Abstract: A ferroelectric memory includes at least one storage cell. Each storage cell includes a transistor, a first ferroelectric capacitor, and at least one voltage divider capacitor. The transistor includes a gate electrode, a source electrode, and a drain electrode. One electrode of the first ferroelectric capacitor is connected to the gate electrode. The other electrode of the first ferroelectric capacitor is connected to a word line. One electrode of each voltage divider capacitor in the at least one voltage divider capacitor is connected to the gate electrode, and the other electrode of each voltage divider capacitor in the at least one voltage divider capacitor is connected to the source electrode.

Abstract: Provided are a three-dimensional vertical single transistor ferroelectric memory and a manufacturing method thereof. The ferroelectric memory comprises: a substrate; an insulating dielectric layer provided at the substrate; a channel structure extending through the insulating dielectric layer and connected to the substrate, the channel structure having a source/drain region and a channel region connected to the source/drain region; and a gate stack structure arranged around the channel structure and provided in the insulating dielectric layer opposite to the channel region, the gate stack structure comprising a ferroelectric insulation layer and a gate sequentially stacked in a direction away from the channel structure. The ferroelectric memory having the above structure can replace conventional DRAMs. Therefore, the invention realizes a high intensity high speed memory.

Abstract: A memory includes a storage array, at least one source line, at least one word line, and at least one bit line. The storage array includes a plurality of gate-all-around field-effect transistors. The at least one word line is connected to gates of the plurality of gate-all-around field-effect transistors. The at least one source line is connected to sources of the plurality of gate-all-around field-effect transistors. The at least one bit line is connected to drains of the plurality of gate-all-around field-effect transistors. A material of a nanowire of the gate-all-around field-effect transistor is silicon germanium (SiGe). For a next-generation logic process (for example, a GAA process), a storage array including a gate-all-around field-effect transistor manufactured by using a same process as a logic process is used in a memory so that the memory can be compatible with the logic process.

Abstract: Example ferroelectric memories and storage devices are described One example ferroelectric memory includes at least one bit cell. A bit cell in the at least one bit cell includes a plurality of ferroelectric capacitors and a first transistor. The first transistor includes a first gate, a first channel, a first source, and a first drain. The first source and the first drain are located at two ends of the first channel. One electrode of each of the plurality of ferroelectric capacitors is formed on the first gate.

Abstract: Provided are a three-dimensional vertical single transistor ferroelectric memory and a manufacturing method thereof. The ferroelectric memory comprises: a substrate; an insulating dielectric layer provided at the substrate; a channel structure extending through the insulating dielectric layer and connected to the substrate, the channel structure having a source/drain region and a channel region connected to the source/drain region; and a gate stack structure arranged around the channel structure and provided in the insulating dielectric layer opposite to the channel region, the gate stack structure comprising a ferroelectric insulation layer and a gate sequentially stacked in a direction away from the channel structure. The ferroelectric memory having the above structure can replace conventional DRAMs. Therefore, the invention realizes a high intensity high speed memory.