array being configured to receive echoes of the plurality of laser beams emitted from the laser array reflected by the target object (OB), and convert the echoes into electrical signals, where the laser array and the detector array form a plurality of detection channels, and each detection channel includes one laser and one detector; and a processor coupled to the emitter and the receiver, and configured to read a first electrical signal of a detector of a first detection channel and a second electrical signal of a detector of a second detection channel when a laser beam emitted from the laser array.

Abstract: An LED device and a bracket thereof. The bracket includes a first photo-etched metal part, composed of a first electrode and a chip placement layer stacked thereon, wherein an area of the chip placement layer is greater than an area of the first electrode; a second photo-etched metal part, composed of a second electrode and a connection layer stacked thereon; wherein a first insulation trench is provided between the first electrode and the second electrode, and a second insulation trench is provided between the chip placement layer and the connection layer. The LED device and the bracket thereof can increase the placement area for placing LED chips, thereby improving the luminance of the LED device.

Abstract: A white LED including red phosphor, at least one blue LED chip and at least one green LED chip, wherein a red light, a blue light and a green light are mixed simultaneously to produce a white light. The red phosphor comprises a first red phosphor and a second red phosphor. The first red phosphor is made from a substance having structure formula M2AX6:Mn4+, wherein the element M is selected from Li, Na, K, Rb or Cs, the element A is selected from Ti, Si, Ge or Zr, and the element X is selected from F, Cl or Br; the ratio of the second red phosphor to the red phosphor ranges from 0.01% to 15%. Further provided is a backlight module. The adjustably colored points of a device comprising M2AX6:Mn4+ are achieved by adding a second red phosphor to the red phosphor comprising M2AX6:Mn4+.

Abstract: A red luminophor, LED device and method for making the LED device. The red luminophor includes one or more materials selected from SrLiAl3N4:Eu2+, CaLiAl3N4:Eu2+, Sr4LiAl11N14:Eu2+ and Li2Ca2(Mg2Si2N6):Eu2+. The LED device includes the red luminophor. The method for making the LED device includes preparing a carrier; installing a blue LED onto the carrier; mixing the red luminophors and the transparent sealant to form a mixture; dispensing the mixture on the blue LED and the carrier to form an integration; and heating and curing the integration. The red luminophor has continuous light radiation in the wavelength range of 600 nm-750 nm, with the emission peak at 650-680 nm and the FWHM of less than 90 nm. Its emission light intensity at the wavelength of 730 nm is not less than 30% of its maximum emission light intensity, which matches the absorption needs of phytochrome of plant.

Abstract: The present disclosure relates to a method for identification of a noise point used for a LiDAR, comprising: receiving a point cloud generated by the LiDAR; obtaining at least one of reflectivity and continuity parameter of a point in the point cloud, and a distance between the point and the LiDAR; and determining whether the point is a noise point at least based on at least one of the reflectivity and the continuity parameter, and the distance.

Abstract: A method for processing a point cloud generated by a light detection and ranging system, includes: receiving a first measurement generated by the light detection and ranging system; retrieving a plurality of second measurements that are adjacent to the first measurement; calculating a first parameter by using distances of the first measurement and the plurality of the second measurements, the first parameter indicating a degree of continuum of the first measurement relative to the plurality of the second measurements; and determining whether the first measurement represents a measurement of noises by using the first parameter.

Abstract: The present disclosure relates to a method for identification of a noise point used for a LiDAR, comprising: receiving a point cloud generated by the LiDAR; obtaining at least one of reflectivity and continuity parameter of a point in the point cloud, and a distance between the point and the LiDAR; and determining whether the point is a noise point at least based on at least one of the reflectivity and the continuity parameter, and the distance.

Abstract: The present disclosure relates to a method for identification of a noise point used for a LiDAR, comprising: receiving a point cloud generated by the LiDAR; obtaining at least one of reflectivity and continuity parameter of a point in the point cloud, and a distance between the point and the LiDAR; and determining whether the point is a noise point at least based on at least one of the reflectivity and the continuity parameter, and the distance.

Abstract: A light emitting device, including a carrier, at least one first light-emitting diode fixed on the carrier for emitting a first color light, at least one second light-emitting diode fixed on the carrier for emitting a second color light, a first light converter coated on at least one first light-emitting diode for converting the first color light into a red light, and a second light converter coated on at least one second light-emitting diode for converting the second color light into a third color light. The first color light, the red light, the second color light and the third color light are mixed into a sunlight-like light. The light emitting device and method effectively enhance the light emission intensity of the red light, and solve the problems of the existing sunlight-like light, e.g. insufficient red light intensity or absence of red light.

Abstract: A red luminophor, LED device and method for making the LED device. The red luminophor includes one or more materials selected from SrLiAl3N4:Eu2+, CaLiAl3N4:Eu2+, Sr4LiAl11N14:Eu2+ and Li2Ca2(Mg2Si2N6):Eu2+. The LED device includes the red luminophor. The method for making the LED device includes preparing a carrier; installing a blue LED onto the carrier; mixing the red luminophors and the transparent sealant to form a mixture; dispensing the mixture on the blue LED and the carrier to form an integration; and heating and curing the integration. The red luminophor has continuous light radiation in the wavelength range of 600 nm-750 nm, with the emission peak at 650-680 nm and the FWHM of less than 90 nm. Its emission light intensity at the wavelength of 730 nm is not less than 30% of its maximum emission light intensity, which matches the absorption needs of phytochrome of plant.

Abstract: A red phosphor comprising a first red phosphor and a second red phosphor having adjustable wavelength. The first red phosphor is made from a substance having structure formula M2AX6:Mn4+, wherein the element M is selected from Li, Na, K, Rb or Cs, the element A is selected from Ti, Si, Ge or Zr, and the element X is selected from F, Cl or Br; the ratio of the second red phosphor to the red phosphor ranges from 0.01% to 15%. Further provided is a white LED and a backlight module. The adjustably colored points of a device including M2AX6:Mn4+ are achieved by adding a second red phosphor having various wavelength to the red phosphor including M2AX6:Mn4+ whose emission wavelength and spectral shape cannot be adjusted. The device can enable full range of colored points with hardly any reduction of the NTSC color gamut.

Abstract: A white LED including red phosphor, at least one blue LED chip and at least one green LED chip, wherein a red light, a blue light and a green light are mixed simultaneously to produce a white light. The red phosphor comprises a first red phosphor and a second red phosphor. The first red phosphor is made from a substance having structure formula M2AX6:Mn4+, wherein the element M is selected from Li, Na, K, Rb or Cs, the element A is selected from Ti, Si, Ge or Zr, and the element X is selected from F, Cl or Br; the ratio of the second red phosphor to the red phosphor ranges from 0.01% to 15%. Further provided is a backlight module. The adjustably colored points of a device comprising M2AX6:Mn4+ are achieved by adding a second red phosphor to the red phosphor comprising M2AX6:Mn4+.

Abstract: The present invention provide an light emitting device (LED) with wide color gamut (high NTSC), and a LED backlight module with the light emitting device, the light emitting device includes at least one LED chip, wherein the LED chip is a blue or ultraviolet (UV) LED chip, the light-out surface of the LED chip is covered by a phosphor-converted layer which consists of phosphor converted materials and thermosetting colloid materials, the phosphor converted materials contain green-converted phosphor, red-converted phosphor and a special phosphor material that has strong light-absorbing properties in the wavelength range of 460-510 nm. The present invention can reduce the stringent requirements of phosphor FWHM that needs to meet for conventional high NTSC solution.

Abstract: The present invention provide an light emitting device (LED) with wide color gamut (high NTSC), and a LED backlight module with the light emitting device, the light emitting device includes at least one LED chip, wherein the LED chip is a blue or ultraviolet (UV) LED chip, the light-out surface of the LED chip is covered by a phosphor-converted layer which consists of phosphor converted materials and thermosetting colloid materials, the phosphor converted materials contain green-converted phosphor, red-converted phosphor and a special phosphor material that has strong light-absorbing properties in the wavelength range of 460-510 nm. The present invention can reduce the stringent requirements of phosphor FWHM that needs to meet for conventional high NTSC solution.

Abstract: The present invention discloses a white LED chip and method of manufacturing the same. The white LED chip includes a flip blue LED chip and a preformed conversion layer for light conversion, the method of manufacturing the white LED chip includes the steps of preparing for a preformed conversion layer for light conversion, setting up at least one cavity on the conversion layer, for receiving a blue LED chip(s), attaching the blue LED chip into the cavity; and cutting the conversion layer into a single white LED chip based on each cavity that received a blue LED chip. The invention not only enhance the luminous efficiency of the white LED chip, but also avoid the pollution to bottom electrode of the LED chip, making easier manufacture and higher binning yield.

Abstract: The present invention relates to a surface mounted LED structure of integrating functional circuits on a silicon substrate, comprising the silicon substrate and an LED chip. Said silicon substrate has an upper surface of planar structure without grooves. An oxide layer covers the upper surface of the silicon substrate, and metal electrode layers are arranged in the upper surface of the oxide layer. The upper surfaces of said metal electrode layers are arranged with metal bumps, and the LED chip is flip-chip mounted to the silicon substrate. Two conductive metal pads are arranged on the lower surface of said silicon substrate, said conductive metal pads are electrically connected to the metal electrode layers on the upper surface of the silicon substrate by a metal lead arranged on the side wall of the silicon substrate. A heat conduction metal pad is arranged on the corresponding lower, surface of the silicon substrate just below the LED chip.

Abstract: The present invention relates to an LED packaging structure and packaging method. Said packaging structure includes a substrate, an LED chip, one or more convex walls and a colloid lens shaped by the restriction of the convex walls. Said convex walls are arranged on the substrate, at least one LED chip is arranged on the substrate within an area surrounded by the convex walls, and the colloid lens enclosing the LED chip is arranged within the area surrounded by the convex walls. The colloid lens is formed with desired colloid shape by placing a liquid colloid within the area confined by the convex walls and utilizing surface tension of the liquid, and is cured. Compared to prior art, the LED packaging structure of the present invention is simple and reasonable, with simple production process and lower costs.

Abstract: The present invention relates to a surface mounted LED structure of integrating functional circuits on a silicon substrate, comprising the silicon substrate and an LED chip. Said silicon substrate has an upper surface of planar structure without grooves. An oxide layer covers the upper surface of the silicon substrate, and metal electrode layers are arranged in the upper surface of the oxide layer. The upper surfaces of said metal electrode layers are arranged with metal bumps, and the LED chip is flip-chip mounted to the silicon substrate. Two conductive metal pads are arranged on the lower surface of said silicon substrate, said conductive metal pads are electrically connected to the metal electrode layers on the upper surface of the silicon substrate by a metal lead arranged on the side wall of the silicon substrate. A heat conduction metal pad is arranged on the corresponding lower, surface of the silicon substrate just below the LED chip.