Abstract: A power converter includes a power stage circuit, a ramp generator circuit, and a control circuit. The power stage circuit generates an output signal according to an input signal and a control signal. The ramp generator circuit generates a ramp signal according to the control signal, the input signal, and the output signal. The control circuit generates the control signal according to the output signal, a reference signal, and the ramp signal.

Abstract: A power converter includes a power stage circuit, a ramp generator circuit, and a control circuit. The power stage circuit is configured to generate an output signal according to an input signal and a control signal. The ramp generator circuit is configured to generate a ramp signal according to the control signal, the input signal, and the output signal. The control circuit is configured to generate the control signal according to the output signal, a reference signal, and the ramp signal.

Abstract: A power stage circuit generates an output signal according to an input signal and a control signal. A ramp generator circuit generates a ramp signal according to the control signal, the input signal, and the output signal. A calculation circuit generates a calculation signal according to the output signal and a reference signal. The calculation circuit operates in a first mode when the power converter operates in a light loading state, and the calculation circuit operates in a second mode when the power converter operates in a normal state. A control circuit generates the control signal according to the calculation signal and the ramp signal. The control circuit includes a comparator circuit and a control signal generator. The comparator circuit generates a comparison signal according to the calculation signal and the ramp signal. The control signal generator generates the control signal according to the comparison signal.

Abstract: A testing and repairing apparatus of through silicon via (TSV) disposed between a first and a second chips is provided. First terminals of a first and a second switches are coupled to a first terminal of the TSV. First terminals of a third and a fourth switches are coupled to a second terminal of the TSV. A first terminal of a first resister is coupled to a first voltage. A first selector is coupled between second terminals of the second switch and the first resister. A second selector is coupled between a second terminal of the fourth switch and a second voltage. A first control circuit detects the second terminal of the second switch, and controls the first switch, the second switch and the first selector. A second control circuit controls the third switch, the fourth switch and the second selector.

Abstract: A varactor is provided. A substrate includes a first surface, a second surface and a first opening and a second opening in the substrate. A conductive material is filling the first and second openings, to form a first through-wafer via (TWV) and a second through-wafer via. A first capacitor is coupled between the first through-wafer via and a first terminal. A second capacitor is coupled between the second through-wafer via and a second terminal. A capacitance of a depletion-region capacitor between the first through-wafer via and the second through-wafer via is determined by a bias voltage applied to the first through-wafer via and the second through-wafer via.

Abstract: A memory storage circuit includes a volatile memory portion, a control portion, and a non-volatile memory portion. The volatile memory portion includes a first node and a second node to store a pair of complementary logic data. The control portion includes a first transistor and a second transistor. Gate electrodes of the first and second transistors are coupled to receive a store signal, and first electrodes of the first and second transistors are coupled to receive a control signal. The non-volatile memory portion includes a first resistive memory element and a second resistive memory element to store the pair of complementary logic data. The first resistive memory element is coupled between a second electrode of the first transistor and the first node, and the second resistive memory element is coupled between a second electrode of the second transistor and the second node.

Abstract: A memory storage circuit includes a volatile memory portion, a control portion, and a non-volatile memory portion. The volatile memory portion includes a first node and a second node to store a pair of complementary logic data. The control portion includes a first transistor and a second transistor. Gate electrodes of the first and second transistors are coupled to receive a store signal, and first electrodes of the first and second transistors are coupled to receive a control signal. The non-volatile memory portion includes a first resistive memory element and a second resistive memory element to store the pair of complementary logic data. The first resistive memory element is coupled between a second electrode of the first transistor and the first node, and the second resistive memory element is coupled between a second electrode of the second transistor and the second node.

Abstract: A logic gate including a first resistive non-volatile memory device and a second resistive non-volatile memory device is provided. When top electrodes of the first and the second resistive non-volatile memory devices are coupled to an output terminal of the logic gate, bottom electrodes of the first and the second resistive non-volatile memory devices are respectively coupled to a first input terminal and a second input terminal of the logic gate. When the bottom electrodes of the first and the second resistive non-volatile memory devices are coupled to the output terminal of the logic gate, the top electrodes of the first and the second resistive non-volatile memory devices are respectively coupled to the first input terminal and the second input terminal of the logic gate.

Abstract: A varactor is provided. A substrate includes a first surface, a second surface and a first opening and a second opening in the substrate. A conductive material is filling the first and second openings, to form a first through-wafer via (TWV) and a second through-wafer via. A first capacitor is coupled between the first through-wafer via and a first terminal. A second capacitor is coupled between the second through-wafer via and a second terminal. A capacitance of a depletion-region capacitor between the first through-wafer via and the second through-wafer via is determined by a bias voltage applied to the first through-wafer via and the second through-wafer via.

Abstract: A logic gate including a first resistive non-volatile memory device and a second resistive non-volatile memory device is provided. When top electrodes of the first and the second resistive non-volatile memory devices are coupled to an output terminal of the logic gate, bottom electrodes of the first and the second resistive non-volatile memory devices are respectively coupled to a first input terminal and a second input terminal of the logic gate. When the bottom electrodes of the first and the second resistive non-volatile memory devices are coupled to the output terminal of the logic gate, the top electrodes of the first and the second resistive non-volatile memory devices are respectively coupled to the first input terminal and the second input terminal of the logic gate.

Abstract: A multi-chip stack structure including a first chip, a second chip, a shielding layer, and a plurality of conductive bumps is provided. The second chip is stacked on the first chip. The second chip has a plurality of through silicon via (TSV) structures to conduct a reference voltage. The shielding layer and the plurality of conductive bumps are disposed between the first chip and the second chip, and are electrically connected to the plurality of TSV structures. The shielding layer can isolate noises and improve signal coupling between two adjacent chips.

Abstract: A testing and repairing apparatus of through silicon via (TSV) disposed between a first and a second chips is provided. First terminals of a first and a second switches are coupled to a first terminal of the TSV. First terminals of a third and a fourth switches are coupled to a second terminal of the TSV. A first terminal of a first resister is coupled to a first voltage. A first selector is coupled between second terminals of the second switch and the first resister. A second selector is coupled between a second terminal of the fourth switch and a second voltage. A first control circuit detects the second terminal of the second switch, and controls the first switch, the second switch and the first selector. A second control circuit controls the third switch, the fourth switch and the second selector.

Abstract: A multi-chip stack structure including a first chip, a second chip, a shielding layer, and a plurality of conductive bumps is provided. The second chip is stacked on the first chip. The second chip has a plurality of through silicon via (TSV) structures to conduct a reference voltage. The shielding layer and the plurality of conductive bumps are disposed between the first chip and the second chip, and are electrically connected to the plurality of TSV structures. The shielding layer can isolate noises and improve signal coupling between two adjacent chips.