Abstract: A bonding device includes a body defining a cavity, a controller provided in the cavity, an intake device provided on the body and configured to fill gas into the cavity under the control of the controller, an exhaust device provided on the body and configured to remove the gas from the cavity under the control of the controller, a heating device provided in the cavity and configured to heat the gas in the cavity under the control of the controller, and a cooling device provided on a side of the cavity and configured to dissipate heat from the cavity. The intake device and the exhaust device are in communication with the cavity. The heating device, the intake device, and the exhaust device are electrically coupled to the controller.