Patents by Inventor Zheming Zhou

Zheming Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190129479
    Abstract: Disclosed is a water cooling plate composed of multi channels, comprising a plate body (1), a water chamber (2), and a waterproof baffle (3), wherein the plate body (1) is composed of at least two pipelines (4), the pipelines (4) being bent according to the shape of a flow channel one by one and being combined in parallel to form the plate body (1); the plate body (1) can be mounted on a baseplate; the water chamber (2) is provided with a water pipe joint (9); the waterproof baffle (3) being provided between the water chamber (2) and the plate body (1); the pipelines (4) penetrate the waterproof baffle (3), and flow directions of adjacent pipelines (4) can be provided in opposite directions. The structure is flexible in flow channel distribution, and has high heat dissipation efficiency.
    Type: Application
    Filed: April 12, 2017
    Publication date: May 2, 2019
    Inventor: Zheming Zhou
  • Publication number: 20140362525
    Abstract: The present application discloses a low-noise computer heat dissipation device, which relates to electronic devices, and more particularly to the dissipation of heat generated by computer devices such as a server, a network device, a personal computer (PC), a notebook computer, etc. The computer heat dissipation device comprises a heat conduction member, a central radiator, and auxiliary heat dissipation fans. The heat conduction member is mainly formed by heat pipes, evaporation ends of the heat pipes are connected to main heating members inside a chassis, condensation ends of the heat pipes are connected to the central radiator, and the central radiator has cooling fins with large heat dissipation areas and a low-speed fan. The advantages of this technical solution are that noise of heat dissipation fans of the chassis can be reduced and the overall heat dissipation efficiency can be enhanced.
    Type: Application
    Filed: August 25, 2014
    Publication date: December 11, 2014
    Inventor: Zheming Zhou