Abstract: A chainsaw includes a chain, a liquid pump assembly, a motor, and a controller. The chain is used for implementing a cutting operation. The liquid pump assembly includes a liquid pump and a motor. The liquid pump is used for releasing a liquid for lubricating or cooling the chain. The motor is used for at least driving the liquid pump to operate. The controller is electrically connected to at least the motor. The controller is configured to, when the liquid pump is in the jammed state, control the liquid pump assembly to enter a throttling mode in which a supplied amount of the liquid is reduced, and when the liquid pump exits the jammed state, control the liquid pump assembly to exit the throttling mode. Technical solutions provided by the present application can determine and release the jammed state of the chainsaw.

Abstract: A distributed display method provides different parts of an application interface that are collaboratively displayed on a plurality of terminals, so that manners for collaborative display between the plurality of terminals are more flexible and richer. A first terminal displays a first interface including a first part and a second part. When the first terminal detects that a preset condition is met, the first terminal displays a second interface, where the second interface includes the first part and does not include the second part; and the first terminal notifies a second terminal to display a third interface, where the third interface includes the second part and does not include the first part.

Abstract: A calibration concentration selection method includes steps of: using a gas sensor array to obtain a concentration variation sequence and a response variation sequence of the gas mixture; constructing and training an AE-BP model; constructing VAE and identically distributing the response variation sequence; inputting the identically distributed response variation sequence into the trained AE-BP model to output a predicted concentration variation sequence; and then normalizing the predicted concentration variation sequence to generate a target concentration variation sequence; sorting a target concentration variation sequence and calculating a response gradient sequence; processing the response gradient sequence for obtaining a corresponding smoothed gradient sequence; if the spike is greater than a preset hyperparameter, finding a large gradient concentration interval; and selecting concentration test points by random uniform sampling according to weights; and selecting concentration test points from all othe

Abstract: A virulence factor FsPL gene from the sugarcane pokkah boeng disease and use thereof are provided. The virulence factor FsPL gene from the sugarcane pokkah boeng disease has a sequence set forth in SEQ ID NO: 1. The present invention reveals a gene FsPL that is related to the pathogenicity of F. sacchari. Preliminary analysis shows that the deletion of the gene affects the ability of hyphae to penetrate and further affects the pathogenicity of pathogens. This provides a basis for the molecular mechanism of the pathogen infection and pathogenic process.

Abstract: A light-emitting diode (LED) filament structure includes a substrate, an LED chip unit, a first chromic layer, and a light conversion layer. The LED chip unit is disposed on the substrate, and includes first and second LED chips emitting different excitation lights. The first chromic layer covers the first and second LED chips. The light conversion layer covers the LED chip unit and the first chromic layer. The first chromic layer is configured to transition between an inactivated state and an activated state to prevent or allow the excitation light from the first or second LED chips to pass therethrough, so as to excite the light conversion layer to emit different excited lights having different color temperatures.

Abstract: A tilger for a rotating body includes an annular body movably coupled to a rotatable portion of the rotating body. The tilger includes a spring interposed between the first annular body and the rotatable portion. Rotation of the rotatable portion relative to the annular body is to compress and decompress the spring. The tilger includes a ring positioned on an outer surface of the annular body and configured to expand as a rotational speed of the ring increases to decrease a total inertia of the annular body and the ring applied to the spring.

Abstract: A light-emitting diode (LED) device includes a base plate, an LED chip unit disposed on the base plate, and a light conversion layer disposed on and covering the LED chip unit. The LED chip unit includes a first chip and a second chip. The first chip emits a first excitation light having an emission peak wavelength ranging from 385 nm to 425 nm. The second chip emits a second excitation light having an emission peak wavelength greater than that of the first excitation light. The light conversion layer is configured to convert the first and second excitation lights to excited lights having different emission peak wavelengths, each of which ranges from 440 nm to 700 nm. A mixture of the excited lights is white light.

Abstract: A light-emitting diode (LED) packaging module includes light-emitting units arranged in an array having m row(s) and n column(s), an encapsulating layer, and a wiring assembly, where m and n each independently represents a positive integer. Each of the light-emitting units includes LED chips each including a chip first surface, a chip second surface, a chip side surface, and an electrode assembly disposed on the chip second surface. The encapsulating layer covers the chip side surface and fills a space among the LED chips. The wiring assembly is disposed on the chip second surface and is electrically connected to the electrode assembly.

Abstract: A light-emitting diode (LED) packaging module includes a plurality of LED chips spaced apart from one another, an encapsulating layer that fills in a space among the LED chips, a light-transmitting layer disposed on the encapsulating layer, a wiring assembly disposed on and electrically connected to the LED chips, and an insulation component that covers the encapsulating layer and the wiring assembly. Each of the LED chips includes an electrode assembly including first and second electrodes. The light-transmitting layer includes a light-transmitting layer that has a light transmittance greater than that of the encapsulating layer.

Abstract: A light-emitting device includes a number (N) of light-emitting units, a number (a) of first metal pads and a number (b) of second metal pads. Each of the light-emitting units includes a number (n) of light-emitting chips each having two distinct terminals, where N and n are integers and N>1, n>?3. The numbers (a) and (b) are integers and a>1, b>1, and the terminals of each of the light-emitting chips are electrically connected to a unique combination of one of the number (a) of first metal pads and a number (b) of second metal pads, respectively. The numbers (N), (n), (a) and (b) satisfy the equation: a*b=n*N.

Abstract: A light-emitting diode (LED) packaging module includes LED chips, a wiring layer, and an encapsulant component. Each of the LED chips includes a chip first surface, a chip second surface, a chip side surface, and an electrode unit. The wiring layer is disposed on the chip second surfaces of the LED chips, and contacts and is electrically connected to the electrode units. The encapsulant component includes a first encapsulating layer that covers the chip side surface, and a second encapsulating layer that covers the wiring layer. The LED chip has a thickness TA, the first encapsulating layer has a thickness TB, in which TB/TA?1.

Abstract: A tilger for a rotating body includes an annular body movably coupled to a rotatable portion of the rotating body. The tilger includes a spring interposed between the first annular body and the rotatable portion. Rotation of the rotatable portion relative to the annular body is to compress and decompress the spring. The tilger includes a ring positioned on an outer surface of the annular body and configured to expand as a rotational speed of the ring increases to decrease a total inertia of the annular body and the ring applied to the spring.

Abstract: A light emitting device includes an LED chip, a light-transmissible member and a light-reflecting member. The LED chip has a plurality of interconnecting side surfaces having a roughened structure and a plurality of corners. The light-transmissible member covers the side surfaces and the corners and includes a light-transmissible material layer having a breadth value W(A) of a viscosity coefficient (A) range of the light-transmissible material, which satisfies a relation of W(A)?B*D/C: where B represents a thickness of the light-transmissible material layer, represents a thickness of the LED chip measured from the first surface to the second surface, and D represents a roughness of the roughened structure. A method for manufacturing the light emitting device is also provided.

Abstract: A light-emitting diode (LED) filament structure includes a substrate, an LED chip unit, a first chromic layer, and a light conversion layer. The LED chip unit is disposed on the substrate, and includes first and second LED chips emitting different excitation lights. The first chromic layer covers the first and second LED chips. The light conversion layer covers the LED chip unit and the first chromic layer. The first chromic layer is configured to transition between an inactivated state and an activated state to prevent or allow the excitation light from the first or second LED chips to pass therethrough, so as to excite the light conversion layer to emit different excited lights having different color temperatures.

Abstract: A light-emitting diode (LED) device includes a base plate, an LED chip unit disposed on the base plate, and a light conversion layer disposed on and covering the LED chip unit. The LED chip unit includes a first chip and a second chip. The first chip emits a first excitation light having an emission peak wavelength ranging from 385 nm to 425 nm. The second chip emits a second excitation light having an emission peak wavelength greater than that of the first excitation light. The light conversion layer is configured to convert the first and second excitation lights to excited lights having different emission peak wavelengths, each of which ranges from 440 nm to 700 nm. A mixture of the excited lights is white light.

Abstract: A light-emitting diode (LED) package includes a substrate with upper and lower surfaces, including: a metal block; an electrically insulating region surrounding at least a portion of the metal block; an LED chip mounted on the substrate and in electrical communication with the metal block; and an encapsulant covering at least an upper surface of the LED chip. A light-emitting system includes a plurality of light-emitting diode (LED) chips; and a package support for the plurality of LED chips.

Abstract: A light emitting device includes an LED chip, a light-transmissible member and a light-reflecting member. The LED chip has a plurality of interconnecting side surfaces having a roughened structure and a plurality of corners. The light-transmissible member covers the side surfaces and the corners and includes a light-transmissible material layer having a breadth value W(A) of a viscosity coefficient (A) range of the light-transmissible material, which satisfies a relation of W(A)?B*D/C: where B represents a thickness of the light-transmissible material layer, represents a thickness of the LED chip measured from the first surface to the second surface, and D represents a roughness of the roughened structure. A method for manufacturing the light emitting device is also provided.

Abstract: A light-emitting diode (LED) package includes a substrate with upper and lower surfaces, including: a metal block; an electrically insulating region surrounding at least a portion of the metal block; an LED chip mounted on the substrate and in electrical communication with the metal block; and an encapsulant covering at least an upper surface of the LED chip. A light-emitting system includes a plurality of light-emitting diode (LED) chips; and a package support for the plurality of LED chips.

Abstract: A light-emitting diode (LED) package, including: a substrate with front and back surfaces, including: at least two metal blocks; an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and an electrical insulation region between the at least two metal blocks; an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate; wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate.

Abstract: A light-emitting diode (LED) package, including: a substrate with front and back surfaces, including: at least two metal blocks; an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and an electrical insulation region between the at least two metal blocks; an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate; wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate.