Abstract: An active sound barrier has at least one passive sound absorber at or near a boundary location. A microphone provides an output to a frequency division module, in which a plural of frequencies are filtered to provide outputs corresponding to frequency segments of the receiving transducer output at respective ones of the frequencies. An active driving circuit drives plural speakers or output transducers at respective ones of the frequencies, with at least a subset of the speakers or output transducers at or close to the barrier. The speakers or output transducers cooperate with the passive sound absorber to reduce noise across a wide frequency band as well as to effect an electrically switchable soft boundary.

Abstract: An optical module structure includes a substrate, an optical chip and an electrical chip that are fixedly coupled to the substrate. The optical module structure further includes an optical coupling structure fixedly coupled to the optical chip. A side of the optical chip that faces the substrate has a first reference plane, and at least one first alignment mark is provided on the first reference plane. The optical coupling structure has a second reference plane, and at least one second alignment mark is provided on the second reference plane. The first reference plane is aligned with the second reference plane, and the first alignment mark is aligned with the second alignment mark.

Abstract: An active sound barrier has at least one passive sound absorber at or near a boundary location. A microphone provides an output to a frequency division module, in which a plural of frequencies are filtered to provide outputs corresponding to frequency segments of the receiving transducer output at respective ones of the frequencies. An active driving circuit drives plural speakers or output transducers at respective ones of the frequencies, with at least a subset of the speakers or output transducers at or close to the barrier. The speakers or output transducers cooperate with the passive sound absorber to reduce noise across a wide frequency band as well as to effect an electrically switchable soft boundary.

Abstract: An electro-optic modulator includes an input waveguide, a beam splitter connected to the input waveguide, a modulation arm that is disposed on each branch of the beam splitter and modulates a signal. Each modulation arm is correspondingly disposed with a first layer electrode and a second layer electrode. The first layer electrode is a high-frequency traveling wave electrode and is configured to change carrier concentration in the modulation arm, the second layer electrode is a direct current electrode having an inductor function, and an inductor formed in the second layer electrode is connected to the first layer electrode. The electro-optic modulator has functions of a bias tee, so that integration of the electro-optic modulator can be improved without affecting its performance. High-density packaging layout difficulty and cabling pressure can be effectively reduced, and cabling and packaging of a multi-channel high-speed signal on a base board can be implemented.

Abstract: Method for recycling electronic waste are included that enable electronic waste separation and recycling to a high level of separation efficiency and end product purity which are improvements over prior methods. In preferred methods, separated electronic waste which has been subjected to magnetic separation to remove ferrous materials and shredded to an average width of less than about 40 mm is provided and then introduced to a first water tank treated so as to have a specific gravity of about 1.20 to about 1.30 and allowing a first portion of the electronic waste to float in the first water tank and a second portion of the electronic waste to sink in the first water tank; and the second portion of the electronic waste is introduced to a water vibrating table, wherein the remaining second portion of the electronic waste leaving the water vibrating table yields at least about 98% sorted recovered materials comprising pure and clean copper, aluminum, wire, circuit boards, stainless steel and mixed plastics.

Abstract: The present disclosure provides a scanning probe, a method and an apparatus for manufacturing the scanning probe. The scanning probe includes a base and a micro-tip disposed on an end of the base, wherein at least a section of the micro-tip comprises a lateral surface with a concavely curved generatrix. In the method, an end of a probe precursor is immersed in a corrosive solution by having a length direction of the probe precursor inclined with a liquid surface of the corrosive solution. The probe precursor is corroded by the corrosive solution while a corrosion current of the corroding is monitored. The probe precursor is moved away from the corrosive solution after a magnitude of the corrosion current has a plunge. The apparatus includes a container containing the corrosive solution, and a driving device configured to move the probe precursor in the container through a fastener.

Abstract: The present disclosure provides a tip-enhanced Raman spectroscope system. The system includes a laser emitting unit, a laser excitation unit, a first dichroic beam splitter, a first Raman spectrometer, and a confocal detecting unit. The laser excitation unit includes a sample stage and a first scanning probe. The sample stage is configured to have a sample disposed thereon such that a first incident laser beam emitted from the laser emitting unit is transmitted to the sample to excite first scattered light. The first dichroic beam splitter is configured to split a first Raman scattered light from the first Rayleigh scattered light. The first Raman spectrometer is disposed on a first Raman optical path of the first Raman scattered light. The confocal detecting unit is disposed on a first Rayleigh optical path of the first Rayleigh scattered light to image the sample.

Abstract: An optical module structure includes a substrate, an optical chip and an electrical chip that are fixedly coupled to the substrate. The optical module structure further includes an optical coupling structure fixedly coupled to the optical chip. A side of the optical chip that faces the substrate has a first reference plane, and at least one first alignment mark is provided on the first reference plane. The optical coupling structure has a second reference plane, and at least one second alignment mark is provided on the second reference plane. The first reference plane is aligned with the second reference plane, and the first alignment mark is aligned with the second alignment mark.

Abstract: A method of detecting single molecule includes: providing a carrier, wherein the carrier includes a substrate, and a plurality of three-dimensional nanostructures are located on the substrate; disposing single molecule samples on the plurality of three-dimensional nanostructures; detecting the single molecule samples with a detector; wherein each three-dimensional nanostructure includes a first rectangular structure, a second rectangular structure, and a triangular prism structure; the first rectangular structure, the second rectangular structure, and the triangular prism structure are stacked in that order, a first width of a bottom surface of the triangular prism structure is equal to a second width of a first top surface of the second rectangular structure and greater than a third width of a second top surface of the first rectangular structure, and the first rectangular structure comprises a first metal and the triangular prism structure comprises a second metal.

Abstract: A method of making nanoscale devices, the method including: depositing a metal film on a surface of a first substrate; annealing the metal film to form a plurality of metal island structures on the surface of the first substrate; laying metal nanospheres on the surface of the first substrate; baking the first composite structure to make the metal nanospheres become a plurality of metal crystalline balls; forming a photoresist layer on the first surface of the second composite structure; placing a release agent layer on a second substrate, applying an external force to press the photoresist layer on the release agent layer under an inert atmosphere; heating the second composite structure, the photoresist layer, the release agent layer, and the second substrate are and applying voltages in three stages.

Abstract: A light emitting diode, the light emitting diode including: a first semiconductor layer, an active layer, a second semiconductor layer, wherein a surface of the second semiconductor layer defines a first area; a metallic plasma generating layer; a first electrode; a second electrode; wherein the metallic plasma generating layer includes a plurality of three-dimensional nanostructures, the three-dimensional nanostructure includes a first rectangular structure, a second rectangular structure, and a triangular prism structure, the first rectangular structure, the second rectangular structure, and the triangular prism structure are stacked, the width of the triangular prism structure is equal to the width of the second rectangular structure, and is greater than the width of the first rectangular structure, the first rectangular structure is a metal layer, and the triangular prism structure is a metal layer.

Abstract: An electro-optic modulator includes an input waveguide, a beam splitter connected to the input waveguide, a modulation arm that is disposed on each branch of the beam splitter and modulates a signal. Each modulation arm is correspondingly disposed with a first layer electrode and a second layer electrode. The first layer electrode is a high-frequency traveling wave electrode and is configured to change carrier concentration in the modulation arm, the second layer electrode is a direct current electrode having an inductor function, and an inductor formed in the second layer electrode is connected to the first layer electrode. The electro-optic modulator has functions of a bias tee, so that integration of the electro-optic modulator can be improved without affecting its performance. High-density packaging layout difficulty and cabling pressure can be effectively reduced, and cabling and packaging of a multi-channel high-speed signal on a base board can be implemented.

Abstract: A method of making a pine shaped metal nano-scaled grating, the method including: forming a first metal layer on a substrate, forming an isolation layer on the first metal layer, and locating a second metal layer on the isolation layer; placing a first mask layer on the second metal layer, wherein the first mask layer comprises a body, and the body defines a plurality of openings parallel with and spaced apart from each other; etching the first mask layer and the second metal layer to obtain a plurality of triangular prism structures; etching the isolation layer to obtain a plurality of second rectangular structures using the plurality of triangular prism structures as a first mask; and etching the first metal layer to obtain a plurality of first rectangular structures using the plurality of second rectangular structures as a second mask.

Abstract: A pine shaped metal nano-scaled grating, the grating including a substrate and a plurality of three-dimensional nanostructures located on the substrate, wherein each three-dimensional nanostructure comprises a first rectangular structure, a second rectangular structure, and a triangular prism structure; the first rectangular structure is located on the substrate, the second rectangular structure is located on the first rectangular structure, the triangular prism structure is located on the second rectangular structure, a first width of a bottom surface of the triangular prism structure is equal to a second width of a first top surface of the second rectangular structure and greater than a third width of a second top surface of the first rectangular structure, and the first rectangular structure comprises a first metal and the triangular prism structure comprises a second metal.

Abstract: A light emitting diode, the light emitting diode including: a first semiconductor layer, an active layer, a second semiconductor layer, wherein a surface of the second semiconductor layer defines a first area; a metallic plasma generating layer; a first electrode; a second electrode; wherein the metallic plasma generating layer includes a plurality of three-dimensional nanostructures, the three-dimensional nanostructure includes a first rectangular structure, a second rectangular structure, and a triangular prism structure, the first rectangular structure, the second rectangular structure, and the triangular prism structure are stacked, the width of the triangular prism structure is equal to the width of the second rectangular structure, and is greater than the width of the first rectangular structure, the first rectangular structure is a metal layer, and the triangular prism structure is a metal layer.

Abstract: A solar cell including: a silicon substrate; a back electrode; a doped silicon layer; an upper electrode, wherein the upper electrode includes a plurality of three-dimensional nanostructures extending along a same direction; an electrode lead, wherein a direction of the electrode lead intersects with the direction of the plurality of three-dimensional nanostructures; wherein the three-dimensional nanostructures includes a first rectangular structure, a second rectangular structure, and a triangular prism structure; the first rectangular structure, the second rectangular structure, and the triangular prism structure are stacked, a first width of a bottom surface of the triangular prism structure is equal to a second width of a top surface of the second rectangular structure, and is greater than a third width of a top surface of the first rectangular structure, materials of the first rectangular structure and the triangular prism structure are metal.

Abstract: A method of detecting single molecule includes: providing a carrier, wherein the carrier includes a substrate, and a plurality of three-dimensional nanostructures are located on the substrate; disposing single molecule samples on the plurality of three-dimensional nanostructures; detecting the single molecule samples with a detector; wherein each three-dimensional nanostructure includes a first rectangular structure, a second rectangular structure, and a triangular prism structure; the first rectangular structure, the second rectangular structure, and the triangular prism structure are stacked in that order, a first width of a bottom surface of the triangular prism structure is equal to a second width of a first top surface of the second rectangular structure and greater than a third width of a second top surface of the first rectangular structure, and the first rectangular structure comprises a first metal and the triangular prism structure comprises a second metal.

Abstract: A method of making a pine shaped metal nano-scaled grating, the method including: forming a first metal layer on a substrate, forming an isolation layer on the first metal layer, and locating a second metal layer on the isolation layer; placing a first mask layer on the second metal layer, wherein the first mask layer comprises a body, and the body defines a plurality of openings parallel with and spaced apart from each other; etching the first mask layer and the second metal layer to obtain a plurality of triangular prism structures; etching the isolation layer to obtain a plurality of second rectangular structures using the plurality of triangular prism structures as a first mask; and etching the first metal layer to obtain a plurality of first rectangular structures using the plurality of second rectangular structures as a second mask.

Abstract: A method of making nanoscale devices, the method including: depositing a metal film on a surface of a first substrate; annealing the metal film to form a plurality of metal island structures on the surface of the first substrate; laying metal nanospheres on the surface of the first substrate; baking the first composite structure to make the metal nanospheres become a plurality of metal crystalline balls; forming a photoresist layer on the first surface of the second composite structure; placing a release agent layer on a second substrate, applying an external force to press the photoresist layer on the release agent layer under an inert atmosphere; heating the second composite structure, the photoresist layer, the release agent layer, and the second substrate are and applying voltages in three stages.

Abstract: A pine shaped metal nano-scaled grating, the grating including a substrate and a plurality of three-dimensional nanostructures located on the substrate, wherein each three-dimensional nanostructure comprises a first rectangular structure, a second rectangular structure, and a triangular prism structure; the first rectangular structure is located on the substrate, the second rectangular structure is located on the first rectangular structure, the triangular prism structure is located on the second rectangular structure, a first width of a bottom surface of the triangular prism structure is equal to a second width of a first top surface of the second rectangular structure and greater than a third width of a second top surface of the first rectangular structure, and the first rectangular structure comprises a first metal and the triangular prism structure comprises a second metal.