Abstract: An electronic device for automated image-based auditing of equipment cabinets may include a memory storing an imaging computer program; and a computer processor. The imaging computer program, when executed by the computer processor, may cause the computer processor to perform the following: receive a plurality images from an image capture device on a carriage, wherein the image capture device is configured to traverse an equipment cabinet and capture the plurality of images of equipment in the equipment cabinet; generate a single image by stitching the plurality of images together; receive data from a sensor on the carriage, wherein the sensor is configured to capture data from the equipment in the equipment cabinet; associate the data with a location in the equipment cabinet; compare the single image and the data to an expected image and expected data; and output a result of the comparison.

Abstract: An electronic device for automated image-based auditing of equipment cabinets may include a memory storing an imaging computer program; and a computer processor. The imaging computer program, when executed by the computer processor, may cause the computer processor to perform the following: receive a plurality images from an image capture device on a carriage, wherein the image capture device is configured to traverse an equipment cabinet and capture the plurality of images of equipment in the equipment cabinet; generate a single image by stitching the plurality of images together; receive data from a sensor on the carriage, wherein the sensor is configured to capture data from the equipment in the equipment cabinet; associate the data with a location in the equipment cabinet; compare the single image and the data to an expected image and expected data; and output a result of the comparison.

Abstract: A semiconductor wafer is singulated to form a plurality of semiconductor packages. The semiconductor wafer has a semiconductor substrate, a metal layer, an adhesive layer, a rigid supporting layer, a passivation layer and a plurality of contact pads. A semiconductor package has a semiconductor substrate, a metal layer, an adhesive layer, a rigid supporting layer, a passivation layer and a plurality of contact pads. A thickness of the rigid supporting layer is larger than a thickness of the semiconductor substrate. A thickness of the metal layer is thinner than the thickness of the semiconductor substrate. An entirety of the rigid supporting layer may be made of a single crystal silicon material or a poly-crystal silicon material. The single crystal silicon material or the poly-crystal silicon material may be fabricated from a reclaimed silicon wafer. An advantage of using a reclaimed silicon wafer is for a cost reduction.

Abstract: A semiconductor wafer is singulated to form a plurality of semiconductor packages. The semiconductor wafer has a semiconductor substrate, a metal layer, an adhesive layer, a rigid supporting layer, a passivation layer and a plurality of contact pads. A semiconductor package has a semiconductor substrate, a metal layer, an adhesive layer, a rigid supporting layer, a passivation layer and a plurality of contact pads. A thickness of the rigid supporting layer is larger than a thickness of the semiconductor substrate. A thickness of the metal layer is thinner than the thickness of the semiconductor substrate. An entirety of the rigid supporting layer may be made of a single crystal silicon material or a poly-crystal silicon material. The single crystal silicon material or the poly-crystal silicon material may be fabricated from a reclaimed silicon wafer. An advantage of using a reclaimed silicon wafer is for a cost reduction.