Patents by Inventor ZHEN-DUAN LIN

ZHEN-DUAN LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210005791
    Abstract: A light-emitting diode (LED) filament structure includes a substrate, an LED chip unit, a first chromic layer, and a light conversion layer. The LED chip unit is disposed on the substrate, and includes first and second LED chips emitting different excitation lights. The first chromic layer covers the first and second LED chips. The light conversion layer covers the LED chip unit and the first chromic layer. The first chromic layer is configured to transition between an inactivated state and an activated state to prevent or allow the excitation light from the first or second LED chips to pass therethrough, so as to excite the light conversion layer to emit different excited lights having different color temperatures.
    Type: Application
    Filed: September 18, 2020
    Publication date: January 7, 2021
    Inventors: JUNPENG SHI, ZHEN-DUAN LIN, CHEN-KE HSU, PING ZHANG
  • Publication number: 20200303358
    Abstract: A light-emitting diode (LED) device includes a base plate, an LED chip unit disposed on the base plate, and a light conversion layer disposed on and covering the LED chip unit. The LED chip unit includes a first chip and a second chip. The first chip emits a first excitation light having an emission peak wavelength ranging from 385 nm to 425 nm. The second chip emits a second excitation light having an emission peak wavelength greater than that of the first excitation light. The light conversion layer is configured to convert the first and second excitation lights to excited lights having different emission peak wavelengths, each of which ranges from 440 nm to 700 nm. A mixture of the excited lights is white light.
    Type: Application
    Filed: June 11, 2020
    Publication date: September 24, 2020
    Inventors: Ping ZHANG, Junpeng SHI, Senpeng HUANG, Zhen-Duan LIN, Shunyi CHEN, Chen-ke HSU
  • Patent number: 10510938
    Abstract: A light-emitting diode (LED) package includes a substrate with upper and lower surfaces, including: a metal block; an electrically insulating region surrounding at least a portion of the metal block; an LED chip mounted on the substrate and in electrical communication with the metal block; and an encapsulant covering at least an upper surface of the LED chip. A light-emitting system includes a plurality of light-emitting diode (LED) chips; and a package support for the plurality of LED chips.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: December 17, 2019
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Jun-Peng Shi, Pei-Song Cai, Hao Huang, Xing-Hua Liang, Zhen-Duan Lin, Chih-Wei Chao, Chen-Ke Hsu
  • Publication number: 20190319169
    Abstract: A light emitting device includes an LED chip, a light-transmissible member and a light-reflecting member. The LED chip has a plurality of interconnecting side surfaces having a roughened structure and a plurality of corners. The light-transmissible member covers the side surfaces and the corners and includes a light-transmissible material layer having a breadth value W(A) of a viscosity coefficient (A) range of the light-transmissible material, which satisfies a relation of W(A)?B*D/C: where B represents a thickness of the light-transmissible material layer, represents a thickness of the LED chip measured from the first surface to the second surface, and D represents a roughness of the roughened structure. A method for manufacturing the light emitting device is also provided.
    Type: Application
    Filed: June 26, 2019
    Publication date: October 17, 2019
    Inventors: Senpeng HUANG, Zhen-duan LIN, Weng-Tack WONG, Junpeng SHI, Shunyi CHEN, Chih-Wei CHAO, Chen-ke HSU
  • Publication number: 20170279023
    Abstract: A light-emitting diode (LED) package includes a substrate with upper and lower surfaces, including: a metal block; an electrically insulating region surrounding at least a portion of the metal block; an LED chip mounted on the substrate and in electrical communication with the metal block; and an encapsulant covering at least an upper surface of the LED chip. A light-emitting system includes a plurality of light-emitting diode (LED) chips; and a package support for the plurality of LED chips.
    Type: Application
    Filed: June 13, 2017
    Publication date: September 28, 2017
    Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: JUN-PENG SHI, PEI-SONG CAI, HAO HUANG, XING-HUA LIANG, ZHEN-DUAN LIN, CHIH-WEI CHAO, CHEN-KE HSU
  • Patent number: 9711704
    Abstract: A light-emitting diode (LED) package, including: a substrate with front and back surfaces, including: at least two metal blocks; an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and an electrical insulation region between the at least two metal blocks; an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate; wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate.
    Type: Grant
    Filed: August 9, 2016
    Date of Patent: July 18, 2017
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Jun-Peng Shi, Pei-Song Cai, Hao Huang, Xing-Hua Liang, Zhen-Duan Lin, Chih-Wei Chao, Chen-Ke Hsu
  • Publication number: 20160351770
    Abstract: A light-emitting diode (LED) package, including: a substrate with front and back surfaces, including: at least two metal blocks; an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and an electrical insulation region between the at least two metal blocks; an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate; wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate.
    Type: Application
    Filed: August 9, 2016
    Publication date: December 1, 2016
    Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Jun-Peng SHI, Pei-Song CAI, Hao HUANG, Xing-Hua LIANG, Zhen-Duan LIN, Chih-Wei CHAO, Chen-Ke HSU
  • Patent number: 9437793
    Abstract: A package support including: metal frames connected together; one or more dielectric materials disposed in an inner gap of the metal frames; wherein: the package support has a frame region and a function region; wherein the function region has complete upper and lower surfaces configured to prevent leakage if at least one of the entire upper or lower surfaces is covered with an encapsulant material. A fabrication method allows for manufacturing the package support with a high cell density, relatively low price, high reflectivity, good heat dissipation, and high reliability. The LED package using the package support has a smaller size and improved dissipation properties.
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: September 6, 2016
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Jun-Peng Shi, Pei-Song Cai, Hao Huang, Xing-Hua Liang, Zhen-Duan Lin, Chih-Wei Chao, Chen-Ke Hsu
  • Publication number: 20150243863
    Abstract: A package support including: metal frames connected together; one or more dielectric materials disposed in an inner gap of the metal frames; wherein: the package support has a frame region and a function region; wherein the function region has complete upper and lower surfaces configured to prevent leakage if at least one of the entire upper or lower surfaces is covered with an encapsulant material. A fabrication method allows for manufacturing the package support with a high cell density, relatively low price, high reflectivity, good heat dissipation, and high reliability. The LED package using the package support has a smaller size and improved dissipation properties.
    Type: Application
    Filed: January 27, 2015
    Publication date: August 27, 2015
    Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: JUN-PENG SHI, PEI-SONG CAI, HAO HUANG, XING-HUA LIANG, ZHEN-DUAN LIN, CHIH-WEI CHAO, CHEN-KE HSU